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UPSD3334DV-40U6

STMicroelectronics

UPSD3334DV-40U6 by STMicroelectronics

UPSD3334DV-40U6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 40 MHz. It features 262,144 ROM words and 8,192 RAM bytes, making it ideal for industrial applications requiring robust performance. Its compact design includes a low-profile flatpack package suitable for space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,202 parts In-Stock

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Anansix

USA . 237 parts In-Stock

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237

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Digiode

USA . 234 parts In-Stock

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Prism Electronics

USA . 12 parts In-Stock

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Ashlea Components Ltd

UK . 10 parts In-Stock

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Speed Components Ltd

Israel . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 271 parts In-Stock

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$12.140

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271

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Microchip USA

USA . 306 parts In-Stock

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$29.696

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IDEA Electronic Components Group

UK . 377 parts In-Stock

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$50.263

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$45.237

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MKK Technologies

India . 557 parts In-Stock

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$94.517

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DigiPath Technology Company

USA . 557 parts In-Stock

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$94.517

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557

$94.517

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A-Z Elektronik GmbH

Germany . 7,392 parts In-Stock

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Vigor

Singapore . 3,103 parts In-Stock

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Corphita

USA . 2,958 parts In-Stock

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Parana Technologies

USA . 1,775 parts In-Stock

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$60.097

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Authorized Procurement Solutions

USA . 600 parts In-Stock

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600

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Perfect Parts

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Overview

Unlock the potential of your next project with the UPSD3334DV-40U6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for reliability and efficiency, this robust 8-bit MCU excels in industrial applications, delivering exceptional performance even in harsh environments. Its compact form factor and versatile features empower engineers to create cutting-edge designs that elevate functionality while reducing time-to-market. Experience unparalleled value and superior support from a trusted manufacturer, ensuring your projects thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and resistance to environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact PCB design and is ideal for high-density applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can operate efficiently within common voltage levels found in many low-power applications.

Address Bus Width: 12

A 12-bit address bus width allows for addressing a larger memory space, which is beneficial for complex applications.

Package Shape: SQUARE

The square package shape contributes to simplicity in layout design and facilitates efficient placement on PCB.

Bit Size: 8

An 8-bit architecture is well-suited for a variety of control applications, providing a balance between performance and resource usage.

Power Supplies (V): 3.3

Operating at 3.3V is common in modern electronic designs, ensuring compatibility with many other components.

No. of Terminals: 80

With 80 terminals, this microcontroller provides ample connectivity options for peripherals and I/O devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style allows for space-efficient designs while facilitating automatic assembly processes.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3V ensures that the microcontroller can operate effectively even in applications with varying power supplies.

Maximum Operating Temperature: 85 °C

The ability to operate at up to 85 °C makes it suitable for industrial applications where higher temperatures may be encountered.

CPU Family: 8051

Based on the popular 8051 architecture, this microcontroller benefits from extensive support and established development tools.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, the microcontroller is ideal for harsh environments and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin terminals provide good solderability and resist corrosion, ensuring reliable electrical connections.

ADC Channels: YES

The presence of ADC channels allows for direct interfacing with analog signals, enhancing the microcontroller's versatility in various applications.

Terminal Position: QUAD

Quad terminal positioning offers efficient use of PCB space and simplifies routing in multi-layer designs.

ROM Words: 262144

A ROM capacity of 262144 words provides sufficient memory for program storage in complex applications.

Maximum Seated Height: 1.6 mm

The low seated height is beneficial for space-constrained applications, allowing for a compact design.

Width: 12 mm

The 12 mm width is standard and convenient for compatibility with a wide range of PCBs.

External Data Bus Width: 8

An 8-bit external data bus width enables integration with many other 8-bit systems, promoting design flexibility.

Maximum Clock Frequency: 40 MHz

With a maximum clock frequency of 40 MHz, this microcontroller delivers good performance for various computational tasks.

Length: 12 mm

The 12 mm length matches the width, supporting efficient and standard board layouts.

Temperature Grade: INDUSTRIAL

Rated for industrial grade, this microcontroller is designed for reliability in rigorous operational conditions.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, it can effectively manage various peripherals, enhancing its utility in complex systems.

RAM Bytes: 8192

With 8192 bytes of RAM, it provides ample storage for variables and data during program execution.

Technology: CMOS

CMOS technology results in lower power consumption and higher integration, making it suitable for battery-operated applications.

Terminal Form: GULL WING

Gull wing terminals are favored for automated assembly processes, enhancing manufacturing efficiency.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V makes it compatible with many modern digital circuits.

PWM Channels: YES

The availability of PWM channels allows for precise control over devices, such as motors or LEDs, which is essential in various applications.

ROM Programmability: FLASH

FLASH ROM programmability allows for easy updates and reprogramming of the microcontroller, which is beneficial for development and testing.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch facilitates high-density PCB layouts while maintaining ease of soldering.

Speed: 40 rpm

Though not typical for microcontrollers, this indicates potential compatibility with low-speed applications where precision control is needed.

No. of I/O Lines: 46

With 46 I/O lines, this microcontroller supports a wide range of connectivity options for interfacing with various external devices.

Technical Specifications

Microcontrollers UPSD3334DV-40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

12

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

46

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3334DV-40U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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