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UPSD3334D-40U6

STMicroelectronics

UPSD3334D-40U6 by STMicroelectronics

UPSD3334D-40U6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates at up to 40 MHz. It features 262,144 ROM words and supports ADC/PWM channels, making it ideal for industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,525 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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5,525

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Digiode

USA . 3,672 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,672

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Anansix

USA . 1,000 parts In-Stock

1+ parts

-

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1,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 72 parts In-Stock

1+ parts

$20.870

100+ parts

-

1k+ parts

-

10k+ parts

-

72

$20.870

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-

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IDEA Electronic Components Group

UK . 1,280 parts In-Stock

1+ parts

$63.825

100+ parts

-

1k+ parts

$57.442

10k+ parts

-

1,280

$63.825

-

$57.442

-

MKK Technologies

India . 302 parts In-Stock

1+ parts

$120.019

100+ parts

-

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302

$120.019

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DigiPath Technology Company

USA . 302 parts In-Stock

1+ parts

$120.019

100+ parts

-

1k+ parts

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302

$120.019

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-

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Corphita

USA . 3,879 parts In-Stock

1+ parts

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100+ parts

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3,879

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Vigor

Singapore . 2,211 parts In-Stock

1+ parts

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2,211

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Parana Technologies

USA . 1,014 parts In-Stock

1+ parts

-

100+ parts

$76.312

1k+ parts

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1,014

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$76.312

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Microchip USA

USA . 457 parts In-Stock

1+ parts

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457

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Overview

Unlock the future of innovation with the UPSD3334D-40U6 microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. Designed for versatility and efficiency, this 8-bit powerhouse excels in industrial applications, ensuring reliable performance even in extreme temperatures. With robust features and a compact design, it empowers engineers to create cutting-edge devices that deliver unmatched value, enhancing your project’s success and longevity. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern PCBs, enhancing the product's versatility in projects.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V offers flexibility for integration with various power sources, ensuring compatibility with a range of systems.

Address Bus Width: 12

A 12-bit address bus width allows access to a larger memory space, thereby facilitating more complex applications and functionality.

Package Shape: SQUARE

The square package shape simplifies PCB layout and design, ensuring easier manual assembly and automated handling.

Bit Size: 8

An 8-bit architecture is sufficient for a wide range of applications, making this microcontroller ideal for simpler, cost-effective projects.

Power Supplies (V): 3.3, 5

Support for both 3.3V and 5V power supplies increases compatibility with various components, making it adaptable to multiple projects.

No. of Terminals: 80

With 80 terminals, this microcontroller offers ample I/O options for complex applications, allowing multiple peripherals to be connected easily.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack low profile design reduces height on PCBs, promoting more efficient use of space, especially in compact electronics.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage ensures reliable operation even with slightly lower voltages, providing stability in various environmental conditions.

Maximum Operating Temperature: 85 °C

Operating at up to 85 °C makes this microcontroller suitable for industrial applications and environments with higher temperature ranges.

CPU Family: 8051

The renowned 8051 CPU family is known for its robustness and wide community support, making implementation easier due to available resources.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller can operate reliably in extreme cold conditions.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances reliability and prevents corrosion, ensuring a longer lifespan in a variety of environments.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with analog sensors, greatly expanding its application potential.

Terminal Position: QUAD

Quad terminal positioning facilitates easier routing and connections on PCBs, enhancing design layout efficiency.

ROM Words: 262144

A ROM capacity of 262144 words allows for substantial program space, supporting sophisticated applications with large codebases.

Maximum Seated Height: 1.6 mm

The low seated height is an advantage in low-profile designs, making this microcontroller suitable for compact electronic devices.

Width: 12 mm

A moderate width ensures compatibility with various PCB layouts and housing, giving designers flexibility in product design.

External Data Bus Width: 8

An 8-bit external data bus width allows standard interaction with a range of peripherals and sensors, simplifying integration.

Maximum Clock Frequency: 40 MHz

The high clock frequency allows for rapid processing of instructions, enhancing performance for demanding applications.

Length: 12 mm

With a compact length of 12 mm, it fits seamlessly into space-constrained designs without compromising functionality.

Temperature Grade: INDUSTRIAL

Industrial temperature grade classification ensures reliability and performance in harsh operating conditions, ideal for industrial applications.

Peripheral IC Type: MICROCONTROLLER

As a popular peripheral type, it enables greater flexibility in designing embedded systems with multiple interfacing options.

RAM Bytes: 8192

With 8192 bytes of RAM, this microcontroller can handle moderate data processing needs, making it suitable for real-time applications.

Technology: CMOS

CMOS technology allows for lower power consumption combined with higher speeds, making it energy-efficient for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easier soldering and improves connectivity with a reliable mechanical bond for surface mount devices.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V ensures stability in common electronic applications, simplifying the design process.

PWM Channels: YES

Pulse Width Modulation channels allow for control of motor speeds and brightness of LEDs, offering versatility in embedded applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming, making it convenient for iterative development processes.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density designs, ideal for miniaturized devices and applications.

Speed: 40 rpm

Speed rating of 40 rpm is suitable for certain low-speed motion control applications, adding to the device's functional flexibility.

No. of I/O Lines: 46

Having 46 I/O lines enables connectivity with multiple devices and sensors, making it highly adaptable for various projects.

Technical Specifications

Microcontrollers UPSD3334D-40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

12

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3/e4

Length:

12 mm

No. of I/O Lines:

46

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3334D-40U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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