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UPSD3254BV-24U6

STMicroelectronics

UPSD3254BV-24U6 by STMicroelectronics

UPSD3254BV-24U6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at temperatures from -40 °C to 85 °C. It features 262144 ROM words, 32768 RAM bytes, and supports ADC/PWM channels. Ideal for industrial applications requiring compact design and reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 7,754 parts In-Stock

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Vyrian

USA . 6,736 parts In-Stock

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Anansix

USA . 1,496 parts In-Stock

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1,496

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Cyclops Electronics Ltd

UK . 423 parts In-Stock

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423

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Digiode

USA . 338 parts In-Stock

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338

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Sea View Technologies

USA . 116 parts In-Stock

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116

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Speed Components Ltd

Israel . 25 parts In-Stock

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25

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Atlantic Semiconductor

USA . 4 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 646 parts In-Stock

1+ parts

$15.880

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646

$15.880

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IDEA Electronic Components Group

UK . 1,705 parts In-Stock

1+ parts

$38.185

100+ parts

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$34.366

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1,705

$38.185

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$34.366

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MKK Technologies

India . 1,384 parts In-Stock

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$71.804

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1,384

$71.804

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DigiPath Technology Company

USA . 1,384 parts In-Stock

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$71.804

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1,384

$71.804

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A-Z Elektronik GmbH

Germany . 6,410 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,853 parts In-Stock

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Perfect Parts

USA . 4,928 parts In-Stock

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Corphita

USA . 4,478 parts In-Stock

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Microchip USA

USA . 2,835 parts In-Stock

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Kepictronics

USA . 2,480 parts In-Stock

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2,480

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Metaverse IC Inc.

Canada . 2,480 parts In-Stock

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2,480

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Vigor

Singapore . 1,737 parts In-Stock

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Parana Technologies

USA . 1,579 parts In-Stock

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$45.656

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$45.656

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RC Electronics

USA . 1,000 parts In-Stock

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Authorized Procurement Solutions

USA . 600 parts In-Stock

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600

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Overview

Unlock innovation with the UPSD3254BV-24U6 from STMicroelectronics, a leading name in microcontroller technology. This high-quality, versatile solution is designed for demanding applications, delivering exceptional performance within industrial environments. With its robust temperature range and low-power consumption, it empowers your projects while ensuring reliability. Elevate your designs with STMicroelectronics' commitment to excellence, providing unparalleled value and performance that you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, ensuring a robust design suitable for various environments.

Surface Mount: YES

Enables compact design and ease of integration into modern PCBs.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options, ensuring compatibility with a range of devices.

Package Shape: SQUARE

Optimizes space utilization on circuit boards, allowing for efficient layout designs.

Bit Size: 8

Suitable for simple control applications, making it ideal for embedded systems.

Power Supplies (V): 3.3

Supports low-power consumption, which is essential for battery-operated devices.

No. of Terminals: 80

Offers a high level of connectivity for various peripherals and interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Facilitates high-density mounting, which is crucial for modern electronic product designs.

Minimum Supply Voltage: 3 V

Allows operation with lower voltage supplies, enhancing design flexibility.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in higher temperature environments, suitable for industrial applications.

CPU Family: 8051

A well-established architecture with extensive support and examples available for developers.

Minimum Operating Temperature: -40 °C

Designed for extreme conditions, making it ideal for use in harsh environments.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and durability, ensuring the longevity of connections.

ADC Channels: YES

Capable of interfacing with analog sensors, expanding the range of applications.

Terminal Position: QUAD

Facilitates better routing on PCBs, aiding in design simplicity and effectiveness.

ROM Words: 262144

Offers significant program storage capacity for complex applications.

Maximum Seated Height: 1.6 mm

Low profile design makes it suitable for space-constrained applications.

Width: 12 mm

Compact dimensions enhance design flexibility, supporting smaller electronic devices.

Maximum Clock Frequency: 40 MHz

Provides sufficient processing speed for a wide range of applications without compromising power.

Length: 12 mm

Compact size allows for integration into small form-factor devices.

Temperature Grade: INDUSTRIAL

Reliable in various temperature ranges, suitable for industrial-grade applications.

Peripheral IC Type: MICROCONTROLLER

Versatile for a wide range of control and automation applications across industries.

RAM Bytes: 32768

Ample RAM for data storage, making it effective for complex processing tasks.

Technology: CMOS

Ensures low power consumption and high efficiency, ideal for battery-powered applications.

Terminal Form: GULL WING

Facilitates easy soldering and reliable connections on PCBs.

Nominal Supply Voltage: 3.3 V

Standard nominal voltage that enhances compatibility across various devices.

PWM Channels: YES

Enables precise control of motors and lights, enhancing functionality in applications.

ROM Programmability: FLASH

Allows for easy updates and changes to firmware, improving product lifecycle management.

Terminal Pitch: 0.5 mm

Facilitates modern PCB design practices and high-density layouts.

Speed: 40 rpm

Provides adequate functionality for motion control applications in various devices.

No. of I/O Lines: 45

Ample I/O capacity for interfacing with a variety of sensors and actuators.

Technical Specifications

Microcontrollers UPSD3254BV-24U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3/e4

Length:

12 mm

No. of I/O Lines:

45

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3254BV-24U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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