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UPSD3253B-40T6

STMicroelectronics

UPSD3253B-40T6 by STMicroelectronics

UPSD3253B-40T6 from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates at up to 40 MHz. It features 131072 ROM words, 32768 RAM bytes, and supports ADC/PWM channels. Ideal for industrial applications requiring robust performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,161 parts In-Stock

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Digiode

USA . 1,652 parts In-Stock

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Anansix

USA . 1,549 parts In-Stock

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1,549

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AZTECH Wire

Italy . 778 parts In-Stock

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$13.110

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778

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Microchip USA

USA . 397 parts In-Stock

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$30.170

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397

$30.170

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IDEA Electronic Components Group

UK . 1,207 parts In-Stock

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$52.595

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$47.335

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$52.595

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MKK Technologies

India . 937 parts In-Stock

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$98.901

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$98.901

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DigiPath Technology Company

USA . 937 parts In-Stock

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$98.901

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$98.901

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Component Stockers USA

USA . 506 parts In-Stock

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$99.990

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$99.990

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Vigor

Singapore . 9,310 parts In-Stock

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Parana Technologies

USA . 971 parts In-Stock

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$62.885

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Corphita

USA . 522 parts In-Stock

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Overview

Unlock the potential of your projects with the UPSD3253B-40T6 microcontroller from STMicroelectronics. Renowned for their precision and reliability, STMicroelectronics delivers a robust solution designed for versatility in industrial applications, consumer electronics, and automation. With low power consumption and high performance, this microcontroller empowers you to innovate while ensuring seamless integration into your designs. Experience enhanced efficiency and unmatched quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material enhances the microcontroller's robustness, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient assembly processes.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can operate safely within standard voltage limits, ensuring reliability.

Package Shape: SQUARE

The square shape of the package optimizes space on the PCB, allowing for efficient layout in design.

Bit Size: 8

An 8-bit architecture is suited for many general-purpose applications, providing a good balance of performance and complexity.

Power Supplies (V): 5

Operating at a standard 5V power supply makes it compatible with a wide range of systems and peripherals.

No. of Terminals: 52

A higher number of terminals allows for increased connectivity options, accommodating various inputs and outputs.

Package Style (Meter): FLATPACK

Flatpack style is excellent for space efficiency and reliable surface mounting.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures stable operation in applications with varying power conditions.

Maximum Operating Temperature: 85 °C

An operational temperature up to 85 °C makes it suitable for industrial environments.

CPU Family: 8051

Being part of the popular 8051 family provides a wealth of resources and support for development.

Minimum Operating Temperature: -40 °C

A wide temperature range (-40 °C to 85 °C) makes it ideal for harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finishes ensure better electrical connectivity and corrosion resistance.

ADC Channels: YES

Built-in ADC channels enhance versatility, enabling the microcontroller to process analog inputs.

Terminal Position: QUAD

Quad terminal position maximizes available space, enabling better design flexibility.

ROM Words: 131072

The substantial ROM capacity allows for complex programs and algorithms to be implemented.

Maximum Seated Height: 1.75 mm

A low seated height enhances compatibility with low-profile designs.

Width: 10 mm

A compact width enables space-efficient PCB layouts.

Maximum Clock Frequency: 40 MHz

A high clock frequency (40 MHz) allows for faster processing speeds and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

A tolerance of up to 30 seconds at peak reflow temperature ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

Ability to withstand up to 260 °C peak reflow temperature demonstrates robustness during manufacturing.

Length: 10 mm

A compact length contributes to overall space savings in electronic design.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability under demanding conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is well-suited for control applications in various devices.

RAM Bytes: 32768

A substantial amount of RAM enables the execution of more data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and excellent scalability.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve assembly precision.

Nominal Supply Voltage: 5 V

Stable operations at nominal 5V make it versatile for various applications.

PWM Channels: YES

Integrated PWM channels enable effective control of motor speeds and other tasks requiring signal modulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to firmware.

Terminal Pitch: 0.65 mm

A tight terminal pitch (0.65 mm) enables compact designs, reducing overall device size.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates the microcontroller is suitable for standard surface mount assembly processes.

Speed: 40 rpm

While unrelated directly to the microcontroller's capabilities, a speed of 40 rpm suggests it could effectively control devices like motors.

No. of I/O Lines: 37

37 I/O lines provide extensive interfacing capabilities with sensors, actuators, and other peripherals.

Technical Specifications

Microcontrollers UPSD3253B-40T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

37

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.75 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

UPSD3253B-40T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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