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UPSD3234BV-24U6T

STMicroelectronics

UPSD3234BV-24U6T by STMicroelectronics

UPSD3234BV-24U6T from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates in industrial temperatures (-40 °C to 85°C). It features 262,144 ROM words, 4 ADC channels, and supports I2C/UART connectivity. Ideal for low-power applications requiring robust performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,167 parts In-Stock

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8,167

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Digiode

USA . 3,774 parts In-Stock

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3,774

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Anansix

USA . 2,164 parts In-Stock

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2,164

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 355 parts In-Stock

1+ parts

$8.182

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-

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355

$8.182

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AZTECH Wire

Italy . 165 parts In-Stock

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$21.300

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165

$21.300

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IDEA Electronic Components Group

UK . 1,932 parts In-Stock

1+ parts

$66.280

100+ parts

-

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$59.652

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1,932

$66.280

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$59.652

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MKK Technologies

India . 1,313 parts In-Stock

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$124.634

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1,313

$124.634

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DigiPath Technology Company

USA . 1,313 parts In-Stock

1+ parts

$124.634

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1,313

$124.634

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Corphita

USA . 4,877 parts In-Stock

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4,877

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Vigor

Singapore . 2,205 parts In-Stock

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2,205

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Parana Technologies

USA . 1,302 parts In-Stock

1+ parts

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$79.247

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1,302

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$79.247

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Overview

Unlock unparalleled performance with the UPSD3234BV-24U6T microcontroller from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics delivers a reliable and efficient solution perfect for industrial applications. With low power consumption and versatile connectivity options, this microcontroller ensures seamless integration and robust functionality. Experience enhanced control, superior processing capabilities, and peace of mind knowing you’re backed by a trusted leader in semiconductor innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mounting allows for compact design and space efficiency on PCBs, making integration into modern electronic devices easier.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with standard low-voltage systems, enhancing versatility.

Address Bus Width: 12

A 12-bit address bus allows for a larger addressing range, facilitating the use of more memory in applications.

Package Shape: SQUARE

The square package shape makes it easy to fit into various layouts and designs, simplifying the PCB design process.

Bit Size: 8

An 8-bit architecture is efficient for handling general control tasks, making it a cost-effective choice for simpler applications.

No. of Terminals: 80

With 80 terminals, this microcontroller offers ample connectivity options for peripherals and external devices, enhancing its functionality.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style is advantageous for tight spaces in electronic designs, allowing for slimmer devices.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V further expands its compatibility with a wide range of power sources, improving design flexibility.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C ensures reliability in industrial environments and harsh conditions.

CPU Family: 8051

The widely used 8051 CPU family allows for a wealth of resources and community support, facilitating easier development.

No. of External Interrupts: 2

With two external interrupts, this microcontroller can react to multiple external events, allowing for more dynamic applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures this microcontroller can operate in extreme conditions, suitable for industrial and automotive applications.

Terminal Finish: Matte Tin (Sn)

Matte tin finish enhances solderability and provides good resistance to oxidation, promoting long-term reliability.

ADC Channels: YES

The inclusion of ADC channels facilitates the conversion of analog signals to digital form, expanding its application scope.

Terminal Position: QUAD

Quad terminal positioning supports effective layout designs and aids in thermal management in multi-pin configurations.

ROM Words: 262144

A significant ROM capacity allows for complex programs and features, increasing the capability of embedded applications.

Maximum Seated Height: 1.6 mm

A low seated height helps streamline designs and is compatible with low-profile appliance requirements.

RAM Words: 4096

With 4096 words of RAM, this microcontroller can handle more complex tasks and data processing.

Width: 12 mm

A compact width of 12 mm allows for efficient use of space in various designs.

Boundary Scan: YES

Boundary scan support improves testing and debugging capabilities, making development and production easier.

External Data Bus Width: 8

An 8-bit external data bus allows for efficient data transfer and compatibility with a variety of peripherals.

Peripherals: POR; PWM(5); TIMER(3); WDT

The availability of multiple peripherals enhances functionality for a wide range of applications, from motor control to timing functions.

Length: 12 mm

A 12 mm length contributes to a compact form factor, essential for modern electronic designs.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures assures performance and reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is designed for embedded applications, making it versatile for various tasks.

Technology: CMOS

CMOS technology offers low power consumption, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals are easy to solder, enhancing assembly efficiency in production.

Analog To Digital Convertors: 4-Ch 8-Bit

The presence of 4-channel 8-bit ADCs expands functionality for interfacing with analog sensors.

Maximum Supply Current: 20 mA

A maximum supply current of 20 mA indicates low power consumption, ideal for energy-efficient designs.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V aligns with common power supply standards used in many digital circuits.

PWM Channels: YES

The presence of PWM channels enables precise control of motors and other devices, enhancing its application range.

Connectivity: I2C; UART(2)

Multiple connectivity options including I2C and UART provide flexibility for communication with various peripherals.

ROM Programmability: FLASH

FLASH programmability allows easy updates and modifications to programs, extending the product lifecycle.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch facilitates tight packing of components, crucial for space-constrained applications.

Format: FIXED POINT

Fixed point format enhances processing speed for arithmetic operations, beneficial for performance-intensive applications.

Speed: 24 rpm

Operating at 24 rpm is optimal for applications requiring moderate-speed processing and control.

Low Power Mode: YES

The low power mode feature ensures minimal energy consumption during idle times, enhancing efficiency in battery-powered applications.

On Chip Program ROM Width: 8

An 8-bit on-chip program ROM width allows for quick and efficient data access, improving performance.

No. of I/O Lines: 46

With 46 I/O lines, this microcontroller offers significant interfacing capability, making it suitable for complex control applications.

Technical Specifications

Microcontrollers UPSD3234BV-24U6T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 2ND FLASH MEMORY: 32K BYTES

Address Bus Width:

12

Bit Size:

8

Boundary Scan:

YES

CPU Family:

8051

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

2

No. of I/O Lines:

46

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Words:

4096

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Connectivity:

I2C; UART(2)

Peripherals:

POR; PWM(5); TIMER(3); WDT

Analog To Digital Convertors:

4-Ch 8-Bit

Trade Compliance

UPSD3234BV-24U6T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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