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UPSD3234A-40T6

STMicroelectronics

UPSD3234A-40T6 by STMicroelectronics

UPSD3234A-40T6 from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85°C. It features 52 terminals, 4 ADC channels, and supports I2C, UART, and USB connectivity for versatile applications. Ideal for industrial use, it combines low power modes with robust performance.

Median Price

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Lifecycle Status

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5

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1k+

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Vyrian

USA . 8,953 parts In-Stock

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Digiode

USA . 2,535 parts In-Stock

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Anansix

USA . 407 parts In-Stock

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Chip Stock

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Prism Electronics

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Microchip USA

USA . 186 parts In-Stock

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$10.230

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AZTECH Wire

Italy . 600 parts In-Stock

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$20.130

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IDEA Electronic Components Group

UK . 998 parts In-Stock

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$29.540

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$26.586

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998

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MKK Technologies

India . 2,371 parts In-Stock

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$55.549

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DigiPath Technology Company

USA . 2,371 parts In-Stock

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Component Stockers USA

USA . 715 parts In-Stock

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GreenTree Electronics

Israel . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,895 parts In-Stock

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Corphita

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Parana Technologies

USA . 1,447 parts In-Stock

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Vigor

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Authorized Procurement Solutions

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Kepictronics

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Overview

Discover the UPSD3234A-40T6 microcontroller by STMicroelectronics, where exceptional quality meets innovative design. Renowned for their reliability, STMicroelectronics delivers a powerhouse ideal for industrial applications, automotive systems, and IoT devices. With low power consumption and robust performance, this microcontroller enhances efficiency while ensuring seamless connectivity. Maximize your project's potential with a trusted partner that prioritizes cutting-edge technology and superior support!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material offers protection against environmental factors, enhancing the microcontroller's longevity.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic devices.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for various applications while ensuring reliability.

Package Shape: SQUARE

The square shape facilitates efficient space utilization on circuit boards.

Bit Size: 8

An 8-bit architecture is conducive for low power and low-cost applications, making it suitable for a variety of devices.

No. of Terminals: 52

A higher number of terminals allows for more I/O connections, enhancing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style is optimal for minimizing space while allowing for complex circuit designs.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V supports operation in lower voltage scenarios, ensuring versatility.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes this microcontroller suitable for industrial applications.

CPU Family: 8051

The widely-used 8051 family offers a rich ecosystem of development tools and libraries.

No. of External Interrupts: 2

Multiple external interrupts enhance the responsiveness of your application to real-time events.

Minimum Operating Temperature: -40 °C

Support for extreme low temperatures makes it reliable for challenging environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes enhance solderability and reduce oxidation, ensuring reliable connections.

ADC Channels: YES

Integrated ADC channels allow for analog signal processing, which is essential for sensor applications.

Terminal Position: QUAD

Quad terminal positioning provides stability and better connectivity on PCBs.

ROM Words: 262144

Sufficient ROM storage supports complex application code without the need for external memory.

Maximum Seated Height: 1.6 mm

Low-profile design contributes to compact device assembly, perfect for space-constrained applications.

RAM Words: 4096

Adequate RAM allows for efficient data handling, enabling more complex computations.

Width: 10 mm

A width of 10 mm is suitable for compact designs, fitting well into a variety of enclosures.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging embedded systems.

Peripherals: POR; PWM(5); TIMER(3); WDT

Integrated peripherals enhance functionality, allowing for diverse applications with minimal external components.

Maximum Time At Peak Reflow Temperature (s): 30

The design’s tolerance for peak reflow time ensures compatibility with various assembly processes.

Peak Reflow Temperature °C: 260

A high peak temperature rating enhances compatibility with modern soldering technologies.

Length: 10 mm

Compact length aids in efficient PCB design, making it easy to fit into small devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability in demanding operational environments.

Peripheral IC Type: MICROCONTROLLER

This device's classification as a microcontroller indicates versatile functionality tailored for control applications.

Technology: CMOS

CMOS technology contributes to low power consumption, making it efficient for battery-operated devices.

Terminal Form: GULL WING

Gull-wing terminals facilitate enhanced soldering, providing better mechanical stability.

Analog To Digital Convertors: 4-Ch 8-Bit

Four channels of 8-bit ADC enable simultaneous sampling of multiple analog signals.

Maximum Supply Current: 62 mA

A maximum supply current of 62 mA balances performance with energy efficiency.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with industry standards,making it versatile for various applications.

PWM Channels: YES

Support for PWM channels allows for efficient control of motors and lighting applications.

Connectivity: I2C; UART(2); USB

Multiple connectivity options ensure easy integration with other devices and systems.

ROM Programmability: FLASH

Flash programmability enables easy updates and reconfiguration of application firmware.

Terminal Pitch: 0.65 mm

A smaller terminal pitch allows for tighter placements, optimizing space in modern circuitry.

Format: FIXED POINT

Fixed-point format optimizes processing speed and resource usage for certain applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 ensures appropriate handling procedures, supporting reliability in moist environments.

Speed: 40 rpm

A speed rating of 40 rpm provides a good balance between performance and energy efficiency for applications requiring motion control.

Low Power Mode: YES

Low power mode capability enhances battery life for portable applications, making this microcontroller ideal for power-sensitive designs.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports a broad range of applications, optimizing performance for various tasks.

No. of I/O Lines: 37

Having 37 I/O lines allows for extensive interfacing with other components and peripherals for enhanced functionality.

Technical Specifications

Microcontrollers UPSD3234A-40T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 2ND FLASH MEMORY: 32K BYTES

Bit Size:

8

Boundary Scan:

YES

CPU Family:

8051

DAC Channels:

NO

DMA Channels:

NO

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

2

No. of I/O Lines:

37

No. of Terminals:

52

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Words:

4096

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Current:

62 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Connectivity:

I2C; UART(2); USB

Peripherals:

POR; PWM(5); TIMER(3); WDT

Analog To Digital Convertors:

4-Ch 8-Bit

Trade Compliance

UPSD3234A-40T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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