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UPSD3233BV-24U6

STMicroelectronics

UPSD3233BV-24U6 by STMicroelectronics

UPSD3233BV-24U6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates in industrial temperatures from -40 °C to 85°C. It features 131072 ROM words, 4096 RAM words, and supports I2C/UART connectivity. Ideal for low-power applications requiring robust performance and multiple peripherals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,787 parts In-Stock

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2,787

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Anansix

USA . 2,201 parts In-Stock

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2,201

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Digiode

USA . 1,395 parts In-Stock

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1,395

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Rebound Electronics

UK . 357 parts In-Stock

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357

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Distributors (Availability)

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Microchip USA

USA . 309 parts In-Stock

1+ parts

$13.331

100+ parts

-

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309

$13.331

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AZTECH Wire

Italy . 201 parts In-Stock

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$19.940

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-

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201

$19.940

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IDEA Electronic Components Group

UK . 389 parts In-Stock

1+ parts

$42.535

100+ parts

-

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$38.282

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389

$42.535

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$38.282

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MKK Technologies

India . 1,510 parts In-Stock

1+ parts

$79.985

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1,510

$79.985

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DigiPath Technology Company

USA . 1,510 parts In-Stock

1+ parts

$79.985

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1,510

$79.985

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Corphita

USA . 1,302 parts In-Stock

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1,302

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Perfect Parts

USA . 560 parts In-Stock

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560

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Parana Technologies

USA . 379 parts In-Stock

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$50.857

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379

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$50.857

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Kepictronics

USA . 102 parts In-Stock

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102

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Overview

Unlock unparalleled performance with the UPSD3233BV-24U6 from STMicroelectronics, a leader in innovative microcontroller solutions. Designed for demanding applications, this low-profile device offers exceptional power efficiency and robustness, making it ideal for industrial automation, consumer electronics, and IoT devices. Enjoy seamless integration, superior connectivity, and reliable operation across harsh environments, ensuring your projects thrive with uncompromised quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology enables compact designs and easier integration into modern electronic devices.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V is optimal for low-power applications, ensuring energy efficiency.

Address Bus Width: 12

A 12-bit address bus enables a larger memory space, allowing for more complex applications.

Package Shape: SQUARE

The square package shape aids in efficient layout design and ease of mounting on PCBs.

Bit Size: 8

An 8-bit architecture is suitable for various controllers, balancing performance and efficiency.

No. of Terminals: 80

Having 80 terminals allows for extensive connectivity options, providing flexibility in design.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design facilitates space-saving installations in compact devices.

Minimum Supply Voltage: 3 V

A low minimum supply voltage of 3 V increases compatibility with a wider range of power sources.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in various industrial environments.

CPU Family: 8051

The 8051 CPU family is well-established, with extensive support and development resources available.

No. of External Interrupts: 2

Having 2 external interrupts allows for responsive and real-time control in applications.

Minimum Operating Temperature: -40 °C

This wide temperature range enhances the product’s suitability for harsh environmental conditions.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

The terminal finish ensures excellent conductivity and resistance to corrosion, improving reliability.

ADC Channels: YES

The presence of ADC channels provides the ability to process analog signals, enabling more complex functions.

Terminal Position: QUAD

Quad terminal position allows for better PCB layout efficiency and heat dissipation.

ROM Words: 131072

A sizable ROM allows for more complex programs and functionalities within the microcontroller.

Maximum Seated Height: 1.6 mm

A low seated height facilitates compact designs, enabling integration into smaller devices.

RAM Words: 4096

With 4096 words of RAM, the microcontroller can handle more data and run sophisticated applications.

Width: 12 mm

A compact width allows for versatile placement in various applications without compromising space.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging, ensuring reliability in manufacturing.

External Data Bus Width: 8

An 8-bit data bus enhances compatibility with a range of external devices and peripherals.

Peripherals: POR; PWM(5); TIMER(3); WDT

Integrated peripherals like timers and PWM channels enhance control and functionality in applications.

Length: 12 mm

The compact length contributes to space-saving designs, allowing integration into small devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates reliability and performance in challenging environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller type, it’s optimized for control tasks, making it ideal for embedded systems.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics and easy handling during assembly.

Analog To Digital Converters: 4-Ch 8-Bit

Four 8-bit ADC channels offer sufficient resolution for many sensor applications.

Maximum Supply Current: 20 mA

A maximum supply current of 20 mA ensures low power operation, contributing to energy efficiency.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is standard in many modern electronics, enhancing compatibility.

PWM Channels: YES

PWM channels enable advanced control of motors and other devices, enhancing application versatility.

Connectivity: I2C; UART(2)

Multiple connectivity options provide flexibility in interfacing with other devices and systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming, extending the product’s usability.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm supports high-density designs, accommodating smaller PCBs.

Format: FIXED POINT

Fixed point data format can simplify calculations in control applications, making processing faster.

Speed: 24 rpm

A speed of 24 rpm provides adequate performance for control applications requiring moderate motion.

Low Power Mode: YES

The ability to operate in low power mode makes it an excellent choice for battery-operated applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for effective execution of control algorithms.

No. of I/O Lines: 46

With 46 I/O lines, the microcontroller can interface with many external components, enhancing its versatility.

Technical Specifications

Microcontrollers UPSD3233BV-24U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 2ND FLASH MEMORY: 32K BYTES

Address Bus Width:

12

Bit Size:

8

Boundary Scan:

YES

CPU Family:

8051

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3/e4

Length:

12 mm

Low Power Mode:

YES

No. of External Interrupts:

2

No. of I/O Lines:

46

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Words:

4096

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Connectivity:

I2C; UART(2)

Peripherals:

POR; PWM(5); TIMER(3); WDT

Analog To Digital Convertors:

4-Ch 8-Bit

Trade Compliance

UPSD3233BV-24U6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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