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UPSD3233BV-24T6T

STMicroelectronics

UPSD3233BV-24T6T by STMicroelectronics

UPSD3233BV-24T6T by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates in -40 °C to 85°C. It features 131072 ROM words, 4096 RAM words, and supports I2C/UART connectivity. Ideal for industrial applications requiring low power and multiple peripherals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 12,798 parts In-Stock

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12,798

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Digiode

USA . 2,263 parts In-Stock

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2,263

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Anansix

USA . 1,100 parts In-Stock

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1,100

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Distributors (Availability)

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AZTECH Wire

Italy . 455 parts In-Stock

1+ parts

$19.480

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-

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455

$19.480

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IDEA Electronic Components Group

UK . 1,880 parts In-Stock

1+ parts

$57.663

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-

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$51.897

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1,880

$57.663

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$51.897

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MKK Technologies

India . 1,695 parts In-Stock

1+ parts

$108.431

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1,695

$108.431

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DigiPath Technology Company

USA . 1,695 parts In-Stock

1+ parts

$108.431

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1,695

$108.431

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Vigor

Singapore . 7,500 parts In-Stock

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7,500

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Microchip USA

USA . 5,351 parts In-Stock

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5,351

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Parana Technologies

USA . 1,297 parts In-Stock

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$68.945

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1,297

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$68.945

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Corphita

USA . 929 parts In-Stock

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929

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Overview

Elevate your projects with the UPSD3233BV-24T6T microcontroller from STMicroelectronics, renowned for their commitment to quality and innovation. This versatile 8-bit MCU is ideal for diverse applications, offering exceptional performance in a compact, low-profile package. With low power consumption and robust features like multiple ADC channels and flexible connectivity, it empowers creators to build efficient and reliable solutions, ensuring long-lasting value and superior results in any industrial setting.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material enhances the longevity and reliability of the microcontroller in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier automation in the assembly process.

Maximum Supply Voltage: 3.6 V

The low maximum supply voltage makes this microcontroller suitable for battery-powered applications, prolonging battery life.

Package Shape: SQUARE

Square package shape provides efficient use of PCB space and simplifies layout design.

Bit Size: 8

An 8-bit architecture is often sufficient for simple control tasks, making it cost-effective and easier to program.

No. of Terminals: 52

With 52 terminals, this microcontroller offers ample connectivity options for a variety of peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style facilitates high-density mounting and reduces the overall height of the mounted device.

Minimum Supply Voltage: 3 V

The broader voltage range allows it to operate in a variety of environments and applications.

Maximum Operating Temperature: 85 °C

This temperature rating makes it suitable for use in industrial environments where heat is a factor.

CPU Family: 8051

The 8051 CPU family is well-established, which means extensive support and resources are available for development.

No. of External Interrupts: 2

Having two external interrupts enhances responsiveness to external events, useful for real-time applications.

Minimum Operating Temperature: -40 °C

This wide temperature range enables operation in extreme environments, making it ideal for industrial applications.

ADC Channels: YES

Integrated ADC channels simplify design by allowing direct reading of analog signals.

Terminal Position: QUAD

Quad terminal positioning allows for easier routing and reduces board space.

ROM Words: 131072

A large ROM capacity supports complex applications and more extensive firmware.

Maximum Seated Height: 1.6 mm

This low profile height allows for compact designs and better thermal management.

RAM Words: 4096

A decent amount of RAM ensures smooth operation for applications requiring temporary data storage.

Width: 10 mm

A narrow width enables space-efficient designs, which is crucial in compact electronic applications.

Boundary Scan: YES

Boundary scan capabilities facilitate easier testing and debugging of PCBs, improving design reliability.

Peripherals: POR; PWM(5); TIMER(3); WDT

The availability of various peripherals enhances functionality and allows for diverse application implementations.

Length: 10 mm

A compact length allows for more flexible PCB layout options, optimizing space usage.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability in challenging environments.

Peripheral IC Type: MICROCONTROLLER

A specialized microcontroller IC type allows for focused applications in embedded systems.

Technology: CMOS

CMOS technology offers low power consumption, enhancing battery-operated and energy-efficient applications.

Terminal Form: GULL WING

Gull wing terminals ensure good mechanical strength and ease of soldering.

Analog To Digital Converters: 4-Ch 8-Bit

The combination of multiple ADC channels simplifies the interface with analog sensors.

Maximum Supply Current: 20 mA

Low supply current requirements help conserve energy in portable applications.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage is compatible with many devices, enhancing versatility.

PWM Channels: YES

PWM capability allows for precise control of motors and other actuators.

Connectivity: I2C; UART(2)

Diverse connectivity options make it easy to interface with multiple types of peripherals.

ROM Programmability: FLASH

Flash programmability enables updates and modifications to firmware without requiring hardware changes.

Terminal Pitch: 0.65 mm

A smaller terminal pitch allows for finer soldering, suitable for densely packed circuits.

Format: FIXED POINT

Fixed point format is efficient for many embedded applications, simplifying computation.

Speed: 24 rpm

The speed rating indicates capability for efficient processing in various tasks and applications.

Low Power Mode: YES

Low power mode capability extends battery life in portable devices, making it energy-efficient.

On Chip Program ROM Width: 8

Having an 8-bit program ROM width aligns with the device’s architecture, optimizing performance.

No. of I/O Lines: 37

With 37 I/O lines, versatility in interfacing with various components is greatly enhanced.

Technical Specifications

Microcontrollers UPSD3233BV-24T6T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 2ND FLASH MEMORY: 32K BYTES

Bit Size:

8

Boundary Scan:

YES

CPU Family:

8051

DAC Channels:

NO

DMA Channels:

NO

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G52

Length:

10 mm

Low Power Mode:

YES

No. of External Interrupts:

2

No. of I/O Lines:

37

No. of Terminals:

52

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

RAM Words:

4096

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Connectivity:

I2C; UART(2)

Peripherals:

POR; PWM(5); TIMER(3); WDT

Analog To Digital Convertors:

4-Ch 8-Bit

Trade Compliance

UPSD3233BV-24T6T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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