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UPSD3233BV-24T6

STMicroelectronics

UPSD3233BV-24T6 by STMicroelectronics

UPSD3233BV-24T6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates in industrial temperatures from -40 °C to 85°C. It features 131072 ROM words, 4096 RAM words, and supports I2C/UART connectivity. Ideal for low-power applications requiring efficient processing and multiple peripherals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,947 parts In-Stock

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Anansix

USA . 1,683 parts In-Stock

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Digiode

USA . 605 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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AZTECH Wire

Italy . 662 parts In-Stock

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$19.780

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662

$19.780

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IDEA Electronic Components Group

UK . 1,457 parts In-Stock

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$25.891

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$23.302

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MKK Technologies

India . 1,999 parts In-Stock

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$48.686

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$48.686

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DigiPath Technology Company

USA . 1,999 parts In-Stock

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$48.686

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$48.686

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Component Stockers USA

USA . 344 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 5,327 parts In-Stock

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Vigor

Singapore . 5,288 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,796 parts In-Stock

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Corphita

USA . 4,091 parts In-Stock

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Microchip USA

USA . 3,169 parts In-Stock

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Parana Technologies

USA . 1,798 parts In-Stock

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Kepictronics

USA . 1,179 parts In-Stock

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Metaverse IC Inc.

Canada . 1,179 parts In-Stock

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Authorized Procurement Solutions

USA . 600 parts In-Stock

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600

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Perfect Parts

USA . 327 parts In-Stock

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327

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Overview

Elevate your designs with the UPSD3233BV-24T6 microcontroller from STMicroelectronics—where exceptional quality meets unparalleled innovation. This robust 8-bit solution features low power consumption and a versatile range of peripherals, perfect for industrial applications that demand reliability and efficiency. With STMicroelectronics' renowned expertise, you gain not just a product, but a partner committed to driving your success in every project. Experience the power of performance and precision today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing a plastic/epoxy body material ensures durability and resilience, making the microcontroller suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, making it ideal for modern electronic devices.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of power sources, enhancing flexibility in applications.

Package Shape: SQUARE

The square package shape facilitates easy placement and orientation on PCBs, simplifying the manufacturing process.

Bit Size: 8

With an 8-bit architecture, this microcontroller balances performance and resource usage, making it suitable for low-power applications.

No. of Terminals: 52

A high number of terminals offers extensive connectivity options for peripherals and interfaces, allowing for versatile applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style supports advanced space-saving designs in electronic devices, accommodating complex configurations.

Minimum Supply Voltage: 3 V

The capability to operate at a minimum supply voltage of 3 V enables low-power operation, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C supports use in industrial environments, ensuring reliability even under harsh conditions.

CPU Family: 8051

The 8051 CPU family is known for its compatibility and extensive support in development tools, making it a reliable choice for developers.

No. of External Interrupts: 2

Two external interrupts facilitate responsive and real-time processing, enhancing the microcontroller's efficiency in time-sensitive applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller ensures reliable operation in extreme conditions, suitable for outdoor or industrial use.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish provides excellent corrosion resistance and reliable electrical contact, enhancing overall performance.

ADC Channels: YES

Integrated ADC channels allow for direct analog signal processing, making it ideal for applications requiring sensor inputs.

Terminal Position: QUAD

Quad terminal positioning allows for better alignment and connectivity on PCBs, maximizing design efficiency.

ROM Words: 131072

A substantial ROM size supports complex programs and firmware, providing flexibility for diverse applications.

Maximum Seated Height: 1.6 mm

The low seated height enables compact designs, facilitating integration into space-constrained applications.

RAM Words: 4096

Ample RAM allows for efficient data handling and multitasking, optimizing the performance of applications.

Width: 10 mm

Compact dimensions are advantageous for space-efficient designs, particularly in portable electronics.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging, enhancing reliability and reducing development time.

Peripherals: POR; PWM(5); TIMER(3); WDT

Various integrated peripherals offer diverse functionalities, making this microcontroller adaptable for numerous applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard manufacturing processes, increasing production efficiency.

Peak Reflow Temperature °C: 260

A high peak reflow temperature tolerance signifies robustness during manufacturing, ensuring reliable performance.

Length: 10 mm

A compact length further contributes to space savings in electronic design, making it suitable for miniaturized projects.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in demanding environments, making it a suitable choice for critical applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller allows direct interaction with hardware, making it versatile for various control applications.

Technology: CMOS

CMOS technology provides low power consumption and high speed, enhancing overall efficiency and performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improved mechanical strength, ensuring robust connections.

Analog To Digital Convertors: 4-Ch 8-Bit

The presence of a 4-channel 8-bit ADC allows for multiple simultaneous signal measurements, enhancing functionality in data acquisition applications.

Maximum Supply Current: 20 mA

A moderate maximum supply current allows for efficient power management, beneficial for battery-operated devices.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V fits well within the range of modern digital logic families, ensuring compatibility with other components.

PWM Channels: YES

Available PWM channels enable precise control in applications requiring motor speed and brightness adjustment.

Connectivity: I2C; UART(2)

Multiple communication protocols like I2C and UART support versatile connectivity with peripherals, enhancing application interoperability.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to software, providing enhanced functionality and user experience.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch provides suitable spacing for modern assembly techniques, optimizing the production process.

Format: FIXED POINT

The fixed-point format optimizes numeric computing tasks, particularly in embedded applications with limited processing power.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, which helps in shipping and handling considerations for manufacturers.

Speed: 24 rpm

A specified speed effectively supports applications that require moderate processing capabilities without overloading power consumption.

Low Power Mode: YES

Low power mode extends battery life in portable devices, enhancing user satisfaction with prolonged usage.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for streamlined data processing, improving the efficiency of operations.

No. of I/O Lines: 37

A robust number of I/O lines provides adequate interfacing options for sensors and modules, ensuring versatility in applications.

Technical Specifications

Microcontrollers UPSD3233BV-24T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 2ND FLASH MEMORY: 32K BYTES

Bit Size:

8

Boundary Scan:

YES

CPU Family:

8051

DAC Channels:

NO

DMA Channels:

NO

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

2

No. of I/O Lines:

37

No. of Terminals:

52

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Words:

4096

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Connectivity:

I2C; UART(2)

Peripherals:

POR; PWM(5); TIMER(3); WDT

Analog To Digital Convertors:

4-Ch 8-Bit

Trade Compliance

UPSD3233BV-24T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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