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ULQ2001R

STMicroelectronics

ULQ2001R by STMicroelectronics

STMicroelectronics' ULQ2001R is a 16-terminal peripheral driver with built-in transient protection. It operates b/w -20 °C to 85°C, offering a peak current limit of 0.5A and a supply current of 1.45mA. Ideal for applications requiring buffer or inverter-based interface ICs, it features open-collector output and sink current flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,497 parts In-Stock

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3,497

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Anansix

USA . 1,355 parts In-Stock

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1,355

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Digiode

USA . 669 parts In-Stock

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669

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 208 parts In-Stock

1+ parts

$0.594

100+ parts

-

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$0.535

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208

$0.594

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$0.535

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MKK Technologies

India . 2,214 parts In-Stock

1+ parts

$1.118

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2,214

$1.118

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DigiPath Technology Company

USA . 2,214 parts In-Stock

1+ parts

$1.118

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2,214

$1.118

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Corphita

USA . 4,676 parts In-Stock

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4,676

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 270 parts In-Stock

1+ parts

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$0.711

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270

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$0.711

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Kepictronics

USA . 171 parts In-Stock

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171

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Overview

Unlock the potential of your electronic projects with the ULQ2001R by STMicroelectronics. This high-quality peripheral driver offers built-in protections against transients, ensuring reliable performance in a wide range of applications. With 7 driver bits and a peak output current limit of 0.5A, this versatile component is perfect for controlling motors, solenoids, and other devices. Trust in STMicroelectronics to deliver exceptional value and cutting-edge technology with the ULQ2001R.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and long-term reliability of the product.

Built-in Protections: TRANSIENT

The transient protection feature guards the product against sudden voltage spikes or surges, enhancing its lifespan.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options, making it suitable for various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures optimal performance even in challenging environments.

Output Characteristics: OPEN-COLLECTOR

The open-collector output allows for easy interfacing with other devices, increasing flexibility in usage.

Maximum Supply Current: 1.45 mA

With a low maximum supply current requirement of 1.45 mA, the product is energy-efficient and cost-effective to operate.

Driver No. of Bits: 7

The 7-bit driver offers precise control and accuracy in data transmission, ensuring reliable performance.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based peripheral driver interface IC type provides compatibility with a wide range of devices, increasing its versatility.

Technical Specifications

Peripheral Drivers ULQ2001R attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT

Driver No. of Bits:

7

JESD-30 Code:

R-CDIP-T16

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.5 A

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Supply Current:

1.45 mA

Surface Mount:

NO

Terminal Form:

Terminal Position:

DUAL

Turn-off Time:

1 us

Turn-on Time:

1 us

Trade Compliance

ULQ2001R Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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