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ULQ2002A

STMicroelectronics

ULQ2002A by STMicroelectronics

STMicroelectronics ULQ2002A is a 16-terminal peripheral driver with built-in transient protection. It operates b/w -40 °C to 105°C, with a max supply voltage of 13V. Ideal for applications requiring open-collector output and sink current flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,768 parts In-Stock

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1,768

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Digiode

USA . 1,506 parts In-Stock

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1,506

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Anansix

USA . 493 parts In-Stock

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493

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 337 parts In-Stock

1+ parts

$0.921

100+ parts

-

1k+ parts

$0.829

10k+ parts

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337

$0.921

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$0.829

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MKK Technologies

India . 883 parts In-Stock

1+ parts

$1.732

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883

$1.732

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DigiPath Technology Company

USA . 883 parts In-Stock

1+ parts

$1.732

100+ parts

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883

$1.732

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Corphita

USA . 4,874 parts In-Stock

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4,874

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Parana Technologies

USA . 724 parts In-Stock

1+ parts

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$1.101

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724

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$1.101

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Overview

Transform the way you drive peripherals with the ULQ2002A by STMicroelectronics. With a focus on quality and innovation, STMicroelectronics delivers a cutting-edge peripheral driver that guarantees superior performance and reliability. From industrial automation to consumer electronics, this product is versatile and adaptable, providing value and benefits to customers across various applications. Say goodbye to concerns about transient protections and operating temperatures - the ULQ2002A has got you covered. Embrace efficiency and precision with this top-of-the-line peripheral driver today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to physical damage, making this peripheral driver suitable for various industrial environments.

Maximum Supply Voltage: 13 V

The high maximum supply voltage allows for compatibility with a wide range of systems and devices.

Built-in Protections: TRANSIENT

The built-in transient protection enhances the reliability of the peripheral driver by safeguarding it against sudden voltage spikes or fluctuations.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to integrate this peripheral driver into existing systems and reduces the need for additional space.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures the peripheral driver can operate efficiently even in demanding conditions without overheating.

Output Characteristics: OPEN-COLLECTOR

The open-collector output allows for versatile connectivity and compatibility with different types of devices and circuits.

Terminal Position: DUAL

The dual terminal position provides flexibility in installation and connection options, making it suitable for various applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form enhances the stability and reliability of the connections, reducing the risk of intermittent contact or disconnection.

Technical Specifications

Peripheral Drivers ULQ2002A attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT

Driver No. of Bits:

7

JESD-30 Code:

R-PDIP-T16

Length:

20 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.1 mm

Maximum Supply Voltage:

13 V

Surface Mount:

NO

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Turn-off Time:

1 us

Turn-on Time:

1 us

Width:

7.62 mm

Trade Compliance

ULQ2002A Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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