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TSV324AIYDT

STMicroelectronics

TSV324AIYDT by STMicroelectronics

TSV324AIYDT from STMicroelectronics is a micropower operational amplifier featuring a max input offset voltage of 1000 µV, a common mode reject ratio of 80 dB, and operates within -40 °C to 125°C. Ideal for automotive applications, it supports dual supply voltages of 3/5 V. Its compact design with 14 terminals ensures efficient surface mounting in various electronic circuits.

Median Price

$1.500

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,342 parts In-Stock

1+ parts

$1.500

100+ parts

$0.882

1k+ parts

$0.787

10k+ parts

-

2,342

$1.500

$0.882

$0.787

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,815 parts In-Stock

1+ parts

$1.358

100+ parts

-

1k+ parts

-

10k+ parts

-

4,815

$1.358

-

-

-

Vyrian

USA . 2,160 parts In-Stock

1+ parts

$1.430

100+ parts

-

1k+ parts

-

10k+ parts

-

2,160

$1.430

-

-

-

Anansix

USA . 1,986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,986

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 7,300 parts In-Stock

1+ parts

$0.900

100+ parts

-

1k+ parts

-

10k+ parts

-

7,300

$0.900

-

-

-

Corphita

USA . 4,978 parts In-Stock

1+ parts

$1.287

100+ parts

-

1k+ parts

-

10k+ parts

-

4,978

$1.287

-

-

-

IDEA Electronic Components Group

UK . 1,366 parts In-Stock

1+ parts

$6.594

100+ parts

-

1k+ parts

$5.934

10k+ parts

-

1,366

$6.594

-

$5.934

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$7.945

100+ parts

$7.230

1k+ parts

$6.515

10k+ parts

-

100

$7.945

$7.230

$6.515

-

MKK Technologies

India . 343 parts In-Stock

1+ parts

$12.399

100+ parts

-

1k+ parts

-

10k+ parts

-

343

$12.399

-

-

-

DigiPath Technology Company

USA . 343 parts In-Stock

1+ parts

$12.399

100+ parts

-

1k+ parts

-

10k+ parts

-

343

$12.399

-

-

-

A-Z Elektronik GmbH

Germany . 6,701 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,701

-

-

-

-

Microchip USA

USA . 6,668 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,668

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Parana Technologies

USA . 476 parts In-Stock

1+ parts

-

100+ parts

$7.884

1k+ parts

-

10k+ parts

-

476

-

$7.884

-

-

Overview

Elevate your designs with the TSV324AIYDT from STMicroelectronics—a trusted leader in innovative semiconductor solutions. This versatile operational amplifier combines exceptional quality and reliability with low power consumption, making it perfect for automotive applications and portable devices. With four functions packed into a compact design, enjoy enhanced performance and precision while benefiting from ST's commitment to excellence and customer satisfaction. Transform your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides reliability and robustness in various conditions.

Maximum Input Offset Voltage: 1000 uV

A low input offset voltage ensures high accuracy in amplifying signals, making it ideal for precision applications.

Maximum Average Bias Current (IIB): 0.15 uA

The low bias current minimizes power consumption and improves performance in battery-operated devices.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic circuits.

No. of Functions: 4

Having 4 functions increases versatility and reduces the number of components needed in a circuit.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the PCB, facilitating easier layout and assembly.

Nominal Common Mode Reject Ratio: 80 dB

A high CMRR improves the accuracy of the amplifier by rejecting common-mode signals, beneficial in noisy environments.

Nominal Supply Voltage / Vsup (V): 3

A nominal supply voltage of 3V is energy-efficient, suitable for low-power applications.

Power Supplies (V): 3/5

Compatibility with 3 to 5V supplies provides flexibility in circuit designs and integration with various systems.

No. of Terminals: 14

A 14-terminal configuration allows for a variety of circuit connections and functionalities, enhancing adaptability.

Maximum Input Offset Current (IIO): 0.06 uA

The low input offset current contributes to overall signal stability and accuracy, essential in sensitive applications.

Package Style (Meter): SMALL OUTLINE

Small outline packaging is ideal for space-constrained designs, enabling compact product assemblies.

Minimum Slew Rate: 0.42 V/us

This minimum slew rate allows the amplifier to respond quickly to input changes, enhancing performance in dynamic applications.

Maximum Supply Voltage Limit: 7 V

A maximum supply voltage limit of 7V ensures compatibility with a wide range of circuit applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this product suitable for applications in extreme environments.

Maximum Bias Current (IIB) @ 25 °C: 0.125 uA

This low bias current at standard temperature is beneficial for maintaining low power consumption.

Frequency Compensation: YES

Built-in frequency compensation helps ensure stability in a variety of operational scenarios.

Minimum Voltage Gain: 5011

A minimum voltage gain of 5011 provides sufficient amplification for weak input signals.

Minimum Operating Temperature: -40 °C

This low minimum temperature rating allows the device to operate reliably in harsh cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish ensures reliable electrical connections and corrosion resistance.

Terminal Position: DUAL

Dual terminal positioning facilitates easier connections and improved layout options on PCBs.

Maximum Seated Height: 1.75 mm

The compact seated height helps to minimize the overall profile of the device, which is advantageous in tight spaces.

Width: 3.9 mm

A narrow width allows for denser packing of components in circuit designs.

Micropower: YES

Micropower operation minimizes power consumption, making it ideal for portable and battery-powered devices.

Length: 8.65 mm

The short length contributes to compact circuit designs while ensuring functionality.

Temperature Grade: AUTOMOTIVE

An automotive temperature grade ensures reliability and durability in automotive applications.

Nominal Unity Gain Bandwidth: 1300 kHz

A high unity gain bandwidth enhances performance in high-frequency applications and signal processing.

Minimum Common Mode Reject Ratio: 60 dB

A minimum CMRR of 60 dB provides good rejection of common-mode signals, making it suitable for various applications.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS, offering high performance and low power consumption.

Terminal Form: GULL WING

The gull wing terminal form provides reliable soldering connections, ensuring robust circuit assembly.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, it is highly versatile for a variety of signal processing tasks.

Maximum Supply Current: 3.5 mA

The low maximum supply current enhances energy efficiency, suitable for battery-sensitive applications.

Nominal Negative Supply Voltage (Vsup): 0 V

The ability to operate with a 0V negative supply voltage simplifies design and reduces complexity in circuit implementation.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture provides excellent linearity and bandwidth, making it ideal for amplifying various signals.

Packing Method: TAPE AND REEL

Tape and reel packaging facilitates easy handling and automated assembly in production lines.

Nominal Slow Rate: 0.6 V/us

A nominal slow rate of 0.6 V/us is adequate for many signal applications and ensures stable operation.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for standard PCB layouts, ensuring compatibility with most manufacturing processes.

Technical Specifications

Operational Amplifiers (Op Amps) TSV324AIYDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BICMOS

Power Supply:

3/5 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

60 dB

Input Offset Voltage Limit:

1000 uV

Minimum Voltage Gain:

5011

Minimum Slew Rate:

0.42 V/us

Nominal Slew Rate:

0.6 V/us

Maximum Input Offset Current (IIO):

60 nA

Peak Bias Current:

150 nA

Maximum Bias Current (IIB) @25 °C:

125 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

7 V

Maximum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

3.5 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TSV324AIYDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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