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TSV324AIYD

STMicroelectronics

TSV324AIYD by STMicroelectronics

TSV324AIYD by STMicroelectronics is a micropower operational amplifier featuring a max input offset voltage of 1000 µV, a common mode reject ratio of 80 dB, and operates within -40 °C to 125°C. Ideal for automotive applications, it supports dual supply voltages of 3/5 V. Its compact design and low bias current make it suitable for precision signal processing in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,356 parts In-Stock

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4,356

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Digiode

USA . 4,123 parts In-Stock

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4,123

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Anansix

USA . 2,464 parts In-Stock

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2,464

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 518 parts In-Stock

1+ parts

$0.572

100+ parts

-

1k+ parts

$0.515

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518

$0.572

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$0.515

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MKK Technologies

India . 2,026 parts In-Stock

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$1.076

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2,026

$1.076

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DigiPath Technology Company

USA . 2,026 parts In-Stock

1+ parts

$1.076

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2,026

$1.076

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Parana Technologies

USA . 2,079 parts In-Stock

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$0.684

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2,079

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$0.684

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Corphita

USA . 1,460 parts In-Stock

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1,460

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Overview

Elevate your designs with the TSV324AIYD from STMicroelectronics, a leading name in advanced semiconductor solutions. This versatile operational amplifier offers exceptional performance with ultra-low bias current and impressive common mode rejection, making it ideal for precision applications in automotive and industrial settings. Enjoy enhanced efficiency, reliability, and compact integration, ensuring your projects achieve unparalleled quality and innovation. Experience the power of STMicroelectronics—where excellence meets cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robustness and longevity, making it suitable for various applications.

Maximum Input Offset Voltage: 1000 uV

A low input offset voltage is crucial for precision applications, helping to improve accuracy in signal amplification.

Maximum Average Bias Current (IIB): 0.15 uA

Low bias current enhances performance in low-power applications, making it ideal for battery-operated devices.

Surface Mount: YES

Surface mount technology facilitates compact designs and automated assembly processes.

No. of Functions: 4

The availability of multiple functions allows for versatile applications and helps reduce the number of required components.

Package Shape: RECTANGULAR

A rectangular package shape enhances space optimization on PCBs.

Nominal Common Mode Reject Ratio: 80 dB

A high common mode rejection ratio improves the ability to reject noise, ensuring signal integrity.

Nominal Supply Voltage / Vsup (V): 3

Operates at a low supply voltage, which helps in reducing overall power consumption.

Power Supplies (V): 3/5

Compatibility with dual supply voltages offers flexibility for various circuit designs.

No. of Terminals: 14

A 14-terminal configuration allows for expanded functionality and connectivity options.

Package Style (Meter): SMALL OUTLINE

Small outline packages save space and are suitable for dense circuit layouts.

Maximum Supply Voltage Limit: 7 V

This limits the maximum voltage to protect the device from potential damage, enhancing reliability.

Maximum Operating Temperature: 125 °C

High temperature tolerance makes it suitable for automotive and industrial applications.

Maximum Bias Current (IIB) @25°C: 0.13 uA

Further reduced bias current at standard temperature improves performance in sensitive applications.

Frequency Compensation: YES

Integrated frequency compensation ensures stable performance across a wide range of frequencies.

Minimum Voltage Gain: 5000

A substantial minimum voltage gain makes it suitable for applications requiring high amplification levels.

Minimum Operating Temperature: -40 °C

Low temperature operation allows for deployment in harsh environments where reliability is critical.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent solderability and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal positioning provides flexibility for various design layouts.

Maximum Seated Height: 1.75 mm

A low profile height is advantageous for compact designs where space is limited.

Width: 3.9 mm

Compact width allows for efficient board layout and space-saving designs.

Micropower: YES

Micropower operation is beneficial for low-power applications, extending battery life.

Length: 8.65 mm

Compact length supports space-efficient integration into various designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade specification ensures reliability and durability in demanding automotive environments.

Nominal Unity Gain Bandwidth: 1300 kHz

A high bandwidth allows for a wide frequency response, suitable for high-speed applications.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies for high performance with low power consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate easy board mounting and enhance mechanical stability.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it is versatile for a wide range of applications, including signal conditioning and filtering.

Maximum Supply Current: 3.5 mA

Low supply current contributes to energy-efficient designs, suitable for portable applications.

Nominal Negative Supply Voltage (Vsup): 0 V

Having a nominal negative supply voltage of 0 V allows for straightforward design and implementation.

Architecture: VOLTAGE-FEEDBACK

The voltage-feedback architecture is a standard, reliable approach for numerous amplification tasks.

Packing Method: TUBE

Tube packaging is beneficial for careful handling and easy storage of components.

Nominal Slow Rate: 0.6 V/us

A nominal slow rate suits applications where gradual signal transitions are preferred.

Terminal Pitch: 1.27 mm

A standard terminal pitch allows for compatibility with common PCB layouts and designs.

Technical Specifications

Operational Amplifiers (Op Amps) TSV324AIYD attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BICMOS

Power Supply:

3/5 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

1000 uV

Minimum Voltage Gain:

5000

Nominal Slew Rate:

0.6 V/us

Peak Bias Current:

150 nA

Maximum Bias Current (IIB) @25 °C:

130 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

7 V

Maximum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

3.5 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TSV324AIYD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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