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TSV324AID

STMicroelectronics

TSV324AID by STMicroelectronics

TSV324AID by STMicroelectronics is a micropower operational amplifier featuring a max input offset voltage of 1000 µV, a common mode reject ratio of 80 dB, and operates within -40 °C to 125°C. Ideal for automotive applications, it supports dual supply voltages of 3/5 V. Its compact design and low bias current make it suitable for precision signal processing tasks.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 4,223 parts In-Stock

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Vyrian

USA . 4,166 parts In-Stock

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Anansix

USA . 2,688 parts In-Stock

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2,688

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IDEA Electronic Components Group

UK . 1,845 parts In-Stock

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$2.592

100+ parts

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$2.332

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1,845

$2.592

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$2.332

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MKK Technologies

India . 1,567 parts In-Stock

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$4.873

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1,567

$4.873

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DigiPath Technology Company

USA . 1,567 parts In-Stock

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$4.873

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1,567

$4.873

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Corphita

USA . 2,075 parts In-Stock

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2,075

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Parana Technologies

USA . 208 parts In-Stock

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$3.099

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208

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Overview

Unlock exceptional performance with the TSV324AID operational amplifier from STMicroelectronics. Renowned for its quality and reliability, this versatile Op Amp excels in low-power applications across automotive and industrial sectors. With outstanding precision and minimal offset voltage, it ensures optimal signal integrity while remaining energy-efficient. Elevate your designs with a trusted solution that combines innovation, durability, and unmatched support from one of the industry’s leaders!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making it suitable for various applications.

Maximum Input Offset Voltage: 1000 uV

A low maximum input offset voltage contributes to higher accuracy in signal processing, crucial for precision applications.

Maximum Average Bias Current (IIB): 0.15 uA

The low bias current helps in minimizing the power consumption, which is essential for battery-powered and energy-efficient designs.

Surface Mount: YES

The surface mount capability allows for compact designs and automated manufacturing processes, making it ideal for modern electronic devices.

No. of Functions: 4

Having multiple functions in one package enhances design flexibility and reduces overall system complexity.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCB layouts and can improve thermal performance.

Nominal Common Mode Reject Ratio: 80 dB

A high common mode reject ratio ensures excellent noise rejection, making it suitable for precision applications where signal integrity is paramount.

Nominal Supply Voltage / Vsup (V): 3

A nominal supply voltage of 3V supports low-voltage operation, compatible with battery-operated devices.

Power Supplies (V): 3/5

Supports dual supply voltages (3V and 5V), allowing for versatile applications in various circuits.

No. of Terminals: 14

With 14 terminals, this op-amp offers a variety of connection options for different configurations and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-efficient, making it ideal for compact electronic designs.

Maximum Supply Voltage Limit: 7 V

A maximum supply voltage limit of 7V provides flexibility in circuit design while ensuring operational safety.

Maximum Operating Temperature: 125 °C

The high operating temperature range allows this op-amp to perform in harsh environments, making it suitable for automotive and industrial applications.

Maximum Bias Current (IIB) @25 °C: 0.13 uA

A very low bias current at 25 °C ensures minimal distortion and power consumption, enhancing efficiency in signal processing.

Frequency Compensation: YES

Built-in frequency compensation ensures stability across various operating conditions, making it a reliable choice for various applications.

Minimum Voltage Gain: 5000

A minimum voltage gain of 5000 allows for effective amplification of weak signals in a variety of applications.

Minimum Operating Temperature: -40 °C

The capability to operate down to -40 °C makes it suitable for use in extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent conductivity and corrosion resistance, which is vital for long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout options on circuit boards.

Maximum Seated Height: 1.75 mm

The low seated height helps in achieving low-profile designs, important for space-constrained applications.

Width: 3.9 mm

A narrow width facilitates designs in tight spaces while maintaining a compact form factor.

Micropower: YES

Micropower capabilities ensure low energy consumption, making this op-amp ideal for battery-operated applications.

Length: 8.65 mm

The small length makes it suited for modern, compact circuit designs optimizing space on the PCB.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this op-amp meets rigorous temperature and reliability standards needed for automotive electronics.

Nominal Unity Gain Bandwidth: 1300 kHz

A high unity gain bandwidth indicates good frequency performance, which is critical for high-speed signal processing applications.

Technology: BICMOS

The BICMOS technology combines the advantages of bipolar and CMOS transistors, providing high performance with low power consumption.

Terminal Form: GULL WING

Gull-wing terminals enable easy soldering and enhance mechanical stability on printed circuit boards.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, it is versatile for various applications, such as signal conditioning, filtering, and amplification.

Maximum Supply Current: 3.5 mA

A low maximum supply current supports energy-efficient designs, crucial for battery-operated devices.

Nominal Negative Supply Voltage (Vsup): 0 V

A nominal negative supply voltage of 0V simplifies power supply requirements in single-supply applications.

Architecture: VOLTAGE-FEEDBACK

The voltage-feedback architecture allows for straightforward circuit design and stable performance across varying loads.

Packing Method: TUBE

Packed in tubes for easy handling and organization, this method ensures protection during transport and storage.

Nominal Slow Rate: 0.6 V/us

A slow rate of 0.6 V/us allows for controlled response times, which is beneficial in various signal-processing applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm ensures compatible spacing for various surface mount PCB designs.

Technical Specifications

Operational Amplifiers (Op Amps) TSV324AID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BICMOS

Power Supply:

3/5 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

1000 uV

Minimum Voltage Gain:

5000

Nominal Slew Rate:

0.6 V/us

Peak Bias Current:

150 nA

Maximum Bias Current (IIB) @25 °C:

130 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

7 V

Maximum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

3.5 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TSV324AID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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