Loading...

TSV321AID

STMicroelectronics

TSV321AID by STMicroelectronics

TSV321AID by STMicroelectronics is a micropower operational amplifier ideal for automotive applications. It features a max input offset voltage of 1000 µV, a common mode reject ratio of 80 dB, and operates within -40 °C to 125°C. Its compact design supports surface mounting with an 8-terminal configuration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,828

-

-

-

-

Vyrian

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

Digiode

USA . 1,001 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,001

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 812 parts In-Stock

1+ parts

$2.966

100+ parts

-

1k+ parts

$2.669

10k+ parts

-

812

$2.966

-

$2.669

-

MKK Technologies

India . 69 parts In-Stock

1+ parts

$5.578

100+ parts

-

1k+ parts

-

10k+ parts

-

69

$5.578

-

-

-

DigiPath Technology Company

USA . 69 parts In-Stock

1+ parts

$5.578

100+ parts

-

1k+ parts

-

10k+ parts

-

69

$5.578

-

-

-

Corphita

USA . 2,814 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,814

-

-

-

-

Parana Technologies

USA . 706 parts In-Stock

1+ parts

-

100+ parts

$3.546

1k+ parts

-

10k+ parts

-

706

-

$3.546

-

-

Overview

Elevate your designs with the TSV321AID operational amplifier from STMicroelectronics, a leader in high-performance solutions. This micropower op-amp excels in precision applications, offering superior low noise and enhanced reliability for automotive and industrial uses. With its compact size and robust temperature tolerance, it delivers remarkable performance where you need it most. Trust in STMicroelectronics for quality that drives innovation and efficiency in your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight packaging material ensures reliability and ease of handling.

Maximum Input Offset Voltage: 1000 uV

Low input offset voltage enhances precision in signal amplification, making it suitable for sensitive applications.

Maximum Average Bias Current (IIB): 0.15 uA

Minimal bias current helps in reducing signal distortion and improves overall performance in low-power circuits.

Surface Mount: YES

Surface mount capability allows for compact designs and automated assembly, improving manufacturing efficiency.

Package Shape: RECTANGULAR

Rectangular shape aids in efficient space utilization on PCBs.

Nominal Common Mode Reject Ratio: 80 dB

High CMRR ensures better rejection of noise and interference, making it suitable for noisy environments.

Nominal Supply Voltage / Vsup (V): 3

Low supply voltage allows for operation in battery-powered applications, enhancing efficiency.

Power Supplies (V): 3/5

Flexible supply options make this op-amp adaptable to a variety of circuit designs.

No. of Terminals: 8

Standard 8-terminal configuration ensures compatibility with a wide range of applications.

Package Style (Meter): SMALL OUTLINE

Compact form factor is ideal for space-constrained environments in modern electronics.

Maximum Supply Voltage Limit: 7 V

Allows for flexible usage in various applications without the risk of damage from overvoltage.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliable operation in harsh environments, making it suitable for automotive applications.

Maximum Bias Current (IIB) @25°C: 0.13 uA

Very low bias current at room temperature ensures optimal performance and minimal impact on circuit functions.

Frequency Compensation: YES

Ensures stable operation across a range of frequencies, making it suitable for high-performance applications.

Minimum Voltage Gain: 5000

High voltage gain improves signal amplification capabilities, suitable for weak signal applications.

Minimum Operating Temperature: -40 °C

Suitable for operation in extremely low-temperature applications, extending its usability.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish enhances solderability and durability, ensuring longer lifetimes and reliability.

Terminal Position: DUAL

Dual terminal position enhances circuit design flexibility and simplifies layout options.

Maximum Seated Height: 1.75 mm

Low profile keeps components close to the PCB, improving performance and minimizing inductance.

Width: 3.9 mm

Compact width allows for high-density circuit designs, ideal for modern electronic devices.

Micropower: YES

Micropower operation is perfect for battery-powered applications, maximizing battery life.

Length: 4.9 mm

Short length contributes to a compact layout, essential for miniaturized electronics.

Temperature Grade: AUTOMOTIVE

Automotive-grade specifications ensure reliability and performance under a wide range of operating conditions.

Nominal Unity Gain Bandwidth: 1300 kHz

High bandwidth capability improves the op-amp's performance in high-speed applications.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS, providing high speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve PCB assembly processes.

Amplifier Type: OPERATIONAL AMPLIFIER

Standard operational amplifier functionality fits a wide array of applications in analog circuits.

Maximum Supply Current: 0.875 mA

Low supply current extends battery life in portable devices, making this op-amp an excellent choice for energy-sensitive applications.

Nominal Negative Supply Voltage (Vsup): 0 V

Provides flexibility for single-supply operation, simplifying design and reducing component count.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture offers broad compatibility and is ideal for a wide range of applications.

Packing Method: TUBE

Tube packaging protects components during transport and facilitates easier inventory management.

Nominal Slow Rate: 0.6 V/us

Moderate slow rate can improve stability in various application scenarios.

Terminal Pitch: 1.27 mm

Standard terminal pitch simplifies PCB design and component placement.

Technical Specifications

Operational Amplifiers (Op Amps) TSV321AID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BICMOS

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

1000 uV

Minimum Voltage Gain:

5000

Nominal Slew Rate:

0.6 V/us

Peak Bias Current:

150 nA

Maximum Bias Current (IIB) @25 °C:

130 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

7 V

Maximum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

875 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TSV321AID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19