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TSH62CD

STMicroelectronics

TSH62CD by STMicroelectronics

TSH62CD by STMicroelectronics is a dual operational amplifier in a compact 8-terminal SO package. It features a max height of 1.75 mm, operates within commercial temp grades, and is ideal for signal conditioning in various electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,670 parts In-Stock

1+ parts

-

100+ parts

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5,670

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Digiode

USA . 2,013 parts In-Stock

1+ parts

-

100+ parts

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2,013

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Anansix

USA . 653 parts In-Stock

1+ parts

-

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653

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,580 parts In-Stock

1+ parts

$4.151

100+ parts

-

1k+ parts

$3.736

10k+ parts

-

1,580

$4.151

-

$3.736

-

Microchip USA

USA . 125 parts In-Stock

1+ parts

$4.928

100+ parts

-

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-

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125

$4.928

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MKK Technologies

India . 708 parts In-Stock

1+ parts

$7.806

100+ parts

-

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708

$7.806

-

-

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DigiPath Technology Company

USA . 708 parts In-Stock

1+ parts

$7.806

100+ parts

-

1k+ parts

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10k+ parts

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708

$7.806

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-

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AZTECH Wire

Italy . 1,200 parts In-Stock

1+ parts

$16.890

100+ parts

-

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1,200

$16.890

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-

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Component Stockers USA

USA . 495 parts In-Stock

1+ parts

$99.990

100+ parts

-

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10k+ parts

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495

$99.990

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Kepictronics

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Vigor

Singapore . 1,300 parts In-Stock

1+ parts

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1,300

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Corphita

USA . 517 parts In-Stock

1+ parts

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517

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Parana Technologies

USA . 416 parts In-Stock

1+ parts

-

100+ parts

$4.963

1k+ parts

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416

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$4.963

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Overview

Elevate your designs with the TSH62CD from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This dual operational amplifier combines superior performance with compact sizing, perfect for space-constrained applications like audio processing and sensor signal conditioning. Experience reliable functionality and exceptional quality that enhance your projects, driving efficiency and reliability while reducing overall costs. Choose TSH62CD and unlock the potential of your next creation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protects the circuitry from environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient space utilization on PCBs, supporting high-density designs and automated assembly.

No. of Functions: 2

Having two functions in a single package increases design flexibility and can reduce component count, saving space and cost.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design that is easy to place on circuit boards, optimizing layout and functionality.

No. of Terminals: 8

With 8 terminals, this op-amp allows for versatile circuit configurations and connections, enhancing its adaptability in applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style supports efficient use of board space, ideal for compact and portable electronic devices.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures excellent solderability and resistance to oxidation, improving reliability and longevity.

Terminal Position: DUAL

The dual terminal position enhances the ease of integration into various circuit designs, allowing for more efficient connections.

Maximum Seated Height: 1.75 mm

A low maximum seated height aids in maintaining a slim profile for the device, making it ideal for low-profile applications.

Width: 3.9 mm

A compact width supports high-density designs and efficient layout in space-constrained applications.

Length: 4.9 mm

The short length facilitates versatile mounting options on PCBs, allowing for better circuit design flexibility.

Temperature Grade: COMMERCIAL

Rated for commercial temperature ranges, this op-amp is versatile for everyday applications without extreme environment considerations.

Terminal Form: GULL WING

Gull wing terminals offer stability and ease of soldering on PCBs, contributing to a strong mechanical bond.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, it is suitable for a wide range of analog applications, including filtering and signal processing.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides a good balance between compactness and ease of soldering, making it convenient for design.

Technical Specifications

Operational Amplifiers (Op Amps) TSH62CD attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

2

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TSH62CD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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