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TSH61CDT

STMicroelectronics

TSH61CDT by STMicroelectronics

TSH61CDT by STMicroelectronics is a compact operational amplifier in an 8-terminal SO package, ideal for space-constrained applications. It features a max seated height of 1.75 mm and operates within commercial temperature grades. This versatile op-amp is perfect for signal conditioning and amplification tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,528 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,528

-

-

-

-

Vyrian

USA . 1,767 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,767

-

-

-

-

Anansix

USA . 169 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

169

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 438 parts In-Stock

1+ parts

$6.293

100+ parts

-

1k+ parts

$5.664

10k+ parts

-

438

$6.293

-

$5.664

-

MKK Technologies

India . 1,680 parts In-Stock

1+ parts

$11.833

100+ parts

-

1k+ parts

-

10k+ parts

-

1,680

$11.833

-

-

-

DigiPath Technology Company

USA . 1,680 parts In-Stock

1+ parts

$11.833

100+ parts

-

1k+ parts

-

10k+ parts

-

1,680

$11.833

-

-

-

Microchip USA

USA . 5,469 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,469

-

-

-

-

Corphita

USA . 3,332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,332

-

-

-

-

Vigor

Singapore . 2,231 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,231

-

-

-

-

Parana Technologies

USA . 674 parts In-Stock

1+ parts

-

100+ parts

$7.524

1k+ parts

-

10k+ parts

-

674

-

$7.524

-

-

Overview

Unlock the potential of your designs with the TSH61CDT from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-performance operational amplifier seamlessly enhances signal processing in diverse applications, from audio equipment to automotive systems. Its compact form and reliable quality ensure exceptional performance while saving valuable board space. Elevate your projects with the precision and efficiency that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount enables easy integration into circuit boards, enhancing design flexibility and minimizing PCB space.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient space utilization within tight layouts, ideal for compact electronic devices.

No. of Terminals: 8

With 8 terminals, this op amp allows for versatile circuit configurations, improving its functionality in complex designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes the footprint, making it a great choice for space-constrained applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish enhances conductivity and corrosion resistance, ensuring reliable performance over time.

Terminal Position: DUAL

Dual terminal positioning supports better alignment and mechanical stability on the circuit board, reducing assembly errors.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm allows it to fit into low-profile designs without compromising performance.

Width: 3.9 mm

A compact width of 3.9 mm enables this op amp to be utilized in tight spaces while maintaining electrical performance.

Length: 4.9 mm

The length of 4.9 mm complements its width, making it ideal for compact arrays and intricate circuit designs.

Temperature Grade: COMMERCIAL

With a commercial temperature grade, it is suitable for general applications, making it versatile for various consumer electronics.

Terminal Form: GULL WING

The gull wing terminal form provides easy soldering and enhances the reliability of connections, improving the overall integrity of the assembly.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it can be used in a wide range of analog applications, making it a valuable component in signal processing tasks.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compatibility with standard soldering equipment, ensuring ease of manufacturing and assembly.

Technical Specifications

Operational Amplifiers (Op Amps) TSH61CDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TSH61CDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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