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TSH62CDT

STMicroelectronics

TSH62CDT by STMicroelectronics

TSH62CDT by STMicroelectronics is a dual operational amplifier in a compact 8-terminal SO package. It features a max seated height of 1.75 mm, operates within commercial temp grades, and is ideal for signal conditioning in various electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,603 parts In-Stock

1+ parts

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5,603

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Anansix

USA . 2,222 parts In-Stock

1+ parts

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2,222

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Digiode

USA . 1,378 parts In-Stock

1+ parts

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1,378

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LWI Electronics Inc

India . 185 parts In-Stock

1+ parts

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185

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,111 parts In-Stock

1+ parts

$3.555

100+ parts

-

1k+ parts

$3.199

10k+ parts

-

1,111

$3.555

-

$3.199

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MKK Technologies

India . 930 parts In-Stock

1+ parts

$6.685

100+ parts

-

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930

$6.685

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DigiPath Technology Company

USA . 930 parts In-Stock

1+ parts

$6.685

100+ parts

-

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930

$6.685

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Microchip USA

USA . 155 parts In-Stock

1+ parts

$6.961

100+ parts

-

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155

$6.961

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AZTECH Wire

Italy . 1,119 parts In-Stock

1+ parts

$12.030

100+ parts

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1,119

$12.030

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Kepictronics

USA . 5,000 parts In-Stock

1+ parts

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5,000

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

1+ parts

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3,000

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ChipstoGo Electronic ltd

UK . 2,500 parts In-Stock

1+ parts

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2,500

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Vigor

Singapore . 2,500 parts In-Stock

1+ parts

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2,500

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Corphita

USA . 1,913 parts In-Stock

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1,913

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Parana Technologies

USA . 804 parts In-Stock

1+ parts

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100+ parts

$4.250

1k+ parts

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804

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$4.250

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Overview

Unlock exceptional performance with the TSH62CDT from STMicroelectronics, a leader in innovative semiconductor solutions. This dual operational amplifier excels in precision applications, offering unparalleled reliability and quality for your designs. Whether you're enhancing audio systems or optimizing signal processing, its compact, surface-mount package ensures seamless integration. Experience the perfect blend of value and performance that empowers your projects to reach new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection against environmental factors, making this Op Amp suitable for a variety of applications.

Surface Mount: YES

Being a surface mount device allows easier and more efficient placement on PCBs, facilitating higher density layouts and reducing assembly costs.

No. of Functions: 2

Having two functions in one package increases design flexibility and can help minimize board space and component count, which is ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB and allows for better thermal management, essential for efficient heat dissipation.

No. of Terminals: 8

With 8 terminals, this Op Amp can support diverse connectivity options and functionalities, enhancing its versatility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline form factor is conducive for modern electronics where space is at a premium, making this Op Amp a great choice for miniaturized devices.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent conductivity and resistance to corrosion, which enhances long-term reliability and performance.

Terminal Position: DUAL

The dual terminal configuration provides flexibility in circuit configurations and is typical in operational amplifier applications, enabling better layout options.

Maximum Seated Height: 1.75 mm

The compact maximum seated height allows for low-profile designs, which is advantageous in space-constrained applications.

Width: 3.9 mm

A width of 3.9 mm contributes to compact board designs, making it ideal for portable and space-efficient electronics.

Length: 4.9 mm

The compact length aids in maintaining reduced overall dimensions of the PCB, which is critical for high-density applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that the Op Amp can operate reliably in standard environmental conditions, making it suitable for a wide range of applications.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering options and excellent mechanical strength, helping to maintain good electrical connections under mechanical stress.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this product excels in amplification and signal processing tasks, making it versatile for various electronic applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch standardizes design practices and ensures compatibility with a wide range of PCB designs and assembly techniques.

Technical Specifications

Operational Amplifiers (Op Amps) TSH62CDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

2

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TSH62CDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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