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TSH64CDT

STMicroelectronics

TSH64CDT by STMicroelectronics

TSH64CDT by STMicroelectronics is a compact operational amplifier featuring 4 functions in a small outline package. It has a max height of 1.75 mm, with nickel palladium gold terminals for enhanced durability. Ideal for commercial applications requiring precision signal processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,041 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,041

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-

-

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R&J Components

USA . 2,379 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,379

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Anansix

USA . 1,181 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,181

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-

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Digiode

USA . 407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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407

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,872 parts In-Stock

1+ parts

$4.397

100+ parts

-

1k+ parts

$3.957

10k+ parts

-

1,872

$4.397

-

$3.957

-

MKK Technologies

India . 1,188 parts In-Stock

1+ parts

$8.268

100+ parts

-

1k+ parts

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10k+ parts

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1,188

$8.268

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-

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DigiPath Technology Company

USA . 1,188 parts In-Stock

1+ parts

$8.268

100+ parts

-

1k+ parts

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10k+ parts

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1,188

$8.268

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-

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AZTECH Wire

Italy . 314 parts In-Stock

1+ parts

$8.410

100+ parts

-

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10k+ parts

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314

$8.410

-

-

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Microchip USA

USA . 157 parts In-Stock

1+ parts

$11.056

100+ parts

-

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157

$11.056

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Parana Technologies

USA . 1,542 parts In-Stock

1+ parts

-

100+ parts

$5.257

1k+ parts

-

10k+ parts

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1,542

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$5.257

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Vigor

Singapore . 1,450 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,450

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Corphita

USA . 484 parts In-Stock

1+ parts

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484

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Overview

Unlock the power of precision with the TSH64CDT from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile operational amplifier excels in enhancing audio quality, signal processing, and sensor applications. With its compact design and multiple functions, it seamlessly integrates into your projects, offering reliability and performance you can trust. Elevate your designs with ST's commitment to excellence and experience unparalleled efficiency today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the body material ensures durability and provides protection against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Being surface mount compatible allows for compact PCB designs and efficient assembly processes, leading to space savings on circuit boards.

No. of Functions: 4

With four functions integrated into one package, this Op Amp offers versatility and efficiency, reducing the need for multiple components in a circuit.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, facilitating better layout options for complex circuits.

No. of Terminals: 14

Having 14 terminals provides ample connections for a variety of applications, supporting extensive circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style promotes a compact form factor, ideal for modern electronic devices where space is at a premium.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances solderability and ensures reliability over time, contributing to long-lasting performance.

Terminal Position: DUAL

Dual terminal position enables better routing and layout flexibility on PCB, aiding in improved design efficiency.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75 mm allows for a sleek profile that is advantageous in low-profile applications.

Width: 3.9 mm

The compact width of 3.9 mm makes it suitable for high-density applications where minimizing space is crucial.

Length: 8.65 mm

The moderate length of 8.65 mm strikes a balance between compact size and adequate terminal spacing for easy handling.

Temperature Grade: COMMERCIAL

Designed for commercial temperature ranges, this Op Amp is suitable for a wide range of applications without the need for special handling.

Terminal Form: GULL WING

Gull wing terminals are ideal for automated soldering processes, improving manufacturing efficiency and reducing production costs.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it is highly versatile, useful for signal conditioning, filtering, and various other analog applications.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for compatibility with common PCB layouts, facilitating easier assembly and design integration.

Technical Specifications

Operational Amplifiers (Op Amps) TSH64CDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

4

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TSH64CDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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