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TSH61CD

STMicroelectronics

TSH61CD by STMicroelectronics

TSH61CD by STMicroelectronics is a dual operational amplifier in an 8-terminal SO package, ideal for compact applications. It features a max seated height of 1.75 mm and operates within commercial temperature grades. Perfect for signal conditioning and amplification tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,755 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,755

-

-

-

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Anansix

USA . 1,017 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,017

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-

-

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Digiode

USA . 995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

995

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 397 parts In-Stock

1+ parts

$0.647

100+ parts

-

1k+ parts

-

10k+ parts

-

397

$0.647

-

-

-

IDEA Electronic Components Group

UK . 557 parts In-Stock

1+ parts

$1.050

100+ parts

-

1k+ parts

$0.945

10k+ parts

-

557

$1.050

-

$0.945

-

MKK Technologies

India . 2,332 parts In-Stock

1+ parts

$1.974

100+ parts

-

1k+ parts

-

10k+ parts

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2,332

$1.974

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-

-

DigiPath Technology Company

USA . 2,332 parts In-Stock

1+ parts

$1.974

100+ parts

-

1k+ parts

-

10k+ parts

-

2,332

$1.974

-

-

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AZTECH Wire

Italy . 883 parts In-Stock

1+ parts

$9.680

100+ parts

-

1k+ parts

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10k+ parts

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883

$9.680

-

-

-

Vigor

Singapore . 3,854 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,854

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Kepictronics

USA . 2,000 parts In-Stock

1+ parts

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2,000

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-

-

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Parana Technologies

USA . 1,635 parts In-Stock

1+ parts

-

100+ parts

$1.255

1k+ parts

-

10k+ parts

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1,635

-

$1.255

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Corphita

USA . 344 parts In-Stock

1+ parts

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100+ parts

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344

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Overview

Unlock your project’s potential with the TSH61CD from STMicroelectronics, a leading name in semiconductor innovation. This high-quality operational amplifier ensures exceptional performance in compact designs, making it perfect for signal conditioning and audio applications. With its robust construction and reliable surface mount design, the TSH61CD delivers precise amplification while enhancing efficiency and reducing space constraints, empowering engineers to create cutting-edge solutions with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for more compact designs and facilitates automated assembly, enhancing production efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCBs, making it easier to fit into tight layouts while ensuring effective circuit design.

No. of Terminals: 8

Having 8 terminals offers versatility in connections, allowing for a variety of configurations in circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, providing a compact footprint on the circuit board.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality nickel palladium gold finish enhances reliability and conductivity of connections, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal positioning enables effective routing on the PCB, aiding in better layout flexibility and improved signal paths.

Maximum Seated Height: 1.75 mm

The low profile height of 1.75 mm contributes to minimizing overall device thickness, making it perfect for slim profile applications.

Width: 3.9 mm

A compact width of 3.9 mm allows for high-density designs while accommodating other components on the PCB.

Length: 4.9 mm

The length of 4.9 mm offers a balanced size, ensuring compatibility with a variety of circuit designs without excessive space usage.

Temperature Grade: COMMERCIAL

Rated for commercial temperature grades, this op-amp can operate effectively in various standard environments, making it a versatile choice.

Terminal Form: GULL WING

Gull wing terminals provide excellent support for soldering, ensuring strong connections and reliability in performance under mechanical stress.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it is suitable for a wide range of applications including signal processing, filtering, and amplification, adding to its versatility.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm makes it compatible with standard PCB designs, facilitating integration into existing layouts.

Technical Specifications

Operational Amplifiers (Op Amps) TSH61CD attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TSH61CD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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