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TSH341ID

STMicroelectronics

TSH341ID by STMicroelectronics

TSH341ID by STMicroelectronics is a compact video amplifier designed for industrial applications, featuring a nominal bandwidth of 300 kHz. It operates within -40 °C to 85 °C and supports supply voltages from 3V to 5.5V. Its small outline package ensures efficient surface mounting in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,368 parts In-Stock

1+ parts

-

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2,368

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Digiode

USA . 1,940 parts In-Stock

1+ parts

-

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1k+ parts

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1,940

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Anansix

USA . 351 parts In-Stock

1+ parts

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351

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 163 parts In-Stock

1+ parts

$0.618

100+ parts

-

1k+ parts

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10k+ parts

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163

$0.618

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IDEA Electronic Components Group

UK . 1,220 parts In-Stock

1+ parts

$2.707

100+ parts

-

1k+ parts

$2.436

10k+ parts

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1,220

$2.707

-

$2.436

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MKK Technologies

India . 1,374 parts In-Stock

1+ parts

$5.090

100+ parts

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1,374

$5.090

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DigiPath Technology Company

USA . 1,374 parts In-Stock

1+ parts

$5.090

100+ parts

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1,374

$5.090

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AZTECH Wire

Italy . 873 parts In-Stock

1+ parts

$18.690

100+ parts

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873

$18.690

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Corphita

USA . 3,987 parts In-Stock

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3,987

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Parana Technologies

USA . 2,179 parts In-Stock

1+ parts

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$3.236

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2,179

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$3.236

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Overview

Elevate your audio and video projects with the TSH341ID from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. Designed for seamless performance in industrial applications, this compact video amplifier ensures crystal-clear output while enduring extreme temperatures. Its reliable construction and advanced features deliver unmatched value, enhancing your system's efficiency and performance. Experience the difference with TSH341ID—where quality meets innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making this amplifier suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and ease of integration into modern electronic systems.

Package Shape: RECTANGULAR

The rectangular shape facilitates space-efficient layouts on printed circuit boards, optimizing design and functionality.

General IC Type: VIDEO AMPLIFIER

As a video amplifier, it is specifically designed to enhance video signals, ensuring high-quality video playback for various applications.

No. of Terminals: 8

The 8-terminal configuration provides flexibility in design and connectivity, making it adaptable to numerous electronic applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a compact footprint, ideal for space-constrained designs.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in high-temperature environments and extended operational longevity.

Minimum Operating Temperature: -40 °C

The ability to operate in extremely cold conditions (-40 °C) makes this product robust for outdoor and harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides superior corrosion resistance and excellent conductivity, enhancing reliability and performance.

Terminal Position: DUAL

Dual terminal positions allow for better soldering and connection options, ensuring a stable and reliable operation.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75 mm makes this amplifier suitable for low-profile designs, ensuring versatility in different applications.

Width: 3.9 mm

With a width of 3.9 mm, it supports design flexibility, enabling incorporation into tight spaces on PCBs.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3 V allows compatibility with a wide range of power sources, enhancing versatility.

Maximum Time At Peak Reflow Temperature: 40 s

A peak reflow time of 40 seconds ensures careful handling during manufacturing processes, reducing the risk of damage.

Peak Reflow Temperature: 260 °C

Operating at a peak reflow temperature of 260 °C allows extended exposure to high temperatures during assembly without compromising integrity.

Length: 4.9 mm

A compact length of 4.9 mm contributes to a small overall package size, ideal for modern miniaturized devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in a range of harsh environments, suitable for industrial applications.

Nominal Bandwidth: 300 kHz

A nominal bandwidth of 300 kHz enables the amplifier to effectively handle a variety of video signal frequencies.

Terminal Form: GULL WING

Gull wing terminal forms enhance soldering reliability and provide a strong mechanical connection to the PCB.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for compatibility with a wide range of PCB designs and manufacturing technologies.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V offers flexibility in circuit design, accommodating various power source configurations.

Technical Specifications

Audio & Video Amplifiers TSH341ID attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

300 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

TSH341ID General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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