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TSH341IDT

STMicroelectronics

TSH341IDT by STMicroelectronics

TSH341IDT by STMicroelectronics is a compact video amplifier designed for industrial applications, featuring a nominal bandwidth of 300 kHz. It operates within a temperature range of -40 °C to 85 °C and supports supply voltages from 3V to 5.5V. Its surface mount design ensures efficient integration in audio and video systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,663 parts In-Stock

1+ parts

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4,663

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Vyrian

USA . 4,293 parts In-Stock

1+ parts

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4,293

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Anansix

USA . 1,159 parts In-Stock

1+ parts

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1,159

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,308 parts In-Stock

1+ parts

$0.368

100+ parts

-

1k+ parts

$0.331

10k+ parts

-

1,308

$0.368

-

$0.331

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Microchip USA

USA . 114 parts In-Stock

1+ parts

$0.618

100+ parts

-

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114

$0.618

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MKK Technologies

India . 987 parts In-Stock

1+ parts

$0.692

100+ parts

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987

$0.692

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DigiPath Technology Company

USA . 987 parts In-Stock

1+ parts

$0.692

100+ parts

-

1k+ parts

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987

$0.692

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AZTECH Wire

Italy . 1,165 parts In-Stock

1+ parts

$12.010

100+ parts

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1,165

$12.010

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Vigor

Singapore . 1,811 parts In-Stock

1+ parts

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1,811

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Parana Technologies

USA . 1,702 parts In-Stock

1+ parts

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100+ parts

$0.440

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1,702

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$0.440

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Corphita

USA . 397 parts In-Stock

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397

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Overview

Elevate your audio and video projects with the TSH341IDT from STMicroelectronics, a trusted leader in innovative technology. This robust video amplifier combines exceptional performance with reliability, operating seamlessly in diverse environments from -40 °C to 85 °C. Its compact design and superior thermal management make it ideal for various applications, ensuring crystal-clear signals and enhanced multimedia experiences. Choose quality and precision—choose TSH341IDT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount compatible allows for easy integration into modern PCB designs, saving space and simplifying manufacturing.

Package Shape: RECTANGULAR

The rectangular shape provides a compact footprint which is beneficial for high-density circuit designs.

General IC Type: VIDEO AMPLIFIER

As a video amplifier, it enhances video signal quality, making it ideal for application in audiovisual products.

No. of Terminals: 8

With 8 terminals, it ensures versatility in connectivity options for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces space consumption on PCBs, catering to compact electronic devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance under high-temperature conditions, extending device lifespan.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C allows this product to function in extreme environments, enhancing its applicability.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finishes provide excellent corrosion resistance and electrical conductivity, enhancing reliability.

Terminal Position: DUAL

Dual terminal positioning aids in design flexibility, allowing a variety of layouts for circuit integration.

Maximum Seated Height: 1.75 mm

A low seated height contributes to a compact design, making it easier to integrate into space-constrained applications.

Width: 3.9 mm

The 3.9 mm width allows it to fit into tighter spaces, ideal for modern, sleek device designs.

Minimum Supply Voltage (Vsup): 3 V

A minimum supply voltage of 3V ensures it can operate with lower power supplies, optimizing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

The reflow time compatibility ensures ease of manufacturing while preventing damage to sensitive components.

Peak Reflow Temperature °C: 260

A high peak reflow temperature capability allows for compatibility with advanced soldering processes, ensuring robust assembly.

Length: 4.9 mm

Its compact length supports integration into slim products without sacrificing performance.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, it is suitable for rigorous environments, ensuring reliability in critical applications.

Nominal Bandwidth: 300 kHz

A nominal bandwidth of 300 kHz provides ample signal processing capabilities for high-quality video applications.

Terminal Form: GULL WING

Gull wing terminal form offers excellent soldering characteristics, facilitating reliable connections on the PCB.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch strikes a balance between ease of soldering and compact layout, fitting various PCB designs.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows for compatibility with a range of power sources, providing design flexibility.

Technical Specifications

Audio & Video Amplifiers TSH341IDT attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

300 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

TSH341IDT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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