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TS4962EIKJT

STMicroelectronics

TS4962EIKJT by STMicroelectronics

TS4962EIKJT by STMicroelectronics is a compact audio amplifier with a nominal output power of 3W and operates b/w 2.4V to 5.5V. It features low harmonic distortion at 10% and supports industrial applications with a temp range of -40 °C to 85 °C. Its fine pitch grid array design ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,401 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,401

-

-

-

-

Digiode

USA . 843 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

843

-

-

-

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Anansix

USA . 215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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215

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,113 parts In-Stock

1+ parts

$1.543

100+ parts

-

1k+ parts

$1.389

10k+ parts

-

1,113

$1.543

-

$1.389

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MKK Technologies

India . 1,818 parts In-Stock

1+ parts

$2.901

100+ parts

-

1k+ parts

-

10k+ parts

-

1,818

$2.901

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-

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DigiPath Technology Company

USA . 1,818 parts In-Stock

1+ parts

$2.901

100+ parts

-

1k+ parts

-

10k+ parts

-

1,818

$2.901

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-

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Corphita

USA . 1,837 parts In-Stock

1+ parts

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100+ parts

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1,837

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Parana Technologies

USA . 1,666 parts In-Stock

1+ parts

-

100+ parts

$1.845

1k+ parts

-

10k+ parts

-

1,666

-

$1.845

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Overview

Unlock unparalleled audio performance with STMicroelectronics' TS4962EIKJT amplifier. Designed for versatile applications, this compact and reliable amplifier delivers crystal-clear sound while ensuring low distortion and efficiency. With a robust temperature range and space-saving design, it's perfect for any environment—whether in consumer electronics or industrial settings. Elevate your audio experience and trust in STMicroelectronics’ legacy of innovation and quality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and helps in effective thermal management, making the amplifier suitable for various environments.

Surface Mount: YES

The surface mount feature allows for compact designs, making the amplifier easy to integrate into modern electronics with limited space.

Package Shape: SQUARE

The square package shape facilitates efficient use of board space and ease of positioning in circuits, enhancing overall layout flexibility.

General IC Type: AUDIO AMPLIFIER

Being a dedicated audio amplifier ensures high performance in audio applications, delivering superior sound quality.

Harmonic Distortion: 10%

A harmonic distortion of 10% strikes a balance between sound clarity and overall audio fidelity, making it suitable for consumer audio electronics.

Power Supplies (V): 2.5/5

Dual power supply options provide flexibility in design, allowing for integration into various audio systems with differing voltage requirements.

No. of Terminals: 9

With nine terminals, this amplifier offers sufficient connection options for various configurations, enhancing versatility in circuit design.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine-pitch grid array package style ensures a compact design while maintaining reliable connections, important for modern electronics.

Maximum Operating Temperature: 85 °C

An operating temperature of 85 °C allows the amplifier to function reliably in various environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this amplifier is designed for extreme environments, expanding its range of applications.

Terminal Position: BOTTOM

Bottom terminal positioning promotes better thermal efficiency and aids in maximizing layout space on PCBs.

Nominal Output Power: 3 W

A nominal output power of 3 W is ideal for driving small speakers or actuators, providing adequate sound amplification for portable devices.

Width: 1.6 mm

A width of 1.6 mm enables designs with tighter spaces without compromising performance, allowing for sleek product designs.

Minimum Supply Voltage (Vsup): 2.4 V

The ability to operate at a minimum voltage of 2.4 V enhances compatibility with low-power applications, increasing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

The specified maximum time at peak reflow temperature ensures reliability during soldering processes, reducing the risk of thermal damage.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C allows for compatibility with standard soldering processes, making it suitable for mass production.

Length: 1.6 mm

A compact length of 1.6 mm enables flexible design options, supporting miniaturized electronic products.

Temperature Grade: INDUSTRIAL

Rated for industrial temperatures, this amplifier is built to endure demanding environments, ensuring long-term reliability.

Nominal Bandwidth: 0.02 kHz

A nominal bandwidth of 0.02 kHz allows for high fidelity audio reproduction, making it suitable for quality audio applications.

Terminal Form: BALL

Ball terminal form facilitates easy mounting and ensures robust connections in compact designs, enhancing reliability.

Maximum Supply Current: 3.3 mA

A maximum supply current of 3.3 mA ensures low power consumption, making it ideal for battery-powered devices.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm supports high-density layouts, enabling compact PCB designs without sacrificing performance.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V allows compatibility with a range of power supplies, making it versatile across multiple audio applications.

Technical Specifications

Audio & Video Amplifiers TS4962EIKJT attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

S-PBGA-B9

Length:

1.6 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

3 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA9,3X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

3.3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.4 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1.6 mm

Trade Compliance

TS4962EIKJT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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