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TS4956EKIJT

STMicroelectronics

TS4956EKIJT by STMicroelectronics

TS4956EKIJT by STMicroelectronics is a compact audio amplifier with a nominal output power of 1.06 W and operates b/w -40 °C to 85°C. It features a very thin profile, fine pitch grid array package with 18 terminals. Ideal for industrial audio applications, it supports supply voltages from 2.7 V to 5.5 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,691 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,691

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-

-

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Digiode

USA . 1,642 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,642

-

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-

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Vyrian

USA . 237 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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237

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,916 parts In-Stock

1+ parts

$0.898

100+ parts

-

1k+ parts

$0.808

10k+ parts

-

1,916

$0.898

-

$0.808

-

MKK Technologies

India . 64 parts In-Stock

1+ parts

$1.688

100+ parts

-

1k+ parts

-

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64

$1.688

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DigiPath Technology Company

USA . 64 parts In-Stock

1+ parts

$1.688

100+ parts

-

1k+ parts

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64

$1.688

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-

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Corphita

USA . 4,006 parts In-Stock

1+ parts

-

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4,006

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-

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Parana Technologies

USA . 656 parts In-Stock

1+ parts

-

100+ parts

$1.074

1k+ parts

-

10k+ parts

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656

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$1.074

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Overview

Elevate your audio experience with the TS4956EKIJT from STMicroelectronics, a leader in innovative solutions. This sleek, compact amplifier delivers crystal-clear sound quality while seamlessly fitting into various applications, from consumer electronics to industrial systems. With its robust design and wide temperature range, it ensures reliability and performance you can trust. Choose STMicroelectronics for unparalleled quality and enjoy the benefits of superior audio amplification!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making this amplifier suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easy integration into modern circuit boards, enhancing versatility.

Package Shape: SQUARE

The square package shape optimizes space on the PCB, maximizing layout efficiency.

General IC Type: AUDIO AMPLIFIER

As a dedicated audio amplifier IC, it is specifically designed for high-quality sound reproduction.

No. of Terminals: 18

With 18 terminals, this amplifier allows for multiple connections, facilitating complex audio setups.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style in a very thin profile optimizes performance while minimizing the footprint, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature indicates robust performance in demanding conditions.

Minimum Operating Temperature: -40 °C

The ability to operate in extremely low temperatures expands its usability for industrial applications.

Terminal Position: BOTTOM

Bottom terminal positioning provides a stable connection and efficient heat dissipation.

Nominal Output Power: 1.06 W

A nominal output power of 1.06 W ensures adequate amplification for typical audio applications.

Maximum Seated Height: 0.6 mm

A low seated height enables a sleek design, beneficial for portable and compact devices.

Width: 2.4 mm

The narrow width contributes to the space-saving design and allows for denser PCB layouts.

Minimum Supply Voltage (Vsup): 2.7 V

A low minimum supply voltage makes this amplifier compatible with a wide range of power sources.

Maximum Time At Peak Reflow Temperature: 40 s

The allowance for a maximum reflow time of 40 seconds ensures compatibility with standard manufacturing processes.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature tolerance allows for reliable assembly in high-temperature soldering processes.

Length: 2.5 mm

The compact length further enhances the ability to fit in tight design spaces.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signals suitability for harsh environments, indicating reliability in critical applications.

No. of Channels: 2

Offering two channels allows for stereo sound, enhancing overall audio experience.

Nominal Bandwidth: 0.02 kHz

A nominal bandwidth of 0.02 kHz positions this amplifier well for quality sound reproduction in specific audio ranges.

Terminal Form: BALL

Ball terminal form helps achieve reliable contact and improves solderability during PCB assembly.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V allows flexibility in power applications, accommodating various design requirements.

Technical Specifications

Audio & Video Amplifiers TS4956EKIJT attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

S-PBGA-B18

Length:

2.5 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

1.06 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

2.4 mm

Trade Compliance

TS4956EKIJT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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