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TS4962EIJT

STMicroelectronics

TS4962EIJT by STMicroelectronics

TS4962EIJT by STMicroelectronics is a compact audio amplifier with a nominal output power of 3 W and operates b/w 2.4 V to 5.5 V. It features low harmonic distortion at 10% and supports industrial applications with a temp range of -40 °C to 85 °C. Its fine pitch grid array design ensures efficient surface mounting in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,316 parts In-Stock

1+ parts

-

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2,316

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Anansix

USA . 1,852 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,852

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Vyrian

USA . 72 parts In-Stock

1+ parts

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72

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,385 parts In-Stock

1+ parts

$3.054

100+ parts

-

1k+ parts

$2.749

10k+ parts

-

1,385

$3.054

-

$2.749

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MKK Technologies

India . 1,888 parts In-Stock

1+ parts

$5.744

100+ parts

-

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-

10k+ parts

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1,888

$5.744

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DigiPath Technology Company

USA . 1,888 parts In-Stock

1+ parts

$5.744

100+ parts

-

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10k+ parts

-

1,888

$5.744

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Authorized Procurement Solutions

USA . 264,710 parts In-Stock

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264,710

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A-Z Elektronik GmbH

Germany . 7,454 parts In-Stock

1+ parts

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7,454

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Corphita

USA . 1,316 parts In-Stock

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1,316

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Parana Technologies

USA . 508 parts In-Stock

1+ parts

-

100+ parts

$3.652

1k+ parts

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508

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$3.652

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Overview

Elevate your audio experience with the TS4962EIJT from STMicroelectronics, a trusted leader in innovative technology. This compact and robust audio amplifier delivers exceptional sound quality, making it perfect for everything from consumer electronics to industrial applications. Enjoy superior performance with minimal distortion and wide compatibility, ensuring seamless integration into your projects. With STMicroelectronics' commitment to excellence, you're investing in reliability and cutting-edge audio solutions that truly enhance your listening journey.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and protects the amplifier from environmental conditions.

Surface Mount: YES

The surface mount design allows for easy integration into compact electronic devices, enhancing design flexibility.

Package Shape: SQUARE

A square package design provides efficient use of PCB space and simplifies layout considerations.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio applications, ensuring optimized performance for sound quality and fidelity.

Harmonic Distortion: 10 %

This level of harmonic distortion is suitable for applications requiring decent audio clarity without significant distortion.

Power Supplies (V): 2.5/5

Flexible power supply requirements allow for easier integration and compatibility with various systems.

Number of Terminals: 9

The 9 terminals facilitate multiple connections, allowing for diverse circuit configurations in your design.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array design allows for a high density of connections, which is beneficial for space-constrained applications.

Maximum Operating Temperature: 85 °C

Withstand high temperatures, making it suitable for industrial applications where heat may be a concern.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold conditions ensures reliability in harsh environments.

Terminal Position: BOTTOM

Bottom terminal positioning can aid in improved signal integrity and thermal management.

Nominal Output Power: 3 W

3 Watts of output power is adequate for driving small speakers, making it a suitable choice for portable applications.

Width: 1.6 mm

The compact width allows for integration into tight spaces without compromising performance.

Minimum Supply Voltage (Vsup): 2.4 V

The low minimum supply voltage ensures compatibility with battery-powered devices, enhancing portability.

Maximum Time At Peak Reflow Temperature (s): 40

This specification is important for ensuring reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 250

A high reflow temperature capability ensures compatibility with standard soldering processes used in electronics.

Length: 1.6 mm

Like width, the compact length facilitates high-density layout designs in modern PCBs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates robustness for a wide range of environmental conditions.

Nominal Bandwidth: 0.02 kHz

A low bandwidth can be advantageous in specific audio applications where low-frequency response is critical.

Terminal Form: BALL

Ball terminals provide reliable connections while allowing for a compact form factor.

Maximum Supply Current: 3.3 mA

Low supply current helps in extending battery life in portable devices, increasing efficiency.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for a high density of connections while maintaining a compact size.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage offers versatility in application, allowing it to adapt to various power conditions.

Technical Specifications

Audio & Video Amplifiers TS4962EIJT attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

S-PBGA-B9

Length:

1.6 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

3 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA9,3X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

3.3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.4 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1.6 mm

Trade Compliance

TS4962EIJT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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