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TS487IST

STMicroelectronics

TS487IST by STMicroelectronics

TS487IST by STMicroelectronics is a compact audio amplifier designed for industrial applications, featuring a dual-channel output with 0.108 W power. It operates b/w -40 °C and 85 °C, supporting supply voltages from 2 V to 5.5 V. Its small outline package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,327 parts In-Stock

1+ parts

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8,327

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Digiode

USA . 3,436 parts In-Stock

1+ parts

-

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-

1k+ parts

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3,436

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Anansix

USA . 2,877 parts In-Stock

1+ parts

-

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2,877

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 463 parts In-Stock

1+ parts

$1.030

100+ parts

-

1k+ parts

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463

$1.030

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IDEA Electronic Components Group

UK . 1,810 parts In-Stock

1+ parts

$1.795

100+ parts

-

1k+ parts

$1.615

10k+ parts

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1,810

$1.795

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$1.615

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MKK Technologies

India . 784 parts In-Stock

1+ parts

$3.375

100+ parts

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784

$3.375

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DigiPath Technology Company

USA . 784 parts In-Stock

1+ parts

$3.375

100+ parts

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784

$3.375

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AZTECH Wire

Italy . 855 parts In-Stock

1+ parts

$12.360

100+ parts

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855

$12.360

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Vigor

Singapore . 3,800 parts In-Stock

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3,800

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Corphita

USA . 932 parts In-Stock

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932

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Parana Technologies

USA . 687 parts In-Stock

1+ parts

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100+ parts

$2.146

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687

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$2.146

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Overview

Elevate your audio experience with the TS487IST from STMicroelectronics, a leader in innovation and quality. This compact audio amplifier delivers exceptional performance in various applications, from consumer electronics to industrial devices. With its robust design and wide operating temperature range, you can rely on the TS487IST for consistent, high-quality sound. Discover unparalleled efficiency and reliability that empowers your projects—experience the STMicroelectronics advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures a lightweight and durable design, making the amplifier suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic devices.

Package Shape: SQUARE

The square package shape facilitates easy PCB layout and component placement, improving manufacturing efficiency.

General IC Type: AUDIO AMPLIFIER

Designed specifically for audio applications, this amplifier provides optimized performance for audio signal processing.

Power Supplies (V): 2/5

The ability to operate with different power supply voltages enhances versatility for various system requirements.

No. of Terminals: 8

With 8 terminals, the amplifier can easily accommodate more connections, providing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save space on the PCB, supporting miniaturization in modern electronic designs.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature of 85 °C ensures reliable performance in demanding environments.

Minimum Operating Temperature: -40 °C

The ability to function in extreme cold temperatures (-40 °C) makes this amplifier suitable for outdoor or harsh environments.

Terminal Position: DUAL

Dual terminal positioning allows for simplified connections and improved layout options on the PCB.

Nominal Output Power: 0.108 W

The nominal output power of 0.108 W provides sufficient amplification for small audio devices without excessive power consumption.

Maximum Seated Height: 1.1 mm

A low seated height of 1.1 mm allows for a slim design, making it suitable for space-constrained applications.

Width: 3 mm

Compact width of 3 mm contributes to the overall space efficiency of the product, ideal for portable devices.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage of 2 V allows the amplifier to operate effectively in battery-powered applications.

Length: 3 mm

The 3 mm length supports space-saving designs, enabling integration into smaller devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates reliability and performance in industrial settings or harsh environments.

No. of Channels: 2

With two channels, this amplifier supports stereo sound, enhancing audio experience in applications with dual audio outputs.

Nominal Bandwidth: 0.02 kHz

A nominal bandwidth of 0.02 kHz allows for a broad range of audio signals, ensuring clarity in sound reproduction.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering and electrical connectivity, enhancing reliability in mounting.

Maximum Supply Current: 2.5 mA

The low maximum supply current of 2.5 mA aids in reducing overall power consumption, making it efficient for portable devices.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for dense packing of components on the PCB, optimizing layout without sacrificing performance.

Maximum Supply Voltage (Vsup): 5.5 V

The amplifier supports a maximum supply voltage of 5.5 V, allowing it to be operated with common power supplies.

Technical Specifications

Audio & Video Amplifiers TS487IST attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.108 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

2.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TS487IST General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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