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TS27M4AIDT

STMicroelectronics

TS27M4AIDT by STMicroelectronics

TS27M4AIDT by STMicroelectronics is a micropower operational amplifier with a max input offset voltage of 6500 µV and a nominal voltage of 10 V. It features low bias current (0.3 nA) and operates in automotive applications up to 125 °C. Its compact design supports surface mount technology for efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Lakeland Logistics Inc

USA . 27,500 parts In-Stock

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27,500

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Bristol Electronics

USA . 27,500 parts In-Stock

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27,500

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Vyrian

USA . 5,070 parts In-Stock

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5,070

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Anansix

USA . 2,365 parts In-Stock

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2,365

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Digiode

USA . 1,293 parts In-Stock

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1,293

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,444 parts In-Stock

1+ parts

$5.040

100+ parts

-

1k+ parts

$4.536

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1,444

$5.040

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$4.536

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MKK Technologies

India . 240 parts In-Stock

1+ parts

$9.477

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240

$9.477

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DigiPath Technology Company

USA . 240 parts In-Stock

1+ parts

$9.477

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240

$9.477

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Microchip USA

USA . 108 parts In-Stock

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$16.495

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108

$16.495

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AZTECH Wire

Italy . 596 parts In-Stock

1+ parts

$21.110

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596

$21.110

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A-Z Elektronik GmbH

Germany . 6,674 parts In-Stock

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6,674

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Vigor

Singapore . 4,293 parts In-Stock

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4,293

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Corphita

USA . 2,146 parts In-Stock

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2,146

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Parana Technologies

USA . 1,683 parts In-Stock

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$6.026

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1,683

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$6.026

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Overview

Unlock unparalleled precision and performance with the TS27M4AIDT from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This advanced operational amplifier is designed for versatility across automotive and industrial applications, delivering exceptional low-bias performance and robust thermal stability. Experience meticulous signal integrity and efficiency, ensuring your projects achieve their full potential while benefiting from ST's commitment to quality and reliability. Transform your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors.

Maximum Input Offset Voltage: 6500 uV

A low input offset voltage contributes to better accuracy and precision in signal amplification.

Maximum Average Bias Current (IIB): 0.0003 uA

This ultra-low bias current enhances the efficiency, making it suitable for low-power applications.

Surface Mount: YES

Surface mount technology offers efficient use of space on PCBs, ideal for compact designs.

No. of Functions: 4

Multiple functions in one package provide versatility and reduce the need for additional components.

Package Shape: RECTANGULAR

The rectangular shape is conducive to efficient layout and design on circuit boards.

Nominal Common Mode Reject Ratio: 80 dB

A high common mode reject ratio ensures good rejection of noise and improves signal integrity.

Nominal Supply Voltage / Vsup (V): 10

10V nominal supply voltage strikes a balance between efficiency and performance.

Power Supplies (V): 10

Compatibility with a standard supply voltage simplifies circuit design and reduces complexity.

No. of Terminals: 14

14 terminals allow for more connectivity options and flexibility in circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for space-constrained applications.

Maximum Supply Voltage Limit: 18 V

A high supply voltage limit allows for greater versatility in various applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this Op Amp is suited for high-temperature environments.

Frequency Compensation: YES

Frequency compensation enables stable performance across a wide range of frequencies.

Minimum Voltage Gain: 10000

A minimum voltage gain of 10,000 allows for significant amplification of weak signals.

Minimum Operating Temperature: -40 °C

The operational range down to -40 °C makes this Op Amp suitable for demanding environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish ensures excellent electrical conductivity and resistance to corrosion.

Terminal Position: DUAL

Dual terminal positions facilitate easier and more efficient assembly on circuit boards.

Maximum Seated Height: 1.75 mm

The low seated height allows for compact and low-profile design in electronic applications.

Width: 3.9 mm

A narrow width is advantageous for designs requiring high density and space optimization.

Micropower: YES

Micropower capability enables ultra-low power consumption, ideal for battery-operated devices.

Maximum Time At Peak Reflow Temperature: 40 s

A maximum peak reflow time of 40s ensures optimal soldering performance without damaging components.

Peak Reflow Temperature: 260 °C

The high reflow temperature tolerance contributes to robust manufacturing processes.

Length: 8.65 mm

The compact length is beneficial for high-density layouts and can help minimize trace lengths.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability in harsh conditions.

Low-Bias: YES

Low-bias characteristics enhance performance in precision applications.

Maximum Negative Supply Voltage Limit: 0 V

The zero-volt limit for the negative supply enhances compatibility with single-supply applications.

Nominal Unity Gain Bandwidth: 1000 kHz

A high unity gain bandwidth allows for broad frequency response, making it suitable for various signals.

Technology: CMOS

CMOS technology provides low power consumption while delivering high performance.

Terminal Form: GULL WING

Gull wing terminals improve soldering reliability and facilitate better connections with PCB.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it is versatile and suitable for many analog signal processing applications.

Maximum Supply Current: 1.2 mA

The low supply current specification ensures energy efficiency, especially in battery-powered devices.

Nominal Negative Supply Voltage (Vsup): 0 V

A nominal negative supply of 0 V simplifies designs and reduces the component count.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture is widely recognized for its stability and ease of use in applications.

Packing Method: TAPE AND REEL

Tape and reel packaging allows for automated assembly, enhancing manufacturing efficiency.

Nominal Slew Rate: 0.6 V/us

A nominal slew rate of 0.6 V/us provides adequate responsiveness for many applications.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch offers compatibility with standard PCB designs and simplifies layout.

Technical Specifications

Operational Amplifiers (Op Amps) TS27M4AIDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

10 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

6500 uV

Minimum Voltage Gain:

10000

Nominal Slew Rate:

0.6 V/us

Peak Bias Current:

300 pA

Operational Characteristics

Nominal Supply Voltage:

10 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

1.2 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TS27M4AIDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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