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TS27M2IPT

STMicroelectronics

TS27M2IPT by STMicroelectronics

TS27M2IPT by STMicroelectronics is a micropower operational amplifier with a max input offset voltage of 12 mV and a common mode reject ratio of 80 dB. It operates within -40 °C to 125°C, making it ideal for automotive applications. Its compact design features an 8-terminal surface mount package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,563 parts In-Stock

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Digiode

USA . 2,073 parts In-Stock

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Anansix

USA . 1,928 parts In-Stock

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1,928

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Microchip USA

USA . 400 parts In-Stock

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$3.135

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400

$3.135

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IDEA Electronic Components Group

UK . 1,457 parts In-Stock

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$3.257

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$2.931

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$3.257

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$2.931

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MKK Technologies

India . 1,841 parts In-Stock

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$6.124

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1,841

$6.124

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DigiPath Technology Company

USA . 1,841 parts In-Stock

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$6.124

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$6.124

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AZTECH Wire

Italy . 959 parts In-Stock

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$15.090

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959

$15.090

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A-Z Elektronik GmbH

Germany . 7,332 parts In-Stock

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Vigor

Singapore . 1,823 parts In-Stock

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Corphita

USA . 306 parts In-Stock

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Parana Technologies

USA . 46 parts In-Stock

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$3.894

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Overview

Elevate your designs with the TS27M2IPT from STMicroelectronics, a trusted leader in high-quality semiconductors. This dual operational amplifier boasts unrivaled precision and low power consumption, making it ideal for automotive applications and beyond. With its compact form factor and exceptional performance, you’ll experience enhanced reliability and efficiency in your projects. Choose the TS27M2IPT for superior quality that propels your innovations forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This robust material ensures durability and reliability, making it suitable for various applications, including automotive.

Maximum Input Offset Voltage: 12000 µV

A low input offset voltage is crucial for high-precision applications, enhancing accuracy in signal amplification.

Maximum Average Bias Current (IIB): 0.0003 µA

Low bias current reduces self-heating and improves stability, especially in battery-operated and sensitive circuits.

Surface Mount: YES

Surface mount technology allows for compact designs and easier automated assembly, beneficial for modern PCB layouts.

Number of Functions: 2

This multi-function capability enhances versatility, allowing it to be used in various configurations without needing additional components.

Package Shape: RECTANGULAR

The rectangular shape simplifies layout design, optimizing space on printed circuit boards.

Nominal Common Mode Reject Ratio: 80 dB

A high CMRR indicates strong performance against common noise signals, improving overall circuit integrity.

Nominal Supply Voltage / Vsup (V): 10

A nominal supply voltage of 10V offers flexibility, allowing for compatibility with standard power supply configurations.

Power Supplies (V): 5/10

Supports both 5V and 10V supplies, making it adaptable to a wide range of applications.

Number of Terminals: 8

Eight terminals facilitate a variety of connections, providing design flexibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A compact package style is ideal for space-constrained applications, providing options for miniaturized designs.

Maximum Supply Voltage Limit: 18 V

With a maximum supply voltage limit of 18V, this Op Amp can safely operate in both low and high voltage environments.

Maximum Operating Temperature: 125 °C

Rated for high temperatures, ensuring reliable operation in automotive and other high-temperature applications.

Frequency Compensation: YES

Built-in frequency compensation ensures stability across a range of frequencies, reducing the risk of oscillations.

Minimum Voltage Gain: 10000

High minimum voltage gain allows for significant amplification of weak signals, making it suitable for sensitive applications.

Minimum Operating Temperature: -40 °C

Rated for low temperatures, ensuring functionality in extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish improves solderability and corrosion resistance, enhancing longevity and performance.

Terminal Position: DUAL

Dual terminal positioning is advantageous for circuit layout and connections, simplifying integration into various systems.

Maximum Seated Height: 1.2 mm

Low seated height is beneficial for space-saving designs, allowing for more compact assembly.

Width: 3 mm

Narrow width facilitates integration into tight spaces on PCBs without sacrificing performance.

Micropower: YES

Micropower operation minimizes energy consumption, making it ideal for battery-powered applications.

Length: 4.4 mm

Compact length enhances its suitability for applications where board space is at a premium.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive environments, ensuring reliable performance under demanding conditions.

Low-Bias: YES

Low bias characteristics improve accuracy and efficiency, making it suitable for precision measurements.

Maximum Negative Supply Voltage Limit: 0 V

The zero negative supply voltage makes it versatile for both single-supply and dual-supply applications.

Nominal Unity Gain Bandwidth: 1000 kHz

The high bandwidth supports fast signal processing, ideal for high-frequency applications.

Technology: CMOS

CMOS technology offers high speed and low power consumption, making it ideal for modern electronic designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering, enhancing reliability.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile components widely used in analog circuitry, suitable for various applications.

Maximum Supply Current: 0.3 mA

Low supply current translates to improved power efficiency, ideal for battery-powered devices.

Nominal Negative Supply Voltage (Vsup): 0 V

The specification of 0V for negative supply voltage simplifies power supply requirements for various applications.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture is widely used for stability and versatility in a range of circuit configurations.

Packing Method: TAPE AND REEL

Tape and reel packaging facilitates automated assembly processes, streamlining production.

Nominal Slow Rate: 0.6 V/us

Moderate slew rate supports a balance between speed and stability, making it suitable for diverse signal amplitudes.

Terminal Pitch: 0.65 mm

The 0.65mm pitch allows for higher density layouts, accommodating modern miniaturized electronic applications.

Technical Specifications

Operational Amplifiers (Op Amps) TS27M2IPT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

5/10 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

12000 uV

Minimum Voltage Gain:

10000

Nominal Slew Rate:

0.6 V/us

Peak Bias Current:

300 pA

Operational Characteristics

Nominal Supply Voltage:

10 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

300 μA

Physical Characteristics

Length:

0.173 in (4.4 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.25

Trade Compliance

TS27M2IPT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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