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TS27L4AMDT

STMicroelectronics

TS27L4AMDT by STMicroelectronics

TS27L4AMDT from STMicroelectronics is a CMOS operational amplifier featuring a max input offset voltage of 6500 µV, low bias current of 0.3 nA, and an impressive CMRR of 80 dB. Ideal for military applications, it operates within -55 °C to 125 °C. Its compact design supports surface mounting for efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,386 parts In-Stock

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8,386

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Digiode

USA . 3,669 parts In-Stock

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3,669

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Anansix

USA . 1,687 parts In-Stock

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1,687

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IDEA Electronic Components Group

UK . 1,488 parts In-Stock

1+ parts

$4.415

100+ parts

-

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$3.974

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1,488

$4.415

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$3.974

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Microchip USA

USA . 246 parts In-Stock

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$6.681

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246

$6.681

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Ampacity Inc.

Singapore . 195 parts In-Stock

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$7.410

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195

$7.410

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MKK Technologies

India . 1,684 parts In-Stock

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$8.302

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1,684

$8.302

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DigiPath Technology Company

USA . 1,684 parts In-Stock

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$8.302

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1,684

$8.302

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AZTECH Wire

Italy . 858 parts In-Stock

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$9.080

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858

$9.080

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Corphita

USA . 2,398 parts In-Stock

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2,398

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Parana Technologies

USA . 2,319 parts In-Stock

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$5.279

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2,319

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$5.279

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Vigor

Singapore . 1,710 parts In-Stock

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1,710

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Overview

Experience precision and reliability with the TS27L4AMDT operational amplifier from STMicroelectronics. Renowned for its exceptional quality and innovative technology, STMicroelectronics delivers robust performance in a compact design. This versatile Op Amp is perfect for a wide range of applications, including industrial automation and consumer electronics, providing low bias current and high gain to enhance your designs. Elevate your projects with unmatched efficiency and superior functionality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures lightweight design and durability, making this Op Amp suitable for various applications.

Maximum Input Offset Voltage: 6500 uV

A relatively low input offset voltage improves accuracy in precision applications, crucial for amplification tasks.

Maximum Average Bias Current (IIB): 0.0003 uA

The ultra-low bias current allows for greater accuracy in signal processing, especially beneficial in low-power applications.

Surface Mount: YES

Being surface mount compatible enhances integration on compact circuit boards, fostering efficient space utilization.

No. of Functions: 4

The presence of multiple functions increases versatility, allowing for diverse applications within a single package.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easily accommodates various PCB layouts.

Nominal Common Mode Reject Ratio: 80 dB

A high common mode reject ratio minimizes noise interference, ensuring cleaner signal amplification.

Nominal Supply Voltage / Vsup (V): 10

This standard supply voltage makes it compatible with a wide range of designs and power systems.

Power Supplies (V): 10

A stable power supply specification ensures reliable operation across different applications.

No. of Terminals: 14

With 14 terminals, this Op Amp provides ample interconnections for complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package allows for more compact designs and facilitates automated assembly.

Maximum Supply Voltage Limit: 18 V

The operational versatility over a wider voltage range supports a variety of usage scenarios.

Maximum Operating Temperature: 125 °C

The high operating temperature rating allows for use in demanding environments, enhancing reliability.

Frequency Compensation: YES

Built-in frequency compensation ensures stable operation across frequency ranges, reducing the risk of oscillation.

Minimum Voltage Gain: 40000

A high minimum voltage gain enhances the amplification capability, making it suitable for weak signal applications.

Minimum Operating Temperature: -55 °C

Extreme temperature tolerance enables the Op Amp to function reliably in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This premium terminal finish improves solderability and enhances longevity in electrical connections.

Terminal Position: DUAL

The dual terminal positioning simplifies PCB layout and improves design flexibility.

Maximum Seated Height: 1.75 mm

A low seated height allows for compact designs, minimizing overall product dimensions.

Width: 3.9 mm

A narrow width aids in high-density applications, optimizing space on the printed circuit board.

Micropower: YES

Micropower consumption suggests suitability for battery-powered devices, enhancing power efficiency.

Length: 8.65 mm

The short length contributes to a compact footprint, ideal for space-constrained designs.

Temperature Grade: MILITARY

The military-grade temperature rating signifies reliability and robustness in challenging operational scenarios.

Low-Bias: YES

Low-bias characteristics make it ideal for high-precision applications, reducing measurement errors.

Nominal Unity Gain Bandwidth: 100 kHz

A sufficient unity gain bandwidth allows the Op Amp to handle a wide range of signal frequencies effectively.

Technology: CMOS

CMOS technology contributes to lower power consumption and higher integration capabilities in circuit designs.

Terminal Form: GULL WING

The gull-wing terminal form enhances connection reliability during soldering, improving assembly efficiency.

Amplifier Type: OPERATIONAL AMPLIFIER

As a dedicated operational amplifier, it is highly suitable for various analog applications, including filtering and signal conditioning.

Maximum Supply Current: 0.072 mA

The low supply current consumption indicates energy efficiency, making it suited for battery-operated devices.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture provides versatility in application, supporting various circuit designs.

Packing Method: TAPE AND REEL

The tape and reel packing method allows for efficient automated assembly and mass production.

Nominal Slow Rate: 0.04 V/us

The moderate slew rate makes it useful for many signal applications without excessive distortion.

Terminal Pitch: 1.27 mm

The standard terminal pitch ensures compatibility with a wide range of PCB designs and components.

Technical Specifications

Operational Amplifiers (Op Amps) TS27L4AMDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

10 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

100 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

6500 uV

Minimum Voltage Gain:

40000

Nominal Slew Rate:

0.04 V/us

Peak Bias Current:

300 pA

Operational Characteristics

Nominal Supply Voltage:

10 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

72 μA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TS27L4AMDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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