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TS272AIPT

STMicroelectronics

TS272AIPT by STMicroelectronics

TS272AIPT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 6500 µV and low bias current of 0.3 nA. It operates within -40 °C to 125 °C, making it ideal for automotive applications. Its compact design supports surface mounting for efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 11,720 parts In-Stock

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11,720

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Vyrian

USA . 4,145 parts In-Stock

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4,145

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ComSIT USA

USA . 4,000 parts In-Stock

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4,000

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Digiode

USA . 2,150 parts In-Stock

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2,150

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Anansix

USA . 1,442 parts In-Stock

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1,442

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 443 parts In-Stock

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$2.146

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443

$2.146

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IDEA Electronic Components Group

UK . 1,811 parts In-Stock

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$2.260

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-

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$2.034

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1,811

$2.260

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$2.034

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MKK Technologies

India . 707 parts In-Stock

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$4.249

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707

$4.249

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DigiPath Technology Company

USA . 707 parts In-Stock

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$4.249

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707

$4.249

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AZTECH Wire

Italy . 1,079 parts In-Stock

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$15.560

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1,079

$15.560

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A-Z Elektronik GmbH

Germany . 4,790 parts In-Stock

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4,790

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Corphita

USA . 4,014 parts In-Stock

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4,014

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Kepictronics

USA . 3,384 parts In-Stock

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3,384

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Vigor

Singapore . 2,285 parts In-Stock

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2,285

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Parana Technologies

USA . 470 parts In-Stock

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$2.702

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470

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$2.702

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Overview

Unlock unparalleled performance with the TS272AIPT from STMicroelectronics, a leader in cutting-edge technology. This dual operational amplifier blends exceptional precision and low power consumption, making it ideal for automotive and industrial applications. With its compact design and robust temperature range, it ensures reliability and efficiency in every project. Elevate your designs today with a product that promises quality, versatility, and unmatched value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making it suitable for various applications.

Maximum Input Offset Voltage: 6500 uV

With a maximum input offset voltage of 6500 uV, this op-amp ensures precision in low signal applications, minimizing error in signal amplification.

Maximum Average Bias Current (IIB): 0.0003 uA

A low average bias current ensures minimal effect on the circuit performance, making it ideal for high-impedance applications.

Surface Mount: YES

Being surface mountable allows for compact PCB designs and automated manufacturing processes, reducing assembly time and costs.

No. of Functions: 2

The dual function capability increases design flexibility, allowing for more complex circuit configurations.

Package Shape: RECTANGULAR

The rectangular shape is beneficial for space-efficient PCB layout, optimizing the use of board real estate.

Nominal Common Mode Reject Ratio: 80 dB

An 80 dB common mode rejection ratio indicates excellent noise rejection capabilities, ensuring signal integrity in noisy environments.

Nominal Supply Voltage / Vsup (V): 10

A nominal supply voltage of 10 V provides sufficient headroom for many applications, balancing performance and power consumption.

Power Supplies (V): 10

The compatibility with standard 10 V power supplies enhances its usability in various electronic systems.

No. of Terminals: 8

With eight terminals, this op-amp provides flexible connection options for versatile circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A small outline and thin profile ensure easy integration into compact designs, making it suited for space-constrained applications.

Maximum Supply Voltage Limit: 18 V

An 18 V maximum supply voltage limit allows this op-amp to be used in higher voltage applications without compromising performance.

Maximum Operating Temperature: 125 °C

Operating at high temperatures (up to 125 °C) ensures reliability in demanding environments, especially in automotive applications.

Frequency Compensation: YES

In-built frequency compensation facilitates stable operation across a wide frequency range, enhancing performance in various applications.

Minimum Voltage Gain: 6000

A minimum voltage gain of 6000 provides significant amplification, making it suitable for low-level signal processing.

Minimum Operating Temperature: -40 °C

Minimum operating temperature of -40 °C ensures reliable performance in extreme conditions, particularly in automotive and industrial settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances connectivity and durability, providing reliable performance over time.

Terminal Position: DUAL

Dual terminal positioning allows for efficient layout and integration into complex PCBs while maintaining low parasitic capacitance.

Maximum Seated Height: 1.2 mm

A low seated height is advantageous for compact designs, fitting easily into space-constrained applications.

Width: 3 mm

The 3 mm width is ideal for modern, compact circuit designs where space is a premium.

Length: 4.4 mm

The length complements the compact dimensions, allowing for efficient use of space on printed circuit boards.

Temperature Grade: AUTOMOTIVE

Being rated for automotive use assures high reliability and durability, meeting the stringent requirements of automotive applications.

Low-Bias: YES

The low-bias characteristic enhances the performance of the op-amp in precision applications, reducing error rates.

Maximum Negative Supply Voltage Limit: 0 V

A limit of 0 V on the negative supply voltage simplifies power supply design, making it easier to integrate with existing systems.

Nominal Negative Supply Voltage (Vsup): 0 V

Operating with a nominal 0 V negative supply allows for single-supply operation, simplifying the power management in designs.

Nominal Unity Gain Bandwidth: 3500 kHz

A unity gain bandwidth of 3500 kHz provides sufficient bandwidth for high-frequency applications, ensuring enhanced performance.

Technology: CMOS

CMOS technology offers low power consumption and high density, making it suitable for battery-operated devices and compact designs.

Terminal Form: GULL WING

Gull wing terminals facilitate efficient surface mounting and ensure strong mechanical and electrical connections.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier signifies versatility in applications, from signal conditioning to filtering and amplification.

Maximum Supply Current: 3.4 mA

A maximum supply current of 3.4 mA ensures low power consumption, making it ideal for energy-efficient designs.

Packing Method: TAPE AND REEL

Packed in tape and reel format, this product is optimized for automated assembly, ensuring efficiency during production.

Nominal Slow Rate: 5.5 V/us

A nominal slow rate of 5.5 V/us indicates the device can handle moderate speed applications, maintaining stability in dynamic environments.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for compact layout designs while ensuring ease of soldering and connection.

Technical Specifications

Operational Amplifiers (Op Amps) TS272AIPT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

10 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

3.5 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

6500 uV

Minimum Voltage Gain:

6000

Nominal Slew Rate:

5.5 V/us

Peak Bias Current:

300 pA

Operational Characteristics

Nominal Supply Voltage:

10 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

3.4 mA

Physical Characteristics

Length:

0.173 in (4.4 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.25

Trade Compliance

TS272AIPT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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