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TDA7473A

STMicroelectronics

TDA7473A by STMicroelectronics

TDA7473A by STMicroelectronics is a versatile motion control IC designed for disk drive motor applications. It operates within a supply voltage range of 6-15 V, features 4 functions, and supports temperatures from -25 °C to 80°C. Its compact SO package (28 terminals) ensures efficient integration in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 16,800 parts In-Stock

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16,800

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Vyrian

USA . 11,653 parts In-Stock

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11,653

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Digiode

USA . 2,566 parts In-Stock

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2,566

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Anansix

USA . 1,483 parts In-Stock

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1,483

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LIBRA Elektronik GmbH

Germany . 56 parts In-Stock

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56

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Distributors (Availability)

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AZTECH Wire

Italy . 595 parts In-Stock

1+ parts

$13.360

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595

$13.360

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IDEA Electronic Components Group

UK . 1,380 parts In-Stock

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$22.784

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-

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$20.505

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1,380

$22.784

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$20.505

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MKK Technologies

India . 1,188 parts In-Stock

1+ parts

$42.843

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1,188

$42.843

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DigiPath Technology Company

USA . 1,188 parts In-Stock

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$42.843

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1,188

$42.843

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Microchip USA

USA . 5,519 parts In-Stock

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5,519

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Kepictronics

USA . 5,350 parts In-Stock

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5,350

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A-Z Elektronik GmbH

Germany . 2,760 parts In-Stock

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2,760

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Corphita

USA . 1,422 parts In-Stock

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1,422

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Assy Fe

Spain . 1,059 parts In-Stock

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1,059

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Parana Technologies

USA . 654 parts In-Stock

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$27.242

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654

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$27.242

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Authorized Procurement Solutions

USA . 580 parts In-Stock

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580

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Overview

Unlock precision and reliability in your motion control applications with the TDA7473A from STMicroelectronics. This robust IC offers exceptional performance, ensuring seamless operation in various environments, thanks to its wide temperature tolerance and compact design. With a rich history of innovation and quality, STMicroelectronics empowers your projects, providing unmatched value, energy efficiency, and ease of integration that drive success in today’s technology landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing durable plastic/epoxy material ensures the robustness and longevity of the device in harsh environments.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient space usage on printed circuit boards.

No. of Functions: 4

With four functions in a single IC, this product enhances versatility and reduces the need for multiple components.

Package Shape: RECTANGULAR

The rectangular shape facilitates straightforward placement and efficient use of board space.

Nominal Supply Voltage (Vsup): 6 V

A nominal supply voltage of 6 V makes this IC compatible with a wide range of low-voltage systems.

No. of Terminals: 28

An ample number of terminals (28) enables various connections, accommodating complex functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style supports high-density layouts, ideal for modern compact devices.

Maximum Operating Temperature: 80 °C

Operating up to 80 °C ensures reliability in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -25 °C

The ability to function at -25 °C expands the usability in cold environments, making it versatile for various applications.

Terminal Position: DUAL

Dual terminal positioning enhances the ease of handling and improves soldering efficiency during assembly.

Maximum Seated Height: 2.65 mm

A low seated height of 2.65 mm is advantageous for thin device designs, promoting innovation in compact electronics.

Width: 7.5 mm

A width of 7.5 mm contributes to a slim profile, effectively supporting high-density circuit designs.

Other IC Type: DISK DRIVE MOTOR CONTROLLER

As a disk drive motor controller, this IC is optimized for precision operations in data storage systems.

Minimum Supply Voltage (Vsup): 6 V

The minimum supply voltage of 6 V maintains compatibility with a variety of power supply systems.

Length: 17.9 mm

A length of 17.9 mm helps maintain compact design layouts, ideal for modern electronics.

Temperature Grade: COMMERCIAL EXTENDED

Rated for commercial extended temperature, this IC offers reliable performance in a broader temperature range.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability, ensuring strong electrical connections and ease of assembly.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for efficient routing on a PCB, supporting high-density layouts.

Maximum Supply Voltage (Vsup): 15 V

A maximum supply voltage of 15 V provides flexibility for use in varied applications that demand higher power.

Technical Specifications

Motion Control ICs TDA7473A attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Functions:

4

No. of Terminals:

28

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

TDA7473A Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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