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TDA7073AT/N4,112

NXP Semiconductors

TDA7073AT/N4,112 by NXP Semiconductors

TDA7073AT/N4,112 by NXP Semiconductors is a Motion Control IC with 2 functions, operating at 5V. It comes in a small outline package with 16 terminals and supports supply voltages from 3V to 18V. Ideal for disk drive motor controllers due to its max output current of 1A.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 3,581 parts In-Stock

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Digiode

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Anansix

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Nova Conductors

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Microchip USA

USA . 228 parts In-Stock

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$0.938

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One Stop Electronics

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Ampacity Inc.

Singapore . 250 parts In-Stock

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AZTECH Wire

Italy . 818 parts In-Stock

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Continental Prestige Electronics

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Overview

Enhance your motion control applications with the TDA7073AT/N4,112 by NXP Semiconductors. This top-tier manufacturer delivers high-quality ICs that guarantee reliability and superior performance. Designed for disk drive motor controllers, this product offers dual terminal positions and a maximum output current of 1A, making it perfect for a wide range of electronic devices. Experience seamless operation and efficiency with this compact and powerful solution. Upgrade your projects today with the TDA7073AT/N4,112.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight construction for the IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

Operates at a standard voltage level, making it compatible with a wide range of systems and power sources.

Power Supplies (V): 5

Offers multiple power supply options, providing flexibility in powering the IC according to system requirements.

No. of Terminals: 16

Provides sufficient connections for interfacing with other components and peripherals in the circuit.

Maximum Output Current: 1 A

Delivers a high output current capability, making it suitable for driving motors and other high-power devices.

Technical Specifications

Motion Control ICs TDA7073AT/N4,112 attributes and parameters. Explore more Motion Control ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

16 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

TDA7073AT/N4,112 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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