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TDA7274D013TR

STMicroelectronics

TDA7274D013TR by STMicroelectronics

TDA7274D013TR by STMicroelectronics is a compact brush DC motor controller designed for efficient motion control. It operates b/w 1.8V and 6V, features an 8-terminal gull-wing package, and has a max height of 1.75mm. Ideal for space-constrained applications in robotics and automation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 721 parts In-Stock

1+ parts

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721

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Anansix

USA . 515 parts In-Stock

1+ parts

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515

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Vyrian

USA . 179 parts In-Stock

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179

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,498 parts In-Stock

1+ parts

$10.611

100+ parts

-

1k+ parts

$9.550

10k+ parts

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1,498

$10.611

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$9.550

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MKK Technologies

India . 230 parts In-Stock

1+ parts

$19.954

100+ parts

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230

$19.954

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DigiPath Technology Company

USA . 230 parts In-Stock

1+ parts

$19.954

100+ parts

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230

$19.954

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Parana Technologies

USA . 2,333 parts In-Stock

1+ parts

-

100+ parts

$12.687

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2,333

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$12.687

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Corphita

USA . 238 parts In-Stock

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238

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Overview

Elevate your motion control projects with the TDA7274D013TR from STMicroelectronics, a trusted leader in semiconductor solutions. This compact and efficient brush DC motor controller is designed for superior performance in various applications, from robotics to consumer electronics. With its robust build and flexible voltage range, it ensures reliable operation and longevity. Experience enhanced precision and control while benefiting from STMicroelectronics' commitment to quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and protection against environmental factors, making this IC reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient assembly, making this IC suitable for modern electronics with space constraints.

Package Shape: RECTANGULAR

The rectangular shape aids in space optimization on PCBs, allowing for easier integration into tight layouts.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal voltage of 3V ensures compatibility with low-power applications, enhancing battery life in portable devices.

No. of Terminals: 8

With 8 terminals, this IC offers enough I/O capabilities for various control functions while maintaining simplicity in design.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to reduced board space usage, making it ideal for compact devices.

Terminal Position: DUAL

The dual terminal position enhances the layout flexibility on PCBs, facilitating easier routing and integration.

Maximum Seated Height: 1.75 mm

A low seated height allows for a slim profile, ideal for applications where height restrictions are a concern.

Width: 3.9 mm

A narrow width aids in saving space on the circuit board, accommodating dense designs without compromising performance.

Other IC type: BRUSH DC MOTOR CONTROLLER

As a brush DC motor controller, this IC is specialized for efficient motor control, making it an excellent choice for robotics and automation.

Minimum Supply Voltage (Vsup): 1.8 V

The ability to operate at a minimum of 1.8V allows the IC to function effectively in low-power settings, further extending battery life.

Length: 4.9 mm

Compact length contributes to the overall small footprint of the product, fitting seamlessly into tight spaces.

Terminal Form: GULL WING

Gull wing terminal form ensures reliable soldering and enhances the mechanical stability of the IC on printed circuit boards.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for standard soldering practices and flexibility in design, ensuring compatibility with various PCB layouts.

Maximum Supply Voltage (Vsup): 6 V

Support for a maximum supply voltage of 6V provides versatility in usage across different applications, accommodating a range of performance requirements.

Technical Specifications

Motion Control ICs TDA7274D013TR attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TDA7274D013TR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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