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TDA7274D

STMicroelectronics

TDA7274D by STMicroelectronics

TDA7274D by STMicroelectronics is a compact brush DC motor controller designed for efficient motion control. It operates b/w 1.8V and 6V, features an 8-terminal dual layout, and has a small outline package measuring 4.9mm x 3.9mm. Ideal for robotics and automation applications, it ensures reliable performance in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,281 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,281

-

-

-

-

Digiode

USA . 1,936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,936

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-

-

-

Anansix

USA . 1,782 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,782

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,883 parts In-Stock

1+ parts

$6.102

100+ parts

-

1k+ parts

$5.492

10k+ parts

-

1,883

$6.102

-

$5.492

-

MKK Technologies

India . 1,106 parts In-Stock

1+ parts

$11.475

100+ parts

-

1k+ parts

-

10k+ parts

-

1,106

$11.475

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-

-

DigiPath Technology Company

USA . 1,106 parts In-Stock

1+ parts

$11.475

100+ parts

-

1k+ parts

-

10k+ parts

-

1,106

$11.475

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-

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Parana Technologies

USA . 2,218 parts In-Stock

1+ parts

-

100+ parts

$7.296

1k+ parts

-

10k+ parts

-

2,218

-

$7.296

-

-

Corphita

USA . 1,925 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,925

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Overview

Elevate your motion control projects with the TDA7274D from STMicroelectronics, a leader in innovative solutions. This versatile brush DC motor controller ensures seamless operation with minimal power consumption, making it perfect for robotics, automation, and consumer electronics. With its compact design and reliable performance, the TDA7274D not only streamlines your designs but also enhances efficiency, delivering exceptional value to engineers and manufacturers alike.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body offers durability and protection, making it suitable for a variety of applications.

Surface Mount: YES

Being surface mount allows for efficient space utilization on PCB, enabling compact designs in modern electronics.

Package Shape: RECTANGULAR

The rectangular shape facilitates straightforward PCB layout and integration, improving assembly efficiency.

Nominal Supply Voltage (Vsup): 3 V

A nominal supply voltage of 3V is standard for low-power applications, enhancing energy efficiency.

No. of Terminals: 8

With 8 terminals, this IC provides sufficient connectivity for control and feedback mechanisms in motor control applications.

Package Style (Meter): SMALL OUTLINE

Small outline packages minimize footprint, making them ideal for applications where space is at a premium.

Terminal Position: DUAL

Dual terminal positioning aids in versatile placement options on PCBs, enhancing design flexibility.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm allows for low-profile designs, contributing to sleeker end products.

Width: 3.9 mm

At 3.9 mm wide, this IC is compact, making it suitable for tight layouts in consumer electronics.

Other IC type: BRUSH DC MOTOR CONTROLLER

Designed specifically for brush DC motor control, it provides efficient and reliable motor drive solutions.

Minimum Supply Voltage (Vsup): 1.8 V

A minimum supply voltage of 1.8V supports a wide range of low-voltage applications, enhancing compatibility.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C ensures compatibility with modern manufacturing processes, ensuring robust assembly.

Length: 4.9 mm

With a length of 4.9 mm, this IC maintains a space-efficient design for integration into compact products.

Terminal Form: GULL WING

Gull-wing terminal form provides excellent solder joint reliability, enhancing the bonding strength on PCBs.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for dense packing of components without compromising soldering ease.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, ensuring appropriate handling and storage precautions are easy to manage.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6V enables versatility in power supply choices, making it suitable for various applications.

Technical Specifications

Motion Control ICs TDA7274D attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3/e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TDA7274D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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