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TD350ID

STMicroelectronics

TD350ID by STMicroelectronics

TD350ID by STMicroelectronics is a high-performance MOSFET gate driver designed for automotive applications. It operates b/w -40 °C to 125 °C, supports supply voltages from 9V to 26V, and delivers a peak output current of 1.5A. Its compact SOIC-14 package ensures efficient surface mounting in space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,691 parts In-Stock

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3,691

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Anansix

USA . 1,373 parts In-Stock

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1,373

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Digiode

USA . 705 parts In-Stock

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705

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Odi Ramu Company

Canada . 316 parts In-Stock

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316

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First Choice Components Inc.

USA . 23 parts In-Stock

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23

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Manotoh

Italy . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 416 parts In-Stock

1+ parts

$2.973

100+ parts

-

1k+ parts

$2.676

10k+ parts

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416

$2.973

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$2.676

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MKK Technologies

India . 2,285 parts In-Stock

1+ parts

$5.591

100+ parts

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2,285

$5.591

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DigiPath Technology Company

USA . 2,285 parts In-Stock

1+ parts

$5.591

100+ parts

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2,285

$5.591

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Microchip USA

USA . 362 parts In-Stock

1+ parts

$6.851

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362

$6.851

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AZTECH Wire

Italy . 923 parts In-Stock

1+ parts

$12.210

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923

$12.210

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Perfect Parts

USA . 16,800 parts In-Stock

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16,800

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Corphita

USA . 3,384 parts In-Stock

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3,384

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Parana Technologies

USA . 371 parts In-Stock

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$3.555

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371

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$3.555

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Overview

Unlock unmatched performance with the TD350ID from STMicroelectronics—your reliable partner in MOSFET gate driving. Designed for robust automotive applications, this high-quality driver delivers superior efficiency and reliability in demanding environments. STMicroelectronics is renowned for innovation and excellence, ensuring you benefit from cutting-edge technology while enjoying enhanced thermal management and compact design. Elevate your projects with the TD350ID, where quality meets versatility!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers excellent durability and protection, making the device suitable for various environmental conditions.

Surface Mount: YES

The surface mount capability allows for efficient use of space on the PCB, facilitating compact designs.

Maximum Supply Voltage: 26 V

With a maximum supply voltage of 26 V, this driver can handle a wide range of applications requiring higher voltage levels.

Package Shape: RECTANGULAR

The rectangular package shape promotes ease of layout and integration into various circuit designs.

Power Supplies (V): -10, 16

Supports a dual supply voltage, allowing for versatile power configurations in different applications.

No. of Terminals: 14

Fourteen terminals provide ample connectivity options for flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact and high-density layouts, which are ideal for space-constrained applications.

Minimum Supply Voltage: 9 V

The low minimum supply voltage ensures compatibility with a variety of low-voltage applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows this driver to function reliably in demanding thermal environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this driver suitable for automotive and harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish enhances solderability and reliability, ensuring long-term performance of the device.

Terminal Position: DUAL

Dual terminal positions facilitate easier implementation in PCB designs, enhancing overall layout flexibility.

Maximum Seated Height: 1.75 mm

The low seated height contributes to a slim profile, further aiding in space-efficient designs.

Width: 3.9 mm

A narrow width allows for high-density placement of components and efficient use of PCB real estate.

High Side Driver: YES

As a high-side driver, it adds versatility to driving configurations, essential for many advanced control applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature rating ensures compatibility with standard reflow soldering processes used in PCB assembly.

Length: 8.65 mm

The compact length aids in achieving smaller overall circuit sizes, making it ideal for modern electronic designs.

Temperature Grade: AUTOMOTIVE

With automotive-grade specifications, this product is designed to endure rigorous conditions prevalent in automotive applications.

Technology: BICMOS

BICMOS technology combines high speed and low power consumption, making this driver highly efficient in its operation.

Terminal Form: GULL WING

Gull wing terminal form ensures easy soldering and mechanical stability, supporting reliable connections on the PCB.

Nominal Supply Voltage: 16 V

The nominal supply voltage of 16 V is optimal for a wide array of applications, ensuring stable operation under various loads.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is suitable for most PCB layouts, allowing for ease of manufacturing and assembly.

Nominal Output Peak Current Limit: 1.5 A

The nominal output peak current limit of 1.5 A provides sufficient drive capability for powering most MOSFETs and IGBTs.

Interface IC Type: HALF BRIDGE BASED IGBT/MOSFET DRIVER

This half bridge driver type offers enhanced efficiency and control for switched-mode power applications.

Technical Specifications

MOSFET Gate Drivers TD350ID attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-10,16

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

9 V

Nominal Supply Voltage:

16 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TD350ID Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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