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T830-400W

STMicroelectronics

T830-400W by STMicroelectronics

STMicroelectronics T830-400W is a single TRIAC with 8A RMS on-state current, 400V repetitive peak off-state voltage, and 30mA max DC gate trigger current. Ideal for snubberless applications in temperature range -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,609 parts In-Stock

1+ parts

-

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4,609

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Digiode

USA . 4,130 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,130

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Anansix

USA . 1,314 parts In-Stock

1+ parts

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100+ parts

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1,314

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 25 parts In-Stock

1+ parts

$3.088

100+ parts

-

1k+ parts

$2.780

10k+ parts

-

25

$3.088

-

$2.780

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MKK Technologies

India . 360 parts In-Stock

1+ parts

$5.808

100+ parts

-

1k+ parts

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10k+ parts

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360

$5.808

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DigiPath Technology Company

USA . 360 parts In-Stock

1+ parts

$5.808

100+ parts

-

1k+ parts

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360

$5.808

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-

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Corphita

USA . 2,986 parts In-Stock

1+ parts

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2,986

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Parana Technologies

USA . 302 parts In-Stock

1+ parts

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100+ parts

$3.693

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302

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$3.693

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Overview

Upgrade your electronics with the T830-400W by STMicroelectronics, a top-quality triode for alternating current (TRIAC) that offers exceptional performance and reliability. Manufactured by industry leader STMicroelectronics, this product is designed to meet the highest standards of excellence. With versatile applications in various electronic devices, the T830-400W boasts a range of benefits such as efficient operation, low leakage current, and a wide operating temperature range. Trust STMicroelectronics to deliver cutting-edge technology that enhances the functionality and longevity of your devices. Upgrade to the T830-400W today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Offers durability and protection for the internal components of the TRIAC, ensuring a longer lifespan.

Maximum DC Gate Trigger Current: 30 mA

Provides a suitable level of gate trigger current for efficient switching operations.

Configuration: SINGLE

Simplified design with a single configuration for ease of use.

Package Shape: RECTANGULAR

Compact and space-saving design for easy integration into various systems.

Terminal Form: THROUGH-HOLE

Convenient terminal form for secure and reliable connections.

Maximum Leakage Current: 0.01 mA

Low leakage current ensures minimal power loss and energy efficiency.

No. of Terminals: 3

Simplified setup with only 3 terminals for connections.

Package Style (Meter): FLANGE MOUNT

Allows for easy mounting and installation in various applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range for versatile usage in different environments.

Trigger Device Type: SNUBBERLESS TRIAC

Improved performance with snubberless design for reduced electromagnetic interference.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperatures without performance degradation.

Terminal Finish: MATTE TIN

Durable terminal finish for reliable connections and longevity.

Terminal Position: SINGLE

Simplified design with a single terminal position for easy installation.

Maximum RMS On-state Current: 8 A

High on-state current capacity for handling heavy loads efficiently.

Maximum DC Gate Trigger Voltage: 1.5 V

Low gate trigger voltage for efficient switching operations and reduced power consumption.

Case Connection: ISOLATED

Isolated case connection for enhanced safety and protection against electrical hazards.

Repetitive Peak Off-state Voltage: 400 V

Suitable off-state voltage rating for reliable performance and protection.

Minimum Critical Rate of Rise of Commutation Voltage: 20 V/us

Fast critical rate of rise of commutation voltage for efficient switching.

Minimum Critical Rate of Rise of Off-state Voltage: 300 V/us

High rate of rise of off-state voltage for effective switching and performance.

Maximum Holding Current: 50 mA

Sufficient holding current capacity to maintain the ON state reliably.

Reference Standard: UL RECOGNIZED

Compliance with UL standards for safety and quality assurance.

Technical Specifications

Triode For Alternating Current (TRIAC) T830-400W attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

20 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

300 V/us

Maximum DC Gate Trigger Current:

30 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

50 mA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.01 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Reference Standard:

UL RECOGNIZED

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T830-400W Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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