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T830-600W

STMicroelectronics

T830-600W by STMicroelectronics

STMicroelectronics T830-600W is a single TRIAC with 8A RMS on-state current and 600V repetitive peak off-state voltage. Ideal for snubberless applications, it has a max DC gate trigger current of 30mA. This device operates in temperatures ranging from -40 to 125 °C, making it suitable for various industrial and consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,341 parts In-Stock

1+ parts

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4,341

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Vyrian

USA . 3,359 parts In-Stock

1+ parts

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3,359

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Anansix

USA . 858 parts In-Stock

1+ parts

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858

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,947 parts In-Stock

1+ parts

$2.804

100+ parts

-

1k+ parts

$2.524

10k+ parts

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1,947

$2.804

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$2.524

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MKK Technologies

India . 1,472 parts In-Stock

1+ parts

$5.273

100+ parts

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1,472

$5.273

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DigiPath Technology Company

USA . 1,472 parts In-Stock

1+ parts

$5.273

100+ parts

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1,472

$5.273

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Corphita

USA . 2,528 parts In-Stock

1+ parts

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2,528

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Parana Technologies

USA . 1,014 parts In-Stock

1+ parts

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100+ parts

$3.353

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1,014

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$3.353

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Assy Fe

Spain . 8 parts In-Stock

1+ parts

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8

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Overview

Upgrade your electronics with the T830-600W TRIAC by STMicroelectronics. Known for their high-quality components, STMicroelectronics offers a reliable and efficient product that is perfect for a wide range of applications. With a maximum RMS On-state Current of 8A and Repetitive Peak Off-state Voltage of 600V, this TRIAC is designed to deliver exceptional performance. Whether you are looking to control power in lighting systems or motor speed controls, the T830-600W provides the value and benefits you need for your projects. Experience the advantages of using STMicroelectronics products and elevate your electronic designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and ensures durability of the product.

Maximum DC Gate Trigger Current: 30 mA

Allows for precise control of the triac, making it suitable for a variety of applications.

Configuration: SINGLE

Simplified design and easy to use for single phase applications.

Package Shape: RECTANGULAR

Compact design for easy mounting and installation in tight spaces.

Terminal Form: THROUGH-HOLE

Facilitates easy soldering and connections, making installation convenient.

Maximum Leakage Current: 0.01 mA

Ensures minimal power loss and efficient operation of the triac.

No. of Terminals: 3

Simplified connection setup with minimal wiring required.

Package Style (Meter): FLANGE MOUNT

Allows for secure mounting and stable operation of the triac.

Maximum Operating Temperature: 125 °C

Suitable for a wide range of operating environments without compromising performance.

Trigger Device Type: SNUBBERLESS TRIAC

Provides improved reliability and efficiency in switching applications.

Minimum Operating Temperature: -40 °C

Operational in extreme cold conditions, making it versatile for various environments.

Terminal Finish: MATTE TIN

Ensures good conductivity and solderability for reliable connections.

Terminal Position: SINGLE

Simplified design for ease of installation and connection.

Maximum RMS On-state Current: 8 A

Can handle high current loads with ease, suitable for different applications.

Maximum DC Gate Trigger Voltage: 1.5 V

Efficient triggering mechanism for precise control and operation of the triac.

Case Connection: ISOLATED

Enhances safety by isolating the case from the circuit, reducing the risk of electrical shock.

Repetitive Peak Off-state Voltage: 600 V

Capable of withstanding high voltage spikes, ensuring reliability in various applications.

Minimum Critical Rate of Rise of Commutation Voltage: 20 V/us

Provides fast commutation for efficient switching operations in high power applications.

Minimum Critical Rate of Rise of Off-state Voltage: 300 V/us

Ensures quick response time for turning off the triac, enhancing safety and efficiency.

Maximum Holding Current: 50 mA

Provides a wide margin of safety for continuous operation without triggering unintentionally.

Reference Standard: UL RECOGNIZED

Complies with safety and quality standards, ensuring reliable performance and peace of mind.

Technical Specifications

Triode For Alternating Current (TRIAC) T830-600W attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

20 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

300 V/us

Maximum DC Gate Trigger Current:

30 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

50 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.01 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Reference Standard:

UL RECOGNIZED

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T830-600W Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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