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T1650H-6G-TR

STMicroelectronics

T1650H-6G-TR by STMicroelectronics

T1650H-6G-TR by STMicroelectronics is a snubberless TRIAC designed for efficient AC control. It features a max RMS on-state current of 16 A, operates from -40 °C to 150°C, and supports surface mount applications. Ideal for lighting and motor control systems.

Median Price

$0.741

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 42,000 parts In-Stock

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42,000

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Vyrian

USA . 2,253 parts In-Stock

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-

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2,253

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Anansix

USA . 968 parts In-Stock

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968

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IBS Electronics

USA . 300 parts In-Stock

1+ parts

-

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$0.741

1k+ parts

$0.702

10k+ parts

$0.669

300

-

$0.741

$0.702

$0.669

Digiode

USA . 187 parts In-Stock

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187

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IDEA Electronic Components Group

UK . 1,458 parts In-Stock

1+ parts

$3.788

100+ parts

-

1k+ parts

$3.409

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-

1,458

$3.788

-

$3.409

-

Microchip USA

USA . 7,325 parts In-Stock

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$4.426

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-

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7,325

$4.426

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MKK Technologies

India . 358 parts In-Stock

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$7.122

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358

$7.122

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DigiPath Technology Company

USA . 358 parts In-Stock

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$7.122

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358

$7.122

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AZTECH Wire

Italy . 54 parts In-Stock

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$19.420

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54

$19.420

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Lixinc

USA . 9,637 parts In-Stock

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9,637

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 2,881 parts In-Stock

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Eastek

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,058 parts In-Stock

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$4.529

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1,058

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$4.529

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Perfect Parts

USA . 988 parts In-Stock

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988

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RC Electronics

USA . 458 parts In-Stock

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458

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Kepictronics

USA . 262 parts In-Stock

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262

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Overview

Elevate your projects with the T1650H-6G-TR TRIAC from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for superior performance across various applications, this snubberless TRIAC excels in reliability and efficiency, ensuring your circuits operate smoothly under demanding conditions. With its compact size and robust features, it delivers exceptional value, making it the ideal choice for engineers seeking quality and dependability in their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy for the package body ensures reliability and protection against environmental factors, making it suitable for various applications.

Maximum DC Gate Trigger Current: 50 mA

A maximum gate trigger current of 50 mA allows for efficient activation with lower power consumption, improving overall circuit efficiency.

Configuration: SINGLE

Single configuration simplifies circuit design and reduces complexity in applications, making it easier to integrate into existing systems.

Surface Mount: YES

Being a surface mount device allows for compact designs and improved thermal performance, ideal for modern electronics with limited space.

Package Shape: RECTANGULAR

Rectangular package shape is convenient for layout design, enhancing PCB density and facilitating efficient assembly.

Terminal Form: GULL WING

Gull wing terminals provide better mechanical strength and soldering reliability, ensuring stable connections and reduced risk of failure.

No. of Terminals: 2

With only 2 terminals, this component is easy to use in basic on-off control applications, minimizing design complexity.

Package Style (Meter): SMALL OUTLINE

The small outline package style is perfect for designs requiring a compact footprint while still delivering necessary functionality.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature makes this TRIAC suitable for use in high-temperature environments, ensuring durability.

Trigger Device Type: SNUBBERLESS TRIAC

Snubberless design reduces power loss and increases efficiency, making this TRIAC a great choice for high-speed switching applications.

Minimum Operating Temperature: -40 °C

A wide temperature range allows operation in cold conditions, making this product versatile and suitable for various environments.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: SINGLE

Single terminal position simplifies PCB layout, allowing for easier integration with other components in compact designs.

Maximum RMS On-state Current: 16 A

The ability to handle up to 16 A of RMS on-state current allows this TRIAC to drive medium-power loads effectively.

Maximum DC Gate Trigger Voltage: 1 V

A low maximum gate trigger voltage ensures safe and efficient operation, preventing over-voltage scenarios in sensitive applications.

Case Connection: MAIN TERMINAL 2

Direct connection to main terminal enhances performance for controlling AC loads, ensuring seamless application in power circuits.

Repetitive Peak Off-state Voltage: 600 V

The capacity to withstand a repetitive peak off-state voltage of 600 V makes this device suitable for high-voltage applications.

Minimum Critical Rate of Rise of Commutation Voltage: 21 V/µs

A low minimum critical rate of rise of commutation voltage offers robust performance in fast-switching applications, reducing noise and interference.

Minimum Critical Rate of Rise of Off-state Voltage: 1000 V/µs

High off-state voltage rate rise capability ensures improved noise immunity and stability during switching transients.

Maximum Holding Current: 75 mA

A maximum holding current of 75 mA allows for efficient latching operation, beneficial for applications requiring stable and low-power state retention.

Technical Specifications

Triode For Alternating Current (TRIAC) T1650H-6G-TR attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

21 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

1000 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

1 V

Maximum Holding Current:

75 mA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

16 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

T1650H-6G-TR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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