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MAC15A6FP

Onsemi

MAC15A6FP by Onsemi

MAC15A6FP by Onsemi is a TRIAC with 15A RMS current, 400V repetitive peak off-state voltage, and 50mA DC gate trigger current. It is used in applications requiring isolated case connection, such as motor control systems and lighting dimmers.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Digiode

USA . 1,540 parts In-Stock

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Vyrian

USA . 758 parts In-Stock

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758

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Bristol Electronics

USA . 176 parts In-Stock

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PC Components Company LLC

USA . 99 parts In-Stock

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99

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A&K Electronics

USA . 87 parts In-Stock

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Rotakorn

Sweden . 87 parts In-Stock

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87

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Lixinc

USA . 15,985 parts In-Stock

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Problanco Electronics

Mexico . 7,610 parts In-Stock

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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Kulean Microsystems

USA . 4,506 parts In-Stock

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TANS Electronics

Latvia . 4,296 parts In-Stock

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SupplyDigital Components

Austria . 1,924 parts In-Stock

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Corphita

USA . 1,490 parts In-Stock

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UHIMA Technologies

Türkiye . 645 parts In-Stock

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Corohmni

South Africa . 470 parts In-Stock

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Overview

Unlock the power of reliable and efficient performance with the MAC15A6FP by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality triodes for alternating current that are designed for a wide range of applications. With its plastic/epoxy package body material and 4-quadrant logic level triac trigger device type, this product offers maximum RMS on-state current of 15A and repetitive peak off-state voltage of 400V. Trust in Onsemi to provide you with a solution that exceeds your expectations, offering unparalleled value, benefits, and advantages to all customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the TRIAC, contributing to its longevity and reliability.

Maximum DC Gate Trigger Current: 50 mA

High maximum DC gate trigger current allows for efficient and reliable switching operations in various applications.

Configuration: SINGLE

Single configuration simplifies the design and implementation process, making it easier to integrate this TRIAC into a circuit.

Package Shape: RECTANGULAR

Rectangular package shape helps in easy mounting and placement of the TRIAC in the circuit, optimizing space utilization.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures secure and stable connections to the circuit board, preventing any disconnection issues during operation.

Maximum Leakage Current: 2 mA

Low maximum leakage current ensures minimal power loss and efficient performance of the TRIAC in various operating conditions.

No. of Terminals: 3

Having 3 terminals allows for the connection of external components, enabling customization and flexibility in the circuit design.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides easy and secure mounting on different surfaces, enhancing the overall mechanical stability of the device.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance allows the TRIAC to function effectively in a wide range of environments, making it versatile and reliable.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

4 quadrant logic level TRIAC ensures precise and accurate triggering, leading to efficient performance in both AC switching applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range enables the TRIAC to operate in extreme cold conditions without compromising its performance.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides corrosion resistance and ensures a reliable electrical connection, prolonging the product's lifespan.

Terminal Position: SINGLE

Single terminal position streamlines the installation process and ensures proper alignment, reducing the risk of errors during assembly.

Maximum RMS On-state Current: 15 A

High maximum RMS on-state current enables the TRIAC to handle substantial electrical loads without overheating or failing, ensuring reliable performance.

Maximum DC Gate Trigger Voltage: 2 V

Low maximum DC gate trigger voltage ensures energy-efficient operation and precise control over triggering, contributing to overall power savings.

Case Connection: ISOLATED

Isolated case connection enhances safety by preventing current leakage and potential shock hazards, making the product suitable for various applications.

Repetitive Peak Off-state Voltage: 400 V

High repetitive peak off-state voltage allows the TRIAC to withstand voltage spikes and surges, ensuring reliable operation in demanding electrical environments.

Maximum Holding Current: 40 mA

High maximum holding current ensures stable operation and prevents false triggering, enhancing the overall reliability and performance of the TRIAC.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC15A6FP attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

40 mA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

15 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC15A6FP Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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