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STW75NF30

STMicroelectronics

STW75NF30 by STMicroelectronics

STW75NF30 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 60 A, breakdown voltage of 300 V, and power dissipation up to 320 W. Ideal for high-efficiency power management in various electronic devices.

Median Price

$7.360

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 125 parts In-Stock

1+ parts

$3.570

100+ parts

$2.450

1k+ parts

-

10k+ parts

-

125

$3.570

$2.450

-

-

Element14

Singapore . 106 parts In-Stock

1+ parts

$11.150

100+ parts

$8.340

1k+ parts

$6.330

10k+ parts

$6.090

106

$11.150

$8.340

$6.330

$6.090

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 90 parts In-Stock

1+ parts

$9.506

100+ parts

$5.704

1k+ parts

-

10k+ parts

-

90

$9.506

$5.704

-

-

Vyrian

USA . 5,802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,802

-

-

-

-

Digiode

USA . 3,364 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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3,364

-

-

-

-

Anansix

USA . 2,697 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,697

-

-

-

-

Cyclops Electronics Ltd

UK . 2,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,400

-

-

-

-

Chip Stock

USA . 546 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

546

-

-

-

-

Lakeland Logistics Inc

USA . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90

-

-

-

-

Sunrise Surplus Inc.

USA . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,542 parts In-Stock

1+ parts

$1.351

100+ parts

-

1k+ parts

$1.216

10k+ parts

-

1,542

$1.351

-

$1.216

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$2.183

100+ parts

$1.987

1k+ parts

$1.790

10k+ parts

-

100

$2.183

$1.987

$1.790

-

MKK Technologies

India . 2,183 parts In-Stock

1+ parts

$2.540

100+ parts

-

1k+ parts

-

10k+ parts

-

2,183

$2.540

-

-

-

DigiPath Technology Company

USA . 2,183 parts In-Stock

1+ parts

$2.540

100+ parts

-

1k+ parts

-

10k+ parts

-

2,183

$2.540

-

-

-

AZTECH Wire

Italy . 522 parts In-Stock

1+ parts

$17.400

100+ parts

-

1k+ parts

-

10k+ parts

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522

$17.400

-

-

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Kepictronics

USA . 143,400 parts In-Stock

1+ parts

-

100+ parts

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143,400

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-

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A-Z Elektronik GmbH

Germany . 7,400 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,400

-

-

-

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Alle Elektronik GmbH

Germany . 4,783 parts In-Stock

1+ parts

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4,783

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-

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Perfect Parts

USA . 4,733 parts In-Stock

1+ parts

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4,733

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-

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,000

-

-

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Epart123

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

$4.380

1k+ parts

-

10k+ parts

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2,400

-

$4.380

-

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GreenTree Electronics

Israel . 2,400 parts In-Stock

1+ parts

-

100+ parts

-

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2,400

-

-

-

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Corphita

USA . 2,065 parts In-Stock

1+ parts

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2,065

-

-

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Parana Technologies

USA . 583 parts In-Stock

1+ parts

-

100+ parts

$1.615

1k+ parts

-

10k+ parts

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583

-

$1.615

-

-

Assy Fe

Spain . 60 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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60

-

-

-

-

Overview

Elevate your electronic projects with the STW75NF30 from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-performance N-channel power FET excels in switching applications, delivering exceptional efficiency and reliability. With robust design and impressive current handling, it's perfect for demanding tasks across automotive, industrial, and consumer electronics. Experience enhanced performance and peace of mind knowing you've chosen a product built for excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making this FET reliable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide higher efficiency and faster switching speeds, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection against reverse polarity, enhancing reliability in circuit designs.

Transistor Application: SWITCHING

Optimized for switching applications, this FET facilitates effective control of power in electronic circuits.

Minimum DS Breakdown Voltage: 300 V

A breakdown voltage of 300 V indicates robustness, allowing the FET to operate safely in high-voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape offers easy integration into various electronic designs, maximizing space efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easier soldering and provides enhanced mechanical stability in circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enhances performance characteristics, ensuring better efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 240 A

The ability to handle pulsed drain currents of up to 240 A makes this FET suitable for demanding applications like motor controls.

Maximum Drain Current (Abs) (ID): 60 A

A maximum drain current capacity of 60 A allows for substantial power handling, making this FET versatile for high-power circuits.

No. of Terminals: 3

The 3-terminal configuration simplifies circuit design and implementation, making it user-friendly for engineers.

Maximum Power Dissipation (Abs): 320 W

With a high power dissipation capability of 320 W, this FET can efficiently manage heat in high-performance applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for better heat dissipation and sturdiness in installation, making it suitable for rugged environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOS technology offers high input impedance and low output capacitance, enhancing switching speeds and efficiency.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures the FET performs reliably in high-temperature environments.

Transistor Element Material: SILICON

Silicon as the base material provides excellent electrical properties, ensuring consistent performance in various applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish reduces oxidation risks and improves solderability, ensuring durable electrical connections.

Maximum Drain Current (ID): 60 A (repeated)

Reiterating the maximum drain current capacity of 60 A, showcasing the FET's robustness and performance in power applications.

Maximum Drain-Source On Resistance: 0.045 ohm

A low on-resistance of 0.045 ohm enhances efficiency by reducing power loss during operation, making it energy-efficient.

Terminal Position: SINGLE

A single terminal position allows for simpler layout and design in circuit boards, improving ease of use in applications.

Technical Specifications

Power Field Effect Transistors (FET) STW75NF30 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

300 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW75NF30 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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