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STW43NM60N

STMicroelectronics

STW43NM60N by STMicroelectronics

STW43NM60N by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 600V breakdown voltage and 35A max drain current. It offers a low on-resistance of 0.095Ω and operates at up to 150 °C. Its robust design ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,734 parts In-Stock

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Anansix

USA . 2,501 parts In-Stock

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Digiode

USA . 1,240 parts In-Stock

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ComSIT Distribution GmbH

Germany . 243 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 119 parts In-Stock

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Bristol Electronics

USA . 119 parts In-Stock

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Dan-Mar Components

USA . 119 parts In-Stock

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North Shore Components

USA . 8 parts In-Stock

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IDEA Electronic Components Group

UK . 625 parts In-Stock

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$0.327

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$0.294

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625

$0.327

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MKK Technologies

India . 1,070 parts In-Stock

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$0.614

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DigiPath Technology Company

USA . 1,070 parts In-Stock

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$0.614

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Advanced Electronics

New Zealand . 24 parts In-Stock

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$1.920

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$1.747

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$1.574

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24

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AZTECH Wire

Italy . 165 parts In-Stock

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$13.720

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Kepictronics

USA . 10,458 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,738 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,875 parts In-Stock

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Corphita

USA . 2,100 parts In-Stock

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RC Electronics

USA . 1,673 parts In-Stock

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Parana Technologies

USA . 1,280 parts In-Stock

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$0.390

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Perfect Parts

USA . 91 parts In-Stock

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Overview

Unlock the power of efficiency with the STW43NM60N, a top-tier N-Channel Power FET from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers unparalleled reliability in high-performance switching applications. This durable transistor excels in handling demanding tasks with ease, providing customers with superior thermal management and reduced energy consumption. Experience enhanced performance and long-lasting value—choose STW43NM60N for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and provides good insulation properties, making it suitable for various operational environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have better performance and efficiency, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the versatility of the device, allowing it to handle reverse currents safely, beneficial for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast switching speeds, essential for modern electronic circuits.

Minimum DS Breakdown Voltage: 600 V

A breakdown voltage of 600 V enables the product to be used in high-voltage applications without the risk of failure.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient space utilization on PCBs, making it suitable for compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust mechanical stability, making the FET reliable in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enables higher efficiency and lower power consumption in circuits, contributing to longer battery life in portable applications.

Maximum Pulsed Drain Current (IDM): 140 A

A high pulsed drain current capability of 140 A ensures that the FET can handle surge conditions without damage, enhancing reliability.

Maximum Drain Current (Abs) (ID): 35 A

The ability to handle a maximum drain current of 35 A makes this FET suitable for a variety of standard applications.

No. of Terminals: 3

Three terminals provide a simple and efficient connection method, simplifying circuit design.

Maximum Power Dissipation (Abs): 255 W

A power dissipation capacity of 255 W allows for high-efficiency operation in power applications, reducing the need for external heat sinks.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides enhanced heat dissipation and stability in larger system applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high-speed operation and low power consumption, making it suitable for high-performance electronic applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures reliable operation even in extreme conditions, making it suitable for industrial applications.

Transistor Element Material: SILICON

Silicon as the element material provides robustness and efficiency, ensuring consistent performance over time.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides excellent solderability and corrosion resistance, enhancing the reliability of connections.

Maximum Drain Current (ID): 35 A

This specification reiterates the FET's ability to handle significant current, making it versatile for various applications.

Maximum Drain-Source On Resistance: 0.095 ohm

A low on-resistance of 0.095 ohm reduces power losses during operation, improving overall efficiency in power management systems.

Terminal Position: SINGLE

A single terminal position simplifies the design and layout process in PCB manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) STW43NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

35 A

Maximum Drain Current (ID):

35 A

Maximum Drain-Source On Resistance:

.095 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

140 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW43NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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