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STW18NK80Z

STMicroelectronics

STW18NK80Z by STMicroelectronics

STW18NK80Z by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 19 A, breakdown voltage of 800 V, and power dissipation up to 350 W. Ideal for high-voltage circuits, it ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 2,944 parts In-Stock

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Digiode

USA . 1,886 parts In-Stock

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Anansix

USA . 1,567 parts In-Stock

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ComSIT Distribution GmbH

Germany . 27 parts In-Stock

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LittleDiode

UK . 5 parts In-Stock

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Donberg Electronics Ltd

Ireland . 5 parts In-Stock

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MISTER SPROCKETS

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IDEA Electronic Components Group

UK . 1,568 parts In-Stock

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$1.385

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$1.246

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Benley Electronics

USA . 4 parts In-Stock

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$2.000

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MKK Technologies

India . 2,232 parts In-Stock

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$2.604

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DigiPath Technology Company

USA . 2,232 parts In-Stock

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AZTECH Wire

Italy . 796 parts In-Stock

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$14.770

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QUARKTWIN TECHNOLOGY LTD

USA . 18,230 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,267 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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Corphita

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Perfect Parts

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

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Parana Technologies

USA . 893 parts In-Stock

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$1.656

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Overview

Unlock unparalleled performance with the STW18NK80Z from STMicroelectronics, a leader in innovative semiconductor solutions. This robust N-channel power FET excels in high-voltage switching applications, delivering reliability and efficiency that empower your designs. With its compact plastic package and built-in diode, it ensures seamless integration and superior thermal management. Trust in STMicroelectronics for quality that drives your projects forward, maximizing both value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and insulative properties, making it suitable for various operating environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for better efficiency and performance in switching applications, making this product a robust choice for designers.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against back EMF, enhancing the reliability of the device in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast switching speeds and high efficiency.

Minimum DS Breakdown Voltage: 800 V

An 800 V breakdown voltage ensures this FET can handle high voltages, making it ideal for applications requiring high voltage ratings.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy mounting and integration into various circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and reliable electrical connections in a variety of applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower off-state power consumption, making this FET energy-efficient.

Maximum Pulsed Drain Current (IDM): 76 A

With a maximum pulsed drain current of 76 A, this FET can handle demanding applications that require high transient currents.

Avalanche Energy Rating (EAS): 700 mJ

The high avalanche energy rating indicates robust ruggedness, making this FET reliable in transient conditions.

Maximum Drain Current (Abs) (ID): 19 A

A maximum absolute drain current of 19 A ensures adequate performance for moderate current applications.

No. of Terminals: 3

The three-terminal design simplifies circuit layout and integration, versatile for multiple circuit applications.

Maximum Power Dissipation (Abs): 350 W

With a maximum power dissipation of 350 W, this FET can handle significant power without overheating, extending its operational lifespan.

Package Style (Meter): FLANGE MOUNT

Flange mounting allows for stable installation and enhanced thermal management in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances switching speeds and energy efficiency, positioning this FET as an excellent choice for modern designs.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C makes this FET suitable for high-temperature environments.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material, providing excellent performance characteristics in a range of applications.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and reduces oxidation, ensuring reliable long-term connections.

Maximum Drain Current (ID): 19 A

The capability to handle a maximum drain current of 19 A makes it suitable for a variety of load requirements.

Maximum Drain-Source On Resistance: 0.38 ohm

A low on-resistance value of 0.38 ohm ensures minimal power loss and increased efficiency in power applications.

Terminal Position: SINGLE

A single terminal position simplifies connection and contributes to a compact circuit design.

Technical Specifications

Power Field Effect Transistors (FET) STW18NK80Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

700 mJ

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

19 A

Maximum Drain Current (ID):

19 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

76 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW18NK80Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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