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STW130NS04ZB

STMicroelectronics

STW130NS04ZB by STMicroelectronics

STW130NS04ZB by STMicroelectronics is a N-CHANNEL FET with 33V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 320A IDM, 500mJ EAS, and 0.009 ohm RDS(ON). Operating in ENHANCEMENT MODE, it has a max power dissipation of 300W at 175°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 1,912 parts In-Stock

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Digiode

USA . 1,226 parts In-Stock

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1,226

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Vyrian

USA . 308 parts In-Stock

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308

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Nova Conductors

Japan . 300 parts In-Stock

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300

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ComSIT Distribution GmbH

Germany . 27 parts In-Stock

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IDEA Electronic Components Group

UK . 1,152 parts In-Stock

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$0.338

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$0.304

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$0.338

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$0.304

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Corohmni

South Africa . 113 parts In-Stock

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$0.402

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113

$0.402

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Aztec Data Supply Inc.

USA . 453 parts In-Stock

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$0.464

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453

$0.464

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MKK Technologies

India . 755 parts In-Stock

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$0.635

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755

$0.635

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DigiPath Technology Company

USA . 755 parts In-Stock

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$0.635

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755

$0.635

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AZTECH Wire

Italy . 879 parts In-Stock

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$8.519

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879

$8.519

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Ampacity Inc.

Singapore . 370 parts In-Stock

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$23.050

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$23.050

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Continental Prestige Electronics

USA . 6,807 parts In-Stock

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Argo Parts USA

USA . 4,350 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Parana Technologies

USA . 1,565 parts In-Stock

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$0.404

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1,565

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$0.404

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Corphita

USA . 1,508 parts In-Stock

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1,508

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Overview

Elevate your power switching capabilities with the STW130NS04ZB by STMicroelectronics. Manufactured with precision and expertise, this N-CHANNEL Power Field Effect Transistor is designed for top-notch performance in various applications. With a built-in diode and enhanced mode operation, this transistor offers superior efficiency and reliability. Experience seamless power management with a maximum pulsing drain current of 320A and a low on-resistance of 0.009 ohm. Trust in STMicroelectronics to deliver quality, value, and innovation with the STW130NS04ZB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and helps protect the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics compared to P-channel transistors, making this product a good choice for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers efficient and reliable performance when used in circuits that require rapid on/off switching.

Minimum DS Breakdown Voltage: 33 V

A high minimum breakdown voltage of 33 V ensures that the transistor can handle voltage spikes and surges without failure, making it suitable for demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the transistor's conductivity, making it versatile for different circuit configurations and applications.

Maximum Pulsed Drain Current (IDM): 320 A

With a high maximum pulsed drain current rating of 320 A, this transistor can handle short bursts of high current, making it suitable for power applications.

Maximum Power Dissipation (Abs): 300 W

The high maximum power dissipation rating of 300 W indicates that this transistor can handle high power levels without overheating, ensuring long-term reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and efficiency, making this transistor an ideal choice for applications that require low power consumption.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this transistor can withstand high temperatures and operate reliably in challenging thermal environments.

Maximum Drain-Source On Resistance: 0.009 ohm

The low on-resistance of 0.009 ohms ensures minimal power loss and high efficiency when the transistor is conducting, making it suitable for high-power applications.

Case Connection: DRAIN

The case connection at the drain terminal ensures efficient heat dissipation and helps maintain the transistor's performance under high load conditions.

Technical Specifications

Power Field Effect Transistors (FET) STW130NS04ZB attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

500 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

33 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.009 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW130NS04ZB Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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