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STW14NM50FD

STMicroelectronics

STW14NM50FD by STMicroelectronics

STW14NM50FD by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 500V breakdown voltage, 14A max drain current, and 175W power dissipation. Ideal for high-efficiency circuits in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,112 parts In-Stock

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6,112

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Anansix

USA . 1,749 parts In-Stock

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1,749

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Digiode

USA . 529 parts In-Stock

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529

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,877 parts In-Stock

1+ parts

$1.102

100+ parts

-

1k+ parts

$0.992

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1,877

$1.102

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$0.992

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MKK Technologies

India . 2,333 parts In-Stock

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$2.073

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2,333

$2.073

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DigiPath Technology Company

USA . 2,333 parts In-Stock

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$2.073

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2,333

$2.073

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AZTECH Wire

Italy . 978 parts In-Stock

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$19.960

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978

$19.960

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Component Stockers USA

USA . 476 parts In-Stock

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$99.990

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476

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 22,080 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,851 parts In-Stock

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4,851

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Corphita

USA . 3,510 parts In-Stock

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3,510

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Parana Technologies

USA . 84 parts In-Stock

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$1.318

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84

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$1.318

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Overview

Unlock the potential of your designs with the STW14NM50FD Power FET from STMicroelectronics—where innovation meets reliability. This N-channel transistor excels in switching applications, offering remarkable efficiency and robust performance. With a trusted legacy in semiconductor excellence, STMicroelectronics ensures superior quality and durability. Elevate your projects with easy integration, exceptional power handling, and maximum thermal performance for a competitive edge in any application!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction offers good durability and protection against environmental factors, ensuring longevity in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide better performance in terms of speed and efficiency, making them ideal for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The inclusion of a built-in diode simplifies circuit design and protects against flyback voltages in inductive loads.

Transistor Application: SWITCHING

Designed for switching applications, this FET allows for efficient control of power in various electronic circuits.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage enhances reliability in high-voltage applications, reducing the risk of damage under stress conditions.

Package Shape: RECTANGULAR

The rectangular shape aids in effective heat dissipation, contributing to stable performance and reliability.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections, making the FET suitable for applications requiring durability in physical environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for greater versatility in circuit design, enabling the FET to be turned off completely when not in use.

Maximum Pulsed Drain Current (IDM): 56 A

The capability to handle high pulsed currents makes this FET excellent for applications requiring high surge capacities.

Avalanche Energy Rating (EAS): 400 mJ

A high avalanche energy rating ensures that the FET can safely handle energy spikes, enhancing its reliability in inductive load applications.

Maximum Drain Current (Abs) (ID): 14 A

This maximum drain current rating ensures the FET can handle significant loads, making it suitable for a variety of power applications.

No. of Terminals: 3

Having three terminals simplifies integration into circuits, enhancing ease of use while providing essential functionality.

Maximum Power Dissipation (Abs): 175 W

The ability to dissipate high power ensures the FET can function efficiently under heavy loads without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for secure mounting and optimal thermal management, ensuring better stability in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for low on-resistance and high-speed operation, making this FET suitable for modern high-frequency applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature rating, this FET can function in harsh environments, making it adaptable for various applications.

Transistor Element Material: SILICON

Silicon as an element material ensures good thermal conductivity and electrical performance, enhancing overall reliability.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and reduces the risk of oxidation, ensuring consistent performance during use.

Maximum Drain Current (ID): 14 A

The repeat maximum current rating confirms reliability for continuous operation, making it a trusted choice in power applications.

Maximum Drain-Source On Resistance: 0.4 ohm

Low on-resistance reduces power losses and improves efficiency, making this FET a cost-effective choice for power management.

Terminal Position: SINGLE

A single terminal position simplifies circuit layout and minimizes the complexity of the design, aiding in ease of integration.

Technical Specifications

Power Field Effect Transistors (FET) STW14NM50FD attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

400 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

56 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW14NM50FD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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