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STV5346/T

STMicroelectronics

STV5346/T by STMicroelectronics

STV5346/T by STMicroelectronics is a Teletext IC with 13.875 MHz crystal frequency, 5V power supply, and 8 stored internal pages. It is a TELETEXT DECODER used in video input processors with CMOS technology for commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,399 parts In-Stock

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4,399

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Vyrian

USA . 2,615 parts In-Stock

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2,615

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Anansix

USA . 1,168 parts In-Stock

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1,168

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,577 parts In-Stock

1+ parts

$0.325

100+ parts

-

1k+ parts

$0.292

10k+ parts

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1,577

$0.325

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$0.292

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MKK Technologies

India . 1,214 parts In-Stock

1+ parts

$0.611

100+ parts

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1,214

$0.611

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DigiPath Technology Company

USA . 1,214 parts In-Stock

1+ parts

$0.611

100+ parts

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1,214

$0.611

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Parana Technologies

USA . 937 parts In-Stock

1+ parts

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100+ parts

$0.388

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937

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$0.388

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Corphita

USA . 865 parts In-Stock

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865

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Overview

Revolutionize your television experience with the STV5346/T Teletext IC from STMicroelectronics. Crafted with precision and expertise, this decoder offers unparalleled performance and reliability. Unlock a world of possibilities with its advanced features and seamless integration. Perfect for a wide range of applications, this innovative product is designed to enhance your viewing experience like never before. Elevate your entertainment with the STV5346/T and discover the true meaning of quality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product durable and lightweight, making it easier to handle and install.

Nominal Crystal Frequency: 13.875 MHz

This high crystal frequency ensures accurate and reliable decoding of teletext signals, providing clear and precise information on the screen.

No. of Stored Internal Pages: 8

With the capability to store 8 internal pages, this teletext IC allows for easy access to multiple pages of information without having to constantly switch channels.

Power Supplies (V): 5

The 5V power supply requirement ensures compatibility with standard power sources, making it easy to integrate this IC into various electronic devices.

No. of Terminals: 28

The 28 terminals provide ample connectivity options for interfacing with other components, allowing for versatile integration into different systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures reliable performance even in harsh environmental conditions, making this teletext IC suitable for a wide range of applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C ensures that the teletext IC can function effectively in colder environments, enhancing its versatility and performance.

Technology: CMOS

The CMOS technology used in this teletext IC offers low power consumption and high noise immunity, resulting in efficient operation and reliable signal decoding.

Technical Specifications

Teletext ICs STV5346/T attributes and parameters. Explore more Teletext ICs devices from STMicroelectronics

Specs

General IC Type:

Nominal Crystal Frequency:

13.875 MHz

External Page Memory Support:

NO

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

Length:

36.83 mm

No. of Stored Internal Pages:

8

No. of Languages:

7

No. of Lines per Frame:

625

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Teletext ICs

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Video Input Processor:

YES

Width:

15.24 mm

Trade Compliance

STV5346/T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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