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SAA5264PS/M3

NXP Semiconductors

SAA5264PS/M3 by NXP Semiconductors

SAA5264PS/M3 by NXP Semiconductors is a CMOS teletext IC designed for commercial applications. It operates at 3.3V with a max supply current of 48mA and features a dual terminal position in a rectangular plastic/epoxy package. This device functions effectively within -20 °C to 70 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,656 parts In-Stock

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Digiode

USA . 2,619 parts In-Stock

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Vyrian

USA . 830 parts In-Stock

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830

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ABC Electronics Ltd.

UK . 6 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 742 parts In-Stock

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$15.800

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742

$15.800

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UNI Independent Distributors

Spain . 4,872 parts In-Stock

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Corphita

USA . 4,247 parts In-Stock

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Metaverse IC Inc.

Canada . 180 parts In-Stock

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Overview

Unlock the potential of your multimedia projects with the SAA5264PS/M3 from NXP Semiconductors. Renowned for quality and innovation, NXP delivers a Teletext IC that promises reliability and efficiency, seamlessly integrating into diverse applications—from consumer electronics to professional video systems. Enjoy enhanced performance and peace of mind knowing you’re backed by a trusted leader in semiconductor technology, ensuring your designs stand out with superior functionality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental stress, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on circuit boards, facilitating easier integration into designs.

Power Supplies: 3.3 V

Operating at a low voltage of 3.3 V makes it energy-efficient and ideal for battery-powered applications.

No. of Terminals: 52

The 52 terminals provide ample connectivity options, ensuring versatility and adaptability for multiple circuit designs.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch package style enhances mounting density, allowing for compact design configurations.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC can function reliably in environments with moderate heat, ensuring stability.

Minimum Operating Temperature: -20 °C

A minimum operating temperature of -20 °C allows the IC to be used in a range of colder environments, increasing application possibilities.

Terminal Position: DUAL

The dual terminal position offers flexible layout options for PCB design, accommodating diverse spatial requirements.

Temperature Grade: COMMERCIAL

Being graded for commercial use ensures that the IC meets standard conditions for performance, making it suitable for everyday applications.

Technology: CMOS

Utilizing CMOS technology allows for low power consumption, enhancing battery life in portable devices.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical support, making it suitable for applications where durability is required.

Maximum Supply Current: 48 mA

A maximum supply current of 48 mA ensures that the IC can perform well without drawing excessive power, crucial for energy-sensitive applications.

Terminal Pitch: 1.78 mm

The 1.78 mm terminal pitch allows for compatibility with a variety of PCB designs and helps maintain a compact footprint.

Technical Specifications

Teletext ICs SAA5264PS/M3 attributes and parameters. Explore more Teletext ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDIP-T52

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP52,.6

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Teletext ICs

Maximum Supply Current:

48 mA

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

SAA5264PS/M3 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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