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SDA5243/H

STMicroelectronics

SDA5243/H by STMicroelectronics

SDA5243/H by STMicroelectronics is a teletext decoder with a nominal crystal frequency of 6.9375 MHz and supports up to 8 internal pages. It operates within -20 °C to 70°C, requiring a supply voltage b/w 4.5V and 5.5V. Ideal for video input processing in commercial applications, it features dual terminals in an in-line package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,586 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,586

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-

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Vyrian

USA . 1,837 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,837

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Anansix

USA . 1,299 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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-

1,299

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-

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Cyclops Electronics Ltd

UK . 207 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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207

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-

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ECAB

Sweden . 84 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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84

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 145 parts In-Stock

1+ parts

$0.140

100+ parts

-

1k+ parts

$0.126

10k+ parts

-

145

$0.140

-

$0.126

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MKK Technologies

India . 167 parts In-Stock

1+ parts

$0.263

100+ parts

-

1k+ parts

-

10k+ parts

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167

$0.263

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-

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DigiPath Technology Company

USA . 167 parts In-Stock

1+ parts

$0.263

100+ parts

-

1k+ parts

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10k+ parts

-

167

$0.263

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Corphita

USA . 3,080 parts In-Stock

1+ parts

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100+ parts

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3,080

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Parana Technologies

USA . 1,054 parts In-Stock

1+ parts

-

100+ parts

$0.167

1k+ parts

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10k+ parts

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1,054

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$0.167

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Overview

Unlock a world of seamless teletext experience with the SDA5243/H from STMicroelectronics, a trusted leader in innovative solutions. This advanced teletext decoder effortlessly enhances multimedia applications, delivering clarity and efficiency. With its versatile support for multiple languages and external page memory, it adapts to diverse needs while ensuring reliable performance across various environments. Elevate your projects with the quality and expertise that only STMicroelectronics can offer!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, ensuring the product remains reliable over time.

Nominal Crystal Frequency: 6.9375 MHz

This frequency is suitable for teletext applications, providing accurate timing and reliable performance.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier mounting and integration into various circuit designs.

General IC Type: TELETEXT DECODER

As a dedicated teletext decoder, it is optimized for decoding teletext signals, enhancing the viewer's experience.

No. of Stored Internal Pages: 8

The ability to store multiple pages allows for a richer teletext experience, giving users access to more information.

Power Supplies (V): 5

Operates on a standard 5V supply, making it compatible with most electronic devices and reducing design complexity.

No. of Terminals: 40

A higher terminal count allows for more connections and flexibility in circuit design, offering better integration options.

Package Style (Meter): IN-LINE

The in-line package style is beneficial for circuit board design, promoting space efficiency and easy soldering.

Maximum Operating Temperature: 70 °C

This temperature range ensures reliable operation in a wide variety of environmental conditions, enhancing the product's versatility.

Minimum Operating Temperature: -20 °C

An operational range down to -20 °C makes the product suitable for use in colder climates or environments.

Terminal Finish: TIN LEAD

The tin-lead finish provides good solderability and reliability, ensuring strong connections in various applications.

Terminal Position: DUAL

Dual terminal positioning allows for flexibility in board layout and design, making integration into existing systems easier.

No. of Lines per Frame: 625

Supporting a high number of lines per frame ensures high-quality teletext display, enhancing user experience.

Width: 15.24 mm

A compact width allows for space-efficient designs, which is ideal for devices with limited PCB space.

Minimum Supply Voltage (Vsup): 4.5 V

Capability to operate at a lower supply voltage improves energy efficiency and compatibility with battery-operated devices.

Length: 52.07 mm

This length provides a balance between compactness and functionality, ensuring it can fit into various designs.

Temperature Grade: COMMERCIAL

Commercial grade ensures suitability for standard consumer applications, balancing performance and cost.

Video Input Processor: YES

Inclusion of a video input processor enables high-quality signal handling, improving overall performance in teletext applications.

Technology: BIPOLAR

Bipolar technology provides fast switching speeds and efficient processing, enhancing the performance of teletext signals.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support, making them suitable for high-stress applications.

Maximum Supply Current: 200 mA

A maximum supply current of 200 mA indicates sufficient power handling for most teletext applications while maintaining efficiency.

External Page Memory Support: YES

Support for external page memory enhances flexibility and capacity, allowing for advanced usage scenarios and larger data storage.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm is widely used, facilitating ease of integration into various PCB designs.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V ensures compatibility with a range of power supplies while protecting against over-voltage conditions.

No. of Languages: 7

Supporting multiple languages caters to diverse user bases, enhancing product usability and market appeal.

Technical Specifications

Teletext ICs SDA5243/H attributes and parameters. Explore more Teletext ICs devices from STMicroelectronics

Specs

General IC Type:

Nominal Crystal Frequency:

6.9375 MHz

External Page Memory Support:

YES

JESD-30 Code:

R-PDIP-T40

JESD-609 Code:

e0

Length:

52.07 mm

No. of Functions:

1

No. of Stored Internal Pages:

8

No. of Languages:

7

No. of Lines per Frame:

625

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Teletext ICs

Maximum Supply Current:

200 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Video Input Processor:

YES

Width:

15.24 mm

Trade Compliance

SDA5243/H General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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