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STV5438/H

STMicroelectronics

STV5438/H by STMicroelectronics

STV5438/H by STMicroelectronics is a teletext and VPS/PDC decoder with a nominal crystal frequency of 13.875 MHz, supporting up to 8 internal pages. It operates b/w 4.75-5.25 V and functions effectively in temperatures from 0 °C to 70°C. Ideal for video input processing, it features a compact rectangular package with 28 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,606 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,606

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-

-

-

Vyrian

USA . 1,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,320

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-

-

-

Digiode

USA . 1,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,040

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,139 parts In-Stock

1+ parts

$2.604

100+ parts

-

1k+ parts

$2.343

10k+ parts

-

2,139

$2.604

-

$2.343

-

MKK Technologies

India . 820 parts In-Stock

1+ parts

$4.896

100+ parts

-

1k+ parts

-

10k+ parts

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820

$4.896

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-

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DigiPath Technology Company

USA . 820 parts In-Stock

1+ parts

$4.896

100+ parts

-

1k+ parts

-

10k+ parts

-

820

$4.896

-

-

-

Corphita

USA . 4,081 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,081

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-

-

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Parana Technologies

USA . 1,947 parts In-Stock

1+ parts

-

100+ parts

$3.113

1k+ parts

-

10k+ parts

-

1,947

-

$3.113

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Overview

Unlock a world of seamless teletext functionality with the STV5438/H from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics ensures this decoder excels in reliability and performance, making it perfect for various applications in broadcasting and consumer electronics. With robust features and support for multiple languages, the STV5438/H enhances user experience while delivering superior value, efficiency, and functionality for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Nominal Crystal Frequency: 13.875 MHz

This frequency supports stable performance for teletext applications, ensuring smooth and reliable signal processing.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space, facilitating compact designs in electronic products.

General IC Type: TELETEXT AND VPS/PDC DECODER

Designed specifically for teletext and VPS/PDC functionality, optimizing performance for these applications.

No. of Stored Internal Pages: 8

With the capability to store multiple pages, it enhances user experience by providing quick access to data.

Power Supplies (V): 5

Standard 5V power supply makes it easy to integrate into existing designs with common voltage levels.

No. of Terminals: 28

A higher number of terminals allows for better connectivity options and supports complex wiring in the circuit.

Package Style (Meter): IN-LINE

In-line packaging style simplifies assembly and can improve manufacturing efficiency.

Maximum Operating Temperature: 70 °C

Suitable for a wide range of environments, ensuring reliable operation even in warmer conditions.

Minimum Operating Temperature: 0 °C

Allows continued performance down to freezing temperatures, making it versatile for different climates.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and corrosion resistance, enhancing the longevity of electrical connections.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and design, accommodating varying space constraints.

No. of Lines per Frame: 625

High resolution of 625 lines ensures clear, detailed teletext display suitable for high-quality viewing experiences.

Width: 15.24 mm

Compact width allows for efficient use of space, contributing to smaller overall device designs.

Minimum Supply Voltage (Vsup): 4.75 V

Supports a wider range of input voltages, enhancing compatibility with various power supply systems.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates reliability for general use in consumer electronics.

Video Input Processor: YES

Integration of a video input processor enhances functionality, enabling better handling of video signals.

Technology: CMOS

CMOS technology contributes to low power consumption and high noise immunity, making it efficient for battery-operated devices.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides strong mechanical connection and ease of handling during assembly.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows compatibility with common PCB designs and simplifies assembly processes.

Maximum Supply Voltage (Vsup): 5.25 V

Provides flexibility in design, allowing the IC to function effectively across a range of supply voltages.

No. of Languages: 6

Support for multiple languages enhances user accessibility and opens up the product to a broader market.

Technical Specifications

Teletext ICs STV5438/H attributes and parameters. Explore more Teletext ICs devices from STMicroelectronics

Specs

General IC Type:

Nominal Crystal Frequency:

13.875 MHz

External Page Memory Support:

NO

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e3

No. of Functions:

1

No. of Stored Internal Pages:

8

No. of Languages:

6

No. of Lines per Frame:

625

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Teletext ICs

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Video Input Processor:

YES

Width:

15.24 mm

Trade Compliance

STV5438/H General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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