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STV2310SDT

STMicroelectronics

STV2310SDT by STMicroelectronics

STV2310SDT by STMicroelectronics is a compact color signal decoder designed for surface mount applications. It operates b/w 1.8V and 3.3V, features a low-profile flatpack design with 64 terminals, and withstands temperatures from 0 °C to 70 °C. Ideal for video processing in consumer electronics, it ensures high-quality color conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,520

-

-

-

-

Vyrian

USA . 678 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

678

-

-

-

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Anansix

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,477 parts In-Stock

1+ parts

$2.245

100+ parts

-

1k+ parts

$2.020

10k+ parts

-

1,477

$2.245

-

$2.020

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MKK Technologies

India . 2,264 parts In-Stock

1+ parts

$4.221

100+ parts

-

1k+ parts

-

10k+ parts

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2,264

$4.221

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-

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DigiPath Technology Company

USA . 2,264 parts In-Stock

1+ parts

$4.221

100+ parts

-

1k+ parts

-

10k+ parts

-

2,264

$4.221

-

-

-

Parana Technologies

USA . 1,342 parts In-Stock

1+ parts

-

100+ parts

$2.684

1k+ parts

-

10k+ parts

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1,342

-

$2.684

-

-

Corphita

USA . 1,124 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,124

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-

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Overview

Elevate your designs with the STV2310SDT from STMicroelectronics, a premier choice in color signal conversion. Renowned for exceptional quality and reliability, STMicroelectronics delivers cutting-edge technology that enhances image clarity and performance across applications like consumer electronics and broadcast systems. Experience simplified integration, low power consumption, and superior thermal management, all while enjoying the peace of mind that comes with a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials enhances the product's longevity and resistance to environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient use of PCB space, which is ideal for modern electronics.

Package Shape: SQUARE

The square package shape optimizes layout efficiency, facilitating easier integration into various circuit designs.

General IC Type: COLOR SIGNAL DECODER

As a color signal decoder, this IC serves critical functions in video and imaging applications, ensuring high-quality color representation.

Power Supplies (V): 1.8, 3.3

Compatible with multiple supply voltages, this product offers flexibility in design, accommodating various power requirements.

No. of Terminals: 64

A high number of terminals allows for versatile connectivity options, enabling more complex configurations and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack and low-profile design aids in minimizing space, making it perfect for compact electronic devices.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can operate effectively in warmer environments, enhancing reliability.

Minimum Operating Temperature: 0 °C

Starting from 0 °C ensures the product performs well in a variety of climates, including low-temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term performance and reliability.

Terminal Position: QUAD

Quad terminal positioning facilitates better circuit layout and routing, contributing to improved performance and ease of assembly.

Maximum Seated Height: 1.6 mm

A low seated height is advantageous for low-profile applications, allowing for slimmer designs in electronic assemblies.

Width: 10 mm

A compact width makes it suitable for space-constrained applications, ensuring efficient integration in tight environments.

Minimum Supply Voltage (Vsup): 1.6 V

This low minimum supply voltage requirement enables compatibility with a range of low-power applications.

Length: 10 mm

The 10 mm length complements its width, maintaining a compact footprint that is crucial for modern electronic designs.

Temperature Grade: COMMERCIAL

Rated for commercial temperatures, this product is designed for standard environmental conditions typical in consumer electronics.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering processes, ensuring solid connections and reliable performance.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for dense layouts, making it suitable for high-density applications and efficient use of PCB space.

Maximum Supply Voltage (Vsup): 2 V

The maximum supply voltage of 2 V ensures compatibility with various electronic components, allowing for greater design flexibility.

Technical Specifications

Color Signal Converters STV2310SDT attributes and parameters. Explore more Color Signal Converters devices from STMicroelectronics

Specs

Additional Features:

IT ALSO REQUIRES 3V TO 3.6V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Color Signal Converters

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

STV2310SDT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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