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STV2310SD

STMicroelectronics

STV2310SD by STMicroelectronics

STV2310SD by STMicroelectronics is a compact color signal decoder designed for surface mount applications. It operates with supply voltages of 1.6-2V and features a low-profile flatpack design with 64 terminals. Ideal for commercial use, it withstands temperatures from 0 °C to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,486 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,486

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-

-

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Anansix

USA . 1,606 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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1,606

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Vyrian

USA . 970 parts In-Stock

1+ parts

-

100+ parts

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970

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 659 parts In-Stock

1+ parts

$3.265

100+ parts

-

1k+ parts

$2.939

10k+ parts

-

659

$3.265

-

$2.939

-

MKK Technologies

India . 2,072 parts In-Stock

1+ parts

$6.140

100+ parts

-

1k+ parts

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10k+ parts

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2,072

$6.140

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DigiPath Technology Company

USA . 2,072 parts In-Stock

1+ parts

$6.140

100+ parts

-

1k+ parts

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10k+ parts

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2,072

$6.140

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-

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Parana Technologies

USA . 775 parts In-Stock

1+ parts

-

100+ parts

$3.904

1k+ parts

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10k+ parts

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775

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$3.904

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Corphita

USA . 737 parts In-Stock

1+ parts

-

100+ parts

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737

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Overview

Elevate your designs with the STV2310SD from STMicroelectronics, a cutting-edge Color Signal Converter that ensures superior image quality and reliability. Known for their innovation and expertise, STMicroelectronics delivers unmatched performance in compact, low-profile packages. Ideal for applications in consumer electronics, automotive displays, and industrial systems, the STV2310SD empowers engineers to enhance visual experiences while optimizing space and energy efficiency. Unleash your creativity and achieve stunning results!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it a reliable choice for various applications.

Surface Mount: YES

Being a surface mount device allows for easier integration into compact circuit boards, optimizing space and improving manufacturing efficiency.

Package Shape: SQUARE

The square package shape aids in efficient layout on PCBs, facilitating a straightforward design process and supporting high-density assemblies.

General IC Type: COLOR SIGNAL DECODER

As a color signal decoder, this IC can effectively process and decode digital video signals, making it ideal for applications in multimedia systems.

Power Supplies (V): 1.8, 3.3

Compatible with multiple voltage levels (1.8V and 3.3V), this product provides flexibility in design and is suitable for a variety of power supply configurations.

No. of Terminals: 64

With 64 terminals, this device offers numerous connectivity options, allowing for extensive interfacing capabilities in complex systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low-profile, and fine pitch design enables high-performance applications while maintaining a minimal footprint on the PCB.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability and stable performance even in moderately elevated thermal environments.

Minimum Operating Temperature: 0 °C

The ability to function from 0 °C enhances versatility, allowing the device to be used effectively in various ambient conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures excellent solderability and corrosion resistance, contributing to long-term reliability.

Terminal Position: QUAD

The quad terminal position facilitates efficient PCB design and layout, providing a compact arrangement that supports high-density component placement.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm keeps this component low-profile, which is advantageous for slim device designs.

Width: 10 mm

With a width of 10 mm, this IC strikes a balance between size and functionality, making it suitable for a variety of sizes in electronic devices.

Minimum Supply Voltage (Vsup): 1.6 V

A low minimum supply voltage of 1.6V allows for operation in low-power applications, contributing to overall energy efficiency.

Length: 10 mm

At 10 mm in length, the compact size enhances design flexibility while still accommodating the necessary functional capabilities of the product.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures the device is suitable for general use in a variety of consumer electronics.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering processes, enhancing reliability and ease of manufacturing on automated lines.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm supports high-density interconnections, ideal for modern applications that require compact components.

Maximum Supply Voltage (Vsup): 2 V

The maximum supply voltage of 2V ensures compatibility with low-voltage systems, enhancing its applicability across various electronic devices.

Technical Specifications

Color Signal Converters STV2310SD attributes and parameters. Explore more Color Signal Converters devices from STMicroelectronics

Specs

Additional Features:

IT ALSO REQUIRES 3V TO 3.6V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Color Signal Converters

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

STV2310SD General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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